• Title/Summary/Keyword: curing behavior

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Friction behavior of controlled low strength material-soil interface

  • Han, WooJin;Kim, Sang Yeob;Lee, Jong-Sub;Byun, Yong-Hoon
    • Geomechanics and Engineering
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    • v.18 no.4
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    • pp.407-415
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    • 2019
  • A controlled low strength material (CLSM) is a highly flowable cementitious material used for trench backfilling. However, when applying vertical loads to backfilled trenches, shear failure or differential settlement may occur at the interface between the CLSM and natural soil. Hence, this study aims to evaluate the characteristics of the interface friction between the CLSM and soils based on curing time, gradation, and normal stress. The CLSM is composed of fly ash, calcium sulfoaluminate cement, sand, silt, water, and an accelerator. To investigate the engineering properties of the CLSM, flow and unconfined compressive strength tests are carried out. Poorly graded and well-graded sands are selected as the in-situ soil adjacent to the CLSM. The direct shear tests of the CLSM and soils are carried out under three normal stresses for four different curing times. The test results show that the shear strengths obtained within 1 day are higher than those obtained after 1 day. As the curing time increases, the maximum dilation of the poorly graded sand-CLSM specimens under lower normal stresses also generally increases. The maximum contraction increases with increasing normal stress, but it decreases with increasing curing time. The shear strengths of the well-graded sand-CLSM interface are greater than those of the poorly graded sand-CLSM interface. Moreover, the friction angle for the CLSM-soil interface decreases with increasing curing time, and the friction angles of the well-graded sand-CLSM interface are greater than those of the poorly graded sand-CLSM interface. The results suggest that the CLSM may be effectively used for trench backfilling owing to a better understanding of the interface shear strength and behavior between the CLSM and soils.

Effect of Zirconia Particle Addition on Curing Behavior of Phenolic Resins (Zirconia 입자의 첨가가 페놀 수지의 경화거동에 미치는 영향)

  • Yun, Jaeho;Kim, Hanjun;Lee, Jae Min;Kim, Jong Hee;Lee, Seung Goo
    • Composites Research
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    • v.35 no.4
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    • pp.288-297
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    • 2022
  • This study investigated the effect of addition of zirconia(zirconium oxide) powder on the curing behavior of phenolic resins. The heating rate controlled curing and isothermal curing behaviors of the phenol resin according to the content of the zirconia powder were analyzed. The viscosity and thermal decomposition characteristics of the phenolic resin with the zirconia content were also examind. From the DSC analysis, the degree of cure and the rate of cure were obtained. Finally, the activation energy for the cure reaction were calculated from the DSC data of the zirconia added phenolic resin. As a found, the higher the zirconia content, the longer the curing was delayed and the greater the activation energy required for curing. Additionally, the TGA result that as the content of zirconia increased, less weight loss was observed. The surface tackiness of the Carbon/Phenol prepreg was partially changed according to the zirconia content, but had no significant effect.

Curing of Epoxy Resin with Natural Cashew Nut Shell Liquids (천연 캐슈너트 외피유를 이용한 에폭시 수지의 가교)

  • Nah, Chang-Woon;Go, Jin-Hwan;Byun, Joon-Hyung;Hwang, Byung-Sun
    • Composites Research
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    • v.21 no.1
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    • pp.16-21
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    • 2008
  • The cure behavior of epoxy resin with a conventional amide-type hardener(HD) was investigated in the presence of castor oil(CO), cashew nut shell liquid(CNSL) and CNSL-formaldehyde resin(CFR) by using a dynamic differential scanning calorimetry(DSC). The activation energy of curing reaction was also calculated based on the non-isothermal DSC thermograms at various heating rates. An one-stage curing was noted in the case of epoxy resin filled with CO, while the epoxy resin with CNSL and CFR showed a two-stage curing process. A competitive cure reaction was noted for the epoxy resin/CNSL(or CFR)/HD blends. In the absence of HD, the CFR showed lower values of curing enthalpy than that of CNSL. The activation energy of epoxy resin curing increased with increasing the CNSL and CFR loading.

Optimization of Curing Pressure for Automatic Pressure Gelation Molding Process of Ultra High Voltage Insulating Spacers (초고압 절연 스페이서의 자동가압 겔화 성형 공정을 위한 경화 보압의 최적화 )

  • Chanyong Lee;Hangoo Cho;Jaehyeong Lee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.1
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    • pp.56-62
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    • 2024
  • By introducing curing kinetics and chemo-rheology for the epoxy resin formulation for ultra-high voltage gas insulated switchgear (GIS) Insulating Spacers, a study was conducted to simulate the curing behavior, flow and warpage analysis for optimization of the molding process in automatic pressure gelation. The curing rate equation and chemo-rheology equation were set as fixed values for various factors and other physical property values, and the APG molding process conditions were entered into the Moldflow software to perform optimization numerical simulations of the three-phase insulating spacer. Changes in curing shrinkage according to pack pressure were observed under the optimized process conditions. As a result, it was confirmed that the residence time in the solid state was shortened due to the lowest curing reaction when the curing holding pressure was 3 bar, and the occurrence of deformation due to internal residual stress was minimized.

The study on cure behavior and dielectric property of Ceramic (BNT)-Polymer (BCB) composite material (세라믹(BNT)-폴리머(BCB) 복합체의 경화 거동과 유전특성에 대한 연구)

  • Kim, Un-Yong;Chun, Myoung-Pyo;Cho, Jung-Ho;Kim, Byung-Ik;Myoung, Sung-Jae;Sin, Dong-Uk
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.17 no.6
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    • pp.251-255
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    • 2007
  • We made $(1-x)BCB-xBNT(BaNd_2Ti_4O_{12})$ (x=20, 30, 40, 50 vol%) composite thick film with a high dielectric constant and low loss by the hand casting method. Dielectric constant and dielectric loss of prepared thick film are measured at 1MHz and curing behavior of the film are observed through thermal analysis such as DSC. We investigated the effect of contents of BNT filler and curing behavior of film on dielectric properties of BCB-BNT composite. Dielectric constant increased with increasing BNT filler from 20 to 50 vol% and dielectric loss ($tan{\delta}$) decreased with increasing BNT filler. Dielectric constant and loss ($tan{\delta}$) of composite material was not nearly dependent on the curing behavior. But as a result of TCC (Temperature Characteristics of Coefficient) decreased with increasing the curing temperature, we confirmed that the curing of these composite system is most stable above $250^{\circ}C$.

Anti-static behavior of Synthetic fabrics treated by anti-static agents (대전방지처리된 합성섬유의 대전성에 관한 연구)

  • Choi Suk-Chul;Kim Mi-Sung
    • Journal of the Korean Society of Clothing and Textiles
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    • v.11 no.1
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    • pp.51-62
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    • 1987
  • In this study, electrostatic behavior of polyester and nylon fabric treated with anti-static agents were investigated. The effects of the concentration of the agents and curing conditions on the electrostatic charge of the fabrics were studied. And washfastness, lightfastness and physicalproperties of the treated fabrics were also investigated. The results were as follows: 1) Polyethylene glycol alkylester was more effective in antistatic behavior than polyethylene laurylphosphate, and polyester is more effective in anti-static behavior than nylon. 2) Concentration of anti-static agents were suitable in concentration of $4\%$. 3) Glyoxal resin was more effective in anti-static behavior than melamine resin, and it was also good in the retaing anti-static behavior after treatments of lightfastness and washfastness. 4) As the condition of curing treatment, $190^{\circ}C$, 1min. for glyoxal resin and $130^{\circ}C$, 4min. for melamine resin is appropriate. 5) In comparison of anti-static behavior according to treating conditions, the simultaneous treatment was more effective than any other treatments. 6) Change of electrostatic charge of anti-static nylon cloths after treatments of lightfastness and washfastness increased greatly in above 10 laundering time and 20 fade-O-meter time. 7) In physical properties according to concentration of treating agents. decrease of physical properties scarcely appeared in concentration of treating agents $4\~5\%$.

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Residual Stress Comparison of Type III Hydrogen Tank by Curing Conditions (Type III 수소탱크 경화조건에 따른 잔류응력 비교)

  • Yong-Chul Shin
    • Composites Research
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    • v.37 no.1
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    • pp.15-20
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    • 2024
  • Since the residual stress of hydrogen tank is directly related to durability, it is very important to reduce it for safety. Type II~IV hydrogen tank are manufactured by the filament winding method, in which the fiber is impregnated with resin and wound around the liner. Residual stress in composite is affected by curing conditions and fiber tension etc. In this study, the effect of curing conditions on residual stress was analyzed when manufacturing a Type III hydrogen tank using carbon fiber filament winding process. First, the curing behavior of the epoxy resin was analyzed using a differential scanning calorimetry. Through this, the curing temperature was set to 140℃. During the same curing time, the specimens were cured under 2-stage curing condition that reached 140℃ earlier and a 4-stage curing condition that reached 140℃ later, respectively. After curing, the residual stress of the composite material was measured by the ring slitting method, and the experimental values were compared with numerical values. It was confirmed that there was a significant difference in residual stress according to the optimization of curing conditions.

Investigating the long-term behavior of creep and drying shrinkage of ambient-cured geopolymer concrete

  • Asad Ullah Qazi;Ali Murtaza Rasool;Iftikhar Ahmad;Muhammad Ali;Fawad S. Niazi
    • Structural Engineering and Mechanics
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    • v.89 no.4
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    • pp.335-347
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    • 2024
  • This study pioneers the exploration of creep and shrinkage behavior in ambient-cured geopolymer concrete (GPC), a vital yet under-researched area in concrete technology. Focusing on the influence of sodium hydroxide (NaOH) solution concentration, the research utilizes low calcium fly ash (Class-F) and alkaline solutions to prepare two sets of GPC. The results show distinct patterns in compressive strength development and dry shrinkage reduction, with a 14 M NaOH solution demonstrating a 26.5% lower dry shrinkage than the 16 M solution. The creep behavior indicated a high initial strain within the first 7 days, significantly influenced by curing conditions and NaOH concentration. This study contributes to the existing knowledge by providing a deeper understanding of the time-dependent properties of GPC, which is crucial for optimizing its performance in structural applications.

Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding (플립칩 본딩용 비전도성 접착제의 속경화거동 평가기법)

  • Min, Kyung-Eun;Lee, Jun-Sik;Lee, So-Jeong;Yi, Sung;Kim, Jun-Ki
    • Journal of Welding and Joining
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    • v.33 no.5
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    • pp.41-46
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    • 2015
  • The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

Synthesis, Cure Behavior, and Rheological Properties of Fluorine-Containing Epoxy Resins (불소함유 에폭시 수지의 합성, 경화 거동 및 유변학적 특성)

  • 박수진;김범용;이재락;신재섭
    • Polymer(Korea)
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    • v.27 no.3
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    • pp.176-182
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    • 2003
  • The fluorine-containing epoxy resin, 2-trifluorotoluene diglycidylether (FER) was prepared by reaction of 2-chloro-${\alpha}$,${\alpha}$,${\alpha}$-trifluorotoluene with glycerol diglycidylether in the presence of pyridine catalyst. Curing behavior of FER/DDM system was investigated using dynamic and isothermal DSC. Cure activation energy (Ea) was determined by Flynn-Wall-Ozawa's equation. The rheological properties of FER/DDM system were studied under isothermal condition using a rheometer. Cross-linking activation energy (Ec) was determined from the Arrhenius equation based on gel time and curing temperature. As a result, the chemical structure of FER was confirmed by FT-IR, $\^$13/C NMR, and $\^$19/F NMR spectroscopy. The cure activation energy of FER/DDM system was 55.4 kJ/mol and conversion and conversion rate were increased with the curing temperature. The cross-linking activation energy of FER/DDM system was 41.6 kJ/mol and gel time was decreased with the curing temperature.