• Journal of Fashion Business
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• v.27 no.6
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• pp.147-159
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• 2023

Fashion is the second most polluting industry. We must strive to transition to a form of industry that does not cause environmental pollution. These efforts drive may fashion brands to produce and sell products with redesigned methods that delight the inventory flow. Accordingly, it is necessary to develop creative apparel up-cycling design using the creative thinking method. This study aims to produce clothing redesign works by introducing design idea types for systematic redesign creation. In this research, we conducted a literature review on the concept of up-cycling design and employed heterotopa spacial concept reflected fashion design creation methodology types. The RE;CODE, a leading domestic up-cycling design brand, was used in case analysis. According to the command of shape transformation, it is spreading, stacking, dropping, inverting and crossing, from the creative thinking method reflecting heterotopia spacial concepts, showing designers a concrete way to transform form into new apparel. Seven works of apparel up-cycling design were developed by conducting process of RE;CODE. Also, to establish an apparel up-cycling design creation process for creating works. In this study, we proposed a systematic method for apparel up-cycling design, including a method for reorganizing two or more different materials to create something new and ultimately reversing the structure. The value and significance of this study is that it proposes a systematic method for apparel up-cycling design to make it new.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.443-449
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• 2007

The structural and thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ electrode during cycling process was studied. The sample was prepared by simple combustion method. Although there were irreversible changes on the initial cycle, O3 stacking for $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ structure was retained during the first and subsequent cycling process. Impedance of the test cell was decreased after the first charge-discharge process, which would be of benefit to intercalation and deintercalation of lithium ion on subsequent cycling. As expected, cycling test for 75 times increased impedance of the cell a little, instead, thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ was improved. Moreover, based on DSC analysis, the initial exothermic peak was shifted to high temperature range and the amount of heat was also decreased after cycling test, which displayed that thermal stability was not deteriorated during cycling.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.45-48
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• 2005

In manufacturing process of composite cylinders with metal liner, the autofrettage process which induces compressive residual stress on liner to improve cycling life can be applied. In this study, finite element analysis technique is presented, which can predict accurately the compressive residual stress on liner induced by autofrettage and stress behavior after. Material and geometry non-linearity is considered in finite element analysis, and the Von-Mises stress of a liner is introduced as a key parameter that determines pressure cycling life of composite cylinders. Presented methodology is verified through fatigue test of liner material and pressure cycling test of composite cylinders.

• Journal of Korean Society on Water Environment
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• v.23 no.5
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• pp.577-580
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• 2007

The influence of flow rate has been investigated on the treatment efficiency of continuous cycling electrolytic process employing artificial and actual photographic wastewater which containing silver ion. For artificial wastewater, the treatment efficiency of process was found to rise ca. three times when the flow rate of wastewater was increased from 3 mL/min to 15 mL/min. The process efficiency was doubled under the same condition regarding actual wastewater. The effect of flow rate on the treatment efficiency was observed to be altered according to the metal ionic form and solution composition. The coefficient of mass transfer was estimated using model equation, which verified that the raised treatment efficiency at higher flow rate was due to the increased mobility of ionic species.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.1-4
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• 2009

This work shows how the adoption of a dual-dicing process for silicon wafer separation affects the thermal-cycling reliability (i.e. $-65^{\circ}C$ to $150^{\circ}C$) of the semiconductor devices utilizing lead-on-chip (LOC) die attach technique. In-situ examinations show that conventional single-dicing process directly attacks the edge region of diced devices but dual-dicing process effectively protects the edge region of diced devices from dicing-induced mechanical damage. Probably, this is because the preferential and sacrificial fracture of notched regions induced on the active surface of wafers saves the edge regions. It was also investigated through thermal-cycling tests that the number of thermal-cycling induced failures is much lower at the dual-dicing process than the single-dicing process.

• Journal of Environmental Science International
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• v.6 no.6
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• pp.697-709
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• 1997

Sequencing Batch Reactor(SBR) experiments for organics and nutrients removal have been conducted to find an optimum anaerobic/anoxic/aerobic cycling time and evaluate the applicability of oxidation-reduction potential(ORP) as a process control parameter. In this study, a 61 bench-scale plant was used and fed with night-soil wastewater in K city which contained TCODcr : 10, 680 mg/l, TBm : 6, 893 mg/l, $NH_4^+-N$ : 1, 609 mg/l, $PO_4^{3-}-P$ : 602 mg/l on average. The cycling time In SBRs was adjusted at 12 hours and 24 hours, and then certainly included anaerobic, aerobic and inoxic conditions. Also, for each cycling time, we performed 3 series of experiment simultaneously which was set up 10 days, 20 days and 30 days as SRT From the experimental results, the optimum cycling time for biological nutrient removal with nlght-soil wastewater was respctively 3hrs, 5hrs, 3hrs(anaerobic-aerobic-anoxic), Nitrogen removal efficiency was 77.9%, 77.9%, 81.7% for each SRT, respectively. When external carbon source was fed in the anoxic phase, ORP-bending point indicating nitrate break point appeared clearly and nitrogen removal efficiency increased as 96.5%, 97.1%, 98.9%. Phosphate removal efficiency was 59.8%, 64.571, 68.6% for each SRT. Also, we finded the applicability of ORP as a process control parameter in SBRs.

• Journal of the Korea Fashion and Costume Design Association
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• v.19 no.2
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• pp.49-61
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• 2017

The purpose of this study was to develop an educational program designed to allow students to experience 'up-cycling' first-hand during class and understand its significance by helping them improving their practical problem-solving abilities. Teachers of home economics, Korean, and social studies to third grade middle schooler were asked to analyze the curriculums of their subjects. The analysis results were then used to identify common elements among the units, reconstruct the curriculums, and develop an integrated lesson program to offer integrated activities. Based on these, a lesson program was developed to make an eco-bag and running shoes under the theme of 'up-cycling' in the unit of 'environmentally-friendly clothing and mending of clothes' in the home economics subject. The results were as follows: First, a topical fusion lesson program was developed to integrate three subjects together. The development process involved the integration of the topic of up-cycling, a program model for integrated lessons, and a teaching and learning process plan for topical integrated education. Secondly, a lesson program for home economics was developed that was applicable to actual home economics lessons based on the topical integrated lesson program. The lesson domains were divided into large, medium, and small to create a ten-lesson teaching and learning process plan needed for the lessons, teaching materials that could be put to actual uses in lessons, and activity and evaluation logs for learners.

• Journal of Korean Society for Quality Management
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• v.51 no.4
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• pp.735-749
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• 2023

Purpose: The purpose of this study is to derive solutions and prevent similar cases from occurring by analyzing the causes of cracks found in temperature cycling tests of rocket motor. Methods: By combining the results of the current state confirmation test, non-destructive test, domestic and foreign rocket motor comparison test, cutting test, and adhesion test according to the number of times to apply mold release agent, a Cause and Effect Diagram analysis was performed to derive the cause of cracks. Results: Through this study, 26 factors that could cause cracking in rocket motors during temperature cycling tests were identified. Through various additional test results, a total of five causes were identified, including chemical and structural design of the joint between the propellant and stress relief insert, omission of procedure in the manufacturing procedures, natural aging due to temperature, and load accumulation due to temperature changes. The fundamental cause was confirmed to be insufficient consideration of the release properties of the propellant and stress relief insert. Conclusion: During the design process, it was confirmed that this could be solved by structurally or chemically designing the insert so that it does not combine with the propellant, or by applying a mold release agent during the manufacturing process.

• Journal of Microbiology and Biotechnology
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• v.31 no.10
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• pp.1430-1437
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• 2021

Cronobacter sakazakii is an opportunistic pathogenic bacterium found in powdered infant formula and is fatal to neonates. Antibiotic resistance has emerged owing to overuse of antibiotics. Therefore, demand for high-yield bacteriophages as an alternative to antibiotics has increased. Accordingly, we developed a modified mass-production method for bacteriophages by introducing a two-stage self-cycling (TSSC) process, which yielded high-concentration bacteriophage solutions by replenishing the nutritional medium at the beginning of each process, without additional challenge. pH of the culture medium was monitored in real-time during C. sakazakii growth and bacteriophage CS01 propagation, and the changes in various parameters were assessed. The pH of the culture medium dropped to 5.8 when the host bacteria reached the early log phase (OD₅₄₀ = 0.3). After challenge, it decreased to 4.65 and then recovered to 4.94; therefore, we set the optimum pH to challenge the phage at 5.8 and that to harvest the phage at 4.94. We then compared phage production during the TSSC process in jar-type bioreactors and the batch culture process in shaker flasks. In the same volume of LB medium, the concentration of the phage titer solution obtained with the TSSC process was 24 times higher than that obtained with the batch culture process. Moreover, we stably obtained high concentrations of bacteriophage solutions for three cycles with the TSSC process. Overall, this modified TSSC process could simplify large-scale production of bacteriophage CS01 and reduce the unit cost of phage titer solution. These results could contribute to curing infants infected with antibiotic-resistant C. sakazakii.

• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.