• 제목/요약/키워드: dark silicon

검색결과 78건 처리시간 0.028초

열선 CVD법에 의한 다결정 실리콘 박막증착 및 특성분석 (Poly-Si Thin Films by Hot-wire Chemical Vapor Deposition Method)

  • 정연식;이정철;김석기;윤경훈;송진수;박이준;권성원;임굉수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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    • pp.1030-1033
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    • 2003
  • This paper presents the deposition characterization of polycrystalline silicon films by the HWCVD(Hot-wire Chemical Vapor Deposition) method at low substrate($300^{\circ}C$). The filament temperature, pressure and $SiH_4$ concentration were determined to be a critical parameter for the deposition of poly-Si films. Series A was deposited under the conditions of $1380^{\circ}C$(Tf), 100 mTorr and $2{\sim}10%\{SiH_4/(SiH_4+H_2)\}$ for 60 min. Series B was deposited under the conditions of $1400{\sim}1450^{\circ}C$ (Tf), 30 mTorr and $2{\sim}12%$ for 60 min. The physical characteristics were measured by Raman and FTIR spectroscopy, dark and photoconductivity measurements under AM1.5 illumination.

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Frequency Response Estimation of 1.3 ㎛ Waveguide Integrated Vertical PIN Type Ge-on-Si Photodetector Based on the Analysis of Fringing Field in Intrinsic Region

  • Seo, Dongjun;Kwon, Won-Bae;Kim, Sung Chang;Park, Chang-Soo
    • Current Optics and Photonics
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    • 제3권6호
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    • pp.510-515
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    • 2019
  • In this paper, we introduce a 1.3-㎛ 25-GHz waveguide-integrated vertical PIN type Ge-on-Si photodetector fabricated using a multi-project wafers service based on fringing field analysis in the depletion region. In general, 1.3-㎛ photodetectors fabricated using a commercial foundry service can achieve limited bandwidths because a significant amount of photo-generated carriers are located within a few microns from the input along the device length, and they are influenced by the fringing field, leading to a longer transit time. To estimate the response time, we calculate the fringing field in that region and the transit time using the drift velocity caused by the field. Finally, we compare the estimated value with the measured one. The photodetector fabricated has a bandwidth of 20.75 GHz at -1 V with an estimation error of <3 GHz and dark current and responsivity of 110 nA and 0.704 A/W, respectively.

Electrical Properties of Boron and Phosphorus Doped μc-Si:H Films using Inductively Coupled Plasma Chemical Vapor Deposition Method for Solar Cell Applications

  • Jeong, Chae-Hwan;Jeon, Min-Sung;Koichi, Kamisako
    • Transactions on Electrical and Electronic Materials
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    • 제9권1호
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    • pp.28-32
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    • 2008
  • Hydrogenated microcrystalline silicon(${\mu}c$-Si:H) films were prepared using inductively coupled plasma chemical vapor deposition(ICP-CVD) method, electrical and optical properties of these films were studied as a function of silane concentration. And then, effect of $PH_3\;and\;B_2H_6$ addition on their electrical properties was also investigated for solar cell application. Characterization of these films from X-ray diffraction revealed that the conductive film exists in microcrystalline phase embedded in an amorphous network. At $PH_3/SiH_4$ gas ratio of $0.9{\times}10^{-3}$, dark conductivity has a maximum value of ${\sim}18.5S/cm$ and optical bandgap also a maximum value of ${\sim}2.39eV$. Boron-doped ${\mu}c$-Si:H films, satisfied with p-layer of solar cell, could be obtained at ${\sim}10^{-2}\;of\;B_2H_6/SiH_4$.

태양전지용 ${\mu}c$-Si:H 박막의 저온증착 및 특성분석 (Low Temperature Deposition of ${\mu}c$-Si:H Thin-films for Solar Cell Application)

  • 정연식;이정철;김석기;윤경훈;송진수;박이준;권성원;임광수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 하계학술대회 논문집 C
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    • pp.1592-1594
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    • 2003
  • This paper presents the deposition and characterization of microcrystalline silicon(${\mu}c$-Si:H) films by HWCVD(Hot-wire Chemical Vapor Deposition) method at low substrate($300^{\circ}C$). The filament temperature, pressure and $SiH_4$ concentration were determined to be a critical parameter for the deposition of poly-Si films. Series A was deposited under the conditions of $1380^{\circ}C$(Tf), 100 mTorr and $2{\sim}10%\{SC:SiH_4/(SiH_4+H_2)\}$ for 60 min. Series B was deposited under the conditions of $1400{\sim}1450^{\circ}(T_f)$, 30 mTorr and $2{\sim}12%$(SC) for 60 min. The physical characteristics were measured by Raman and FTIR spectroscopy, dark and photoconductivity measurements under AM1.5 illumination.

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A prototype of the SiPM readout scintillator neutron detector for the engineering material diffractometer of CSNS

  • Yu, Qian;Tang, Bin;Huang, Chang;Wei, Yadong;Chen, Shaojia;Qiu, Lin;Wang, Xiuku;Xu, Hong;Sun, Zhijia;Wei, Guangyou;Tang, Mengjiao
    • Nuclear Engineering and Technology
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    • 제54권3호
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    • pp.1030-1036
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    • 2022
  • A high detection efficiency thermal neutron detector based on the 6LiF/ZnS(Ag) scintillation screens, wavelength-shifting fibers (WLSF) and Silicon photomultiplier (SiPM) readout is under development at China Spallation Neutron Source (CSNS) for the Engineering Material Diffractometer (EMD).A prototype with a sensitive volume of 180mm×192mm has been built. Signals from SiPMs are processed by the self-design Application Specific Integrated Circuit (ASIC). The performances of this detector prototype are as follows: neutron detection efficiency could reach 50.5% at 1 Å, position resolution of 3, the dark count rate <0.1Hz, the maximum count rate >200KHz. Such detector prototype could be an elementary unit for applications in the EMD detector arrays.

저분자 유기 광다이오드 소자의 p형 유기물 두께에 따른 전류 특성에 관한 연구 (A Study on the Thickness Dependence of p-type Organic Layer on the Current of Small Molecule-based Organic Photodiode)

  • 김영우;이동운;전용민;조의식;권상직
    • 반도체디스플레이기술학회지
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    • 제22권3호
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    • pp.101-105
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    • 2023
  • Organic photo Diodes (OPDi) give multiple advantages in the growing interest of the flexible optoelectronic devices. Organic semiconductors are freeform as they can deposit on any substrate, so it could be flexible. But the inorganic material photodiodes (PDs) are usually fabricated on silicon wafers which are solid. So, normally PDs are inflexible. By those reasons, we decided to make the vacuum deposited small molecule OPDi. We have investigated the OPDi's J-V characteristic by changing the thickness of p-type layer of OPDi. This device consists of indium-tin-oxide (ITO) / 2,3:6,7-dibenzanthracene (pentacene) / buckminsterfullerene (C60) / aluminum (Al). Its J-V characteristics were measured in the probe station(4156C) that can give dark condition while measuring. And for the luminance characteristics, the photocurrent was measured with the bright halogen lamp and a probe station.

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Hot Wire CVD법에 의한 수소화된 미세결정 실리콘(${\mu} c-Si:H$) 박막 증착 (The Hydrogenated Micro-crystalline Silicon(${\mu} c-Si:H$) Films Deposited by Hot Wire CVD Method)

  • 이정철;송진수;박이준
    • 대한전자공학회논문지SD
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    • 제37권8호
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    • pp.17-27
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    • 2000
  • 열선 CVD(Hot Wire CVD)를 이용해 유리기판에 미세결정 실리콘(${\mu}c$ -Si:H) 박막을 증착시키고, 증착 조건에 따른 막의 특성변화를 관찰하였다. 열선 CVD법에 의한 ${\mu}c$ -Si:H막의 증착률은 조건변화에 따라 0.2nm/sec에서 3.5nm/sec사이의 값을 가졌으며, 기존의 PECVD법에 비해 10배 이상 높은 값이었다. Raman 특성으로부터 ${\mu}c$ -Si:H막은 비정질과 결정질의 두상이 혼합된 상태임을 알 수 있었으며, 평균 결정 립의 크기는 6-10nm, 결정체적분율은 37~63%범위였다. 막의 전도대와 Fermi 준위의 차를 나타내는 전도 활성화에너지(conductivity activation energy)는 30mTorr에서 0.22eV로 나타났으며, 압력에 따라 증가하여 300mTorr에서는 0.68eV의 값을 가졌다. 막의 활성화 에너지 증가는 높은 압력에서 증착된 막의 특성이 진성(intrisic)에 가까움을 의미하며, 이는 압력증가에 따른 암 전도도의 감소특성으로부터 확인할 수 있었다. 또한 이차이온질량분석으로부터 열선온도 1800$^{\circ}C$에서 증착시킨 막의 텅스텐 함유량은 $6{\times}10^{16}atoms/cm^3$임을 알 수 있었다.

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스퍼터링된 비정질 실리콘의 전자빔 조사를 통한 태양전지용 흡수층 제조공정 연구 (Preparation of poly-crystalline Si absorber layer by electron beam treatment of RF sputtered amorphous silicon thin films)

  • 정채환;나현식;남대천;최연조
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.81-81
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    • 2010
  • 유리기판위에 큰 결정입자를 갖는 실리콘 (폴리 실리콘) 박막을 제조하는 것은 가격저가화 및 대면적화 측면 같은 산업화의 높은 잠재성을 가지고 있기 때문에 그동안 많은 관심을 가지고 연구되어 오고 있다. 다양한 방법을 이용하여 다결정 실리콘 박막을 만들기 위해 노력해 오고 있으며, 태양전지에 응용하기 위하여 연속적이면서 10um이상의 큰 입자를 갖는 다결정 실리콘 씨앗층이 필요하며, 고속증착을 위해서는 (100)의 결정성장방향 등 다양한 조건이 제시될 수 있다. 다결정 실리콘 흡수층의 품질은 고품질의 다결정 실리콘 씨앗층에서 얻어질 수 있다. 이러한 다결정 실리콘의 에피막 성장을 위해서는 유리기판의 연화점이 저압 화학기상증착법 및 아크 플라즈마 등과 같은 고온기반의 공정 적용의 어려움이 있기 때문에 제약 사항으로 항상 문제가 제기되고 있다. 이러한 관점에서 볼때 유리기판위에 에피막을 성장시키는 방법으로 많지 않은 방법들이 사용될 수 있는데 전자 공명 화학기상증착법(ECR-CVD), 이온빔 증착법(IBAD), 레이저 결정화법(LC) 및 펄스 자석 스퍼터링법 등이 에피 실리콘 성장을 위해 제안되는 대표적인 방법으로 볼 수 있다. 이중에서 효율적인 관점에서 볼때 IBAD는 산업화측면에서 좀더 많은 이점을 가지고 있으나, 박막을 형성하는 과정에서 큰 에너지 및 이온크기의 빔 사이즈 등으로 인한 표면으로의 damages가 일어날 수 있어 쉽지 않는 방법이 될 수 있다. 여기에서는 이러한 damage를 획기적으로 줄이면서 저온에서 결정화 시킬 수 있는 cold annealing법을 소개하고자 한다. 이온빔에 비해서 전자빔의 에너지와 크기는 그리드 형태의 렌즈를 통해 전체면적에 조사하는 것을 쉽게 제어할 수 있으며 이러한 전자빔의 생성은 금속 필라멘트의 열전자가 아닌 Ar플라즈마에서 전자의 분리를 통해 발생된다. 유리기판위에 흡수층 제조연구를 위해 DC 및 RF 스퍼터링법을 이용한 비정질실리콘의 박막에 대하여 두께별에 따른 밴드갭, 캐리어농도 등의 변화에 대하여 조사한다. 최적의 조건에서 비정질 실리콘을 2um이하로 증착을 한 후, 전자빔 조사를 위해 1.4~3.2keV의 다양한 에너지세기 및 조사시간을 변수로 하여 실험진행을 한 후 단면의 이미지 및 결정화 정도에 대한 관찰을 위해 SEM과 TEM을 이용하고, 라만, XRD를 이용하여 결정화 정도를 조사한다. 또한 Hall효과 측정시스템을 이용하여 캐리어농도, 이동도 등을 각 변수별로 전기적 특성변화에 대하여 분석한다. 또한, 태양전지용 흡수층으로 응용을 위하여 dark전도도 및 photo전도도를 측정하여 광감도에 대한 결과가 포함된다.

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Quantitative analysis of formation of oxide phases between SiO2 and InSb

  • Lee, Jae-Yel;Park, Se-Hun;Kim, Jung-Sub;Yang, Chang-Jae;Kim, Su-Jin;Seok, Chul-Kyun;Park, Jin-Sub;Yoon, Eui-Joon
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.162-162
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    • 2010
  • InSb has received great attentions as a promising candidate for the active layer of infrared photodetectors due to the well matched band gap for the detection of $3{\sim}5\;{\mu}m$ infrared (IR) wavelength and high electron mobility (106 cm2/Vs at 77 K). In the fabrication of InSb photodetectors, passivation step to suppress dark currents is the key process and intensive studies were conducted to deposit the high quality passivation layers on InSb. Silicon dioxide (SiO2), silicon nitride (Si3N4) and anodic oxide have been investigated as passivation layers and SiO2 is generally used in recent InSb detector fabrication technology due to its better interface properties than other candidates. However, even in SiO2, indium oxide and antimony oxide formation at SiO2/InSb interface has been a critical problem and these oxides prevent the further improvement of interface properties. Also, the mechanisms for the formation of interface phases are still not fully understood. In this study, we report the quantitative analysis of indium and antimony oxide formation at SiO2/InSb interface during plasma enhanced chemical vapor deposition at various growth temperatures and subsequent heat treatments. 30 nm-thick SiO2 layers were deposited on InSb at 120, 160, 200, 240 and $300^{\circ}C$, and analyzed by X-ray photoelectron spectroscopy (XPS). With increasing deposition temperature, contents of indium and antimony oxides were also increased due to the enhanced diffusion. In addition, the sample deposited at $120^{\circ}C$ was annealed at $300^{\circ}C$ for 10 and 30 min and the contents of interfacial oxides were analyzed. Compared to as-grown samples, annealed sample showed lower contents of antimony oxide. This result implies that reduction process of antimony oxide to elemental antimony occurred at the interface more actively than as-grown samples.

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Low temperature plasma deposition of microcrystalline silicon thin films for active matrix displays: opportunities and challenges

  • Cabarrocas, Pere Roca I;Abramov, Alexey;Pham, Nans;Djeridane, Yassine;Moustapha, Oumkelthoum;Bonnassieux, Yvan;Girotra, Kunal;Chen, Hong;Park, Seung-Kyu;Park, Kyong-Tae;Huh, Jong-Moo;Choi, Joon-Hoo;Kim, Chi-Woo;Lee, Jin-Seok;Souk, Jun-H.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.107-108
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    • 2008
  • The spectacular development of AMLCDs, been made possible by a-Si:H technology, still faces two major drawbacks due to the intrinsic structure of a-Si:H, namely a low mobility and most important a shift of the transfer characteristics of the TFTs when submitted to bias stress. This has lead to strong research in the crystallization of a-Si:H films by laser and furnace annealing to produce polycrystalline silicon TFTs. While these devices show improved mobility and stability, they suffer from uniformity over large areas and increased cost. In the last decade we have focused on microcrystalline silicon (${\mu}c$-Si:H) for bottom gate TFTs, which can hopefully meet all the requirements for mass production of large area AMOLED displays [1,2]. In this presentation we will focus on the transfer of a deposition process based on the use of $SiF_4$-Ar-$H_2$ mixtures from a small area research laboratory reactor into an industrial gen 1 AKT reactor. We will first discuss on the optimization of the process conditions leading to fully crystallized films without any amorphous incubation layer, suitable for bottom gate TFTS, as well as on the use of plasma diagnostics to increase the deposition rate up to 0.5 nm/s [3]. The use of silicon nanocrystals appears as an elegant way to circumvent the opposite requirements of a high deposition rate and a fully crystallized interface [4]. The optimized process conditions are transferred to large area substrates in an industrial environment, on which some process adjustment was required to reproduce the material properties achieved in the laboratory scale reactor. For optimized process conditions, the homogeneity of the optical and electronic properties of the ${\mu}c$-Si:H films deposited on $300{\times}400\;mm$ substrates was checked by a set of complementary techniques. Spectroscopic ellipsometry, Raman spectroscopy, dark conductivity, time resolved microwave conductivity and hydrogen evolution measurements allowed demonstrating an excellent homogeneity in the structure and transport properties of the films. On the basis of these results, optimized process conditions were applied to TFTs, for which both bottom gate and top gate structures were studied aiming to achieve characteristics suitable for driving AMOLED displays. Results on the homogeneity of the TFT characteristics over the large area substrates and stability will be presented, as well as their application as a backplane for an AMOLED display.

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