• Title/Summary/Keyword: curing and adhesive behavior

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Heating Behavior and Adhesion Property of Epoxy Adhesive with Nano and Micro Sized Fe3O4 Particles (Nano 및 Micro 크기의 Fe3O4 분말이 첨가된 열경화성 에폭시 접착제의 유도가열 및 접착 특성)

  • Hwang, Ji-Won;Im, Tae-Gyu;Choi, Seung-Yong;Lee, Nam-Kyu;Shon, Min-Young
    • Composites Research
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    • v.33 no.2
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    • pp.55-60
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    • 2020
  • A study on the heating behavior and adhesion property of structural epoxy adhesive through induction heating have been conducted. An adhesive for induction heating was manufactured through mixing with nano and micro sized Fe3O4. From the results, it was observed that induction heating is less affected by adherend (GFRP) thickness than oven heating. The heating rate of Fe3O4 embedded epoxy adhesive using induction heating much higher than that of oven curing process and it is more appreciable when the contents of Fe3O4 increased. Furthermore, adhesion strength increased with increase of Fe3O4 particle contents.

The Mixture Ratio Effect of Epoxy Resin, Curing Agent and Accelerator on the Fatigue Behavior of FRMLs (프리프레그 제작용 에폭시 수지.경화제.경화촉진제 혼합비 변화에 따른 FRMLs의 피로거동 특성)

  • Song, Sam-Hong;Kim, Cheol-Ung
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.4
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    • pp.592-601
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    • 2001
  • Fiber reinforced metal laminates(FRMLs) are new types of hybrid materials. FRMLs consists of high strength metal(Al 5052-H34) and laminated fiber with structural adhesive bond. The mixture ratio effect of epoxy resin$.$curing agent$.$accelerator on the fatigue behavior of FRMLs was investigated in this study. The epoxy, diglycidylether of bisphenol A(DGEBA), was cured by methylene dianiline(MDA) with or without an accelerator(K-54). Eight different kinds of resin mixture ratios were selected for the test ; five kinds of FRMLs(1) and three others of FRMLs(2). The relationship between da/dN and ΔK with variation of resin mixture ratio was studied. FRMLs(1) and FRMLs(2) indicated approximately 2 times and 2.2 times more improved maximum bending strengths in comparison with those of Al 5052-H34. The resin mixture ratio <1:1> in case of FRMLs(1) indicated the maximum fatigue life, while the resin mixture ratio <1:1:0.2> in case of FRMLs(2) indicated the maximum fatigue life. As results, FRMLs(2) turned out to have more effective characteristics on the fatigue properties and the bending strength than those of FRMLs(1).

Study on Adhesive Strength of Polymer Modified Cement Mortar for Maintenance in Concrete Structure (콘크리트 구조물 보수용 폴리머시멘트 모르타르의 부착강도 특성에 관한 연구)

  • Park, Sang-Soon;Kim, Jung-Heum
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.14 no.5
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    • pp.128-135
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    • 2010
  • Polymer-modified cement mortar(PCM) has been widely used for strengthening of the concrete structures due to its excellent physical properties such as high strength and durability. Adhesive strength or behavior, on the other hands, between PCM and concrete is very important in strengthening the concrete member using PCM. Therefore the adhesive failure mechanism between PCM and concrete should be fully verified and understood. This study was performed to evaluate adhesive strength of PCM to the concrete by the direct pull-out test. In the direct pull-out tests, the adhesive strength under the various pre-treatment conditions such as immersion, thunder shower, freezing and thawing are evaluated. Also, the field direct pull-out test are performed to investigate the adhesive strength of mock-up test specimens. In the results of the test, the adhesive strength value by field test are lower than those of the standard curing condition. From these comparison and investigation, field test result was similar with the thunder shower test result. The results of the test was used to evaluate the korean industrial standard of polymer modified cement mortars for maintenance in concrete.

Strength and Impact Damage Characteristics of A17075/CFRP Sandwitch Pannel by Using Automobiles (자동차용 경량화 A17075 / CFRP 샌드위치 판넬의 강도와 충격손상 특성)

  • Yoon, Han-Ki;Lee, Jong-Ho;Park, Yi-Hyun;Lee, Je-Heon
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2002.10a
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    • pp.295-300
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    • 2002
  • To establish an optimum condition in the surface treatment and curing process will be an important parameters for the fabrication of multilayered hybrid composite materials, A17075/CFRP (CARALL : carbon fiber reinforce aluminum laminates). Effects of carbon fiber direction and thickness variation in tensile strength were investigated. And impact damage behavior of carbon fiber reinforce plastic (CFRP) and CARALL were investigated also, it was found that a partial stress increase in order of epoxy adhesive, A17075, CFRP. And the partial stress of CFRP carried out a great portion of applied stress. The impact damage resistance of CARALL was higher than that of CFRP. This is because both side Al sheet of CARALL absorb a great of impact damage.

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The Peel Energy Behavior of UV-Cured Acrylic PSAs (UV경화형 아크릴계 점착제의 박리 에너지 변화)

  • Son, Hee-Chul;Kim, Ho-Gyum;Lee, Dong-Ho;Min, Kyung-Eun
    • Polymer(Korea)
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    • v.32 no.4
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    • pp.313-321
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    • 2008
  • Acrylic pressure sensitive adhesive(PSA) was prepared by UV radiation curing and the peel energy and physical properties of PSA were investigated. The increase of amount of acrylic acid leads to improve the peel energy, associated with the substrate having smooth surface and high layer thickness. The high peel energy is obtained when the direction of irregularity in substrate is horizontal with the peeling direction. This is attributed to the increase of resistance to peeling in spite of decrease of wetting and the result corresponds to our supposition.

Synthesis and Adhesion Properties of UV Curable Acrylic PSAs for Semiconductor Manufacturing Process (반도체 제조 공정용 UV 경화형 아크릴 점착제의 합성과 점착 특성)

  • Lee, Seon Ho;Lee, Sang Keon;Hwang, Taek Sung
    • Applied Chemistry for Engineering
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    • v.24 no.2
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    • pp.148-154
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    • 2013
  • UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

Reflow Behavior and Board Level BGA Solder Joint Properties of Epoxy Curable No-clean SAC305 Solder Paste (에폭시 경화형 무세정 SAC305 솔더 페이스트의 리플로우 공정성과 보드레벨 BGA 솔더 접합부 특성)

  • Choi, Han;Lee, So-Jeong;Ko, Yong-Ho;Bang, Jung-Hwan;Kim, Jun-Ki
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.1
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    • pp.69-74
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    • 2015
  • With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

Interfacial fracture analysis of human tooth/composite resin restoration using acoustic emission (음향방출법을 이용한 치아/복합레진 수복재의 계면부 파괴해석)

  • Gu, Ja-Uk;Choi, Nak-Sam;Arakawa, Kazuo
    • Composites Research
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    • v.22 no.6
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    • pp.45-51
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    • 2009
  • The marginal integrity at the composite resin-tooth interface has been analyzed in real time through acoustic emission (AE) monitoring during the polymerization shrinkage of composite resin subjected to the light exposure. It was found that AE signals were generated by the polymerization shrinkage. Most AE hit events showed a blast type signal having the principal frequency band of 100-200kHz. Bad bonding states were indicated by many hit events in the initial curing period of 1 minute with high contraction rate. The quantity of hit events for the human molar dentin specimen was much less than that for the steel ring specimen but more than that for the PMMA ring specimen. The better the bonding state, the less the AE hit events. The AE characteristics were related with the tensile crack propagation occurring in the adhesive region between the composite resin and the ring substrate as well as the compressive behavior of the ring substrate, which could be used for a nondestructive characterization of the marginal disintegrative fracture of the dental restoration.