• Title/Summary/Keyword: cure temperature

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The Effect of Mass Transfer on the Cure Properties of the Urea Resin Moulding Compounds Under the Drying Process (건조 공정 중 요소 수지 성형재료의 경화 특성에 대한 물질전달 효과)

  • Kim, Sang Yeul;Choi, Il Gon;Kim, Byoung Chul
    • Korean Chemical Engineering Research
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    • v.40 no.6
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    • pp.681-686
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    • 2002
  • In the industrial field, the theory of drying process is different from the practical application, and it is effective to reduce energy by recirculation of the heat of exhausting gas. But the study of this field may not be performed still. The cure properties of the urea resin moulding compounds was investigated according to drying temperature, drying time, recycle rate of exhausting gas and moulding temperature in the process of drying and moulding. We obtained the following results; water content of material decreases with increasing drying time and drying temperature, and the rate of drying also decreases with increasing recycle rate of exhausting gas. Specially, The cure fluidity of the urea resin moulding compounds decreases, with increasing drying temperature, recycle rate of exhausting gas and moulding temperature. And the correlation equations on water content and cure fluidity of the urea resin moulding material were obtained through a regression analysis of experimental data.

The Toughness of Castor Oil Modified Epoxy Resins by Various Cure Temperatures (경화온도에 따른 Castor Oil/epoxy의 강인성)

  • Kim, Jong Seok;Hong, Suk Pyo
    • Applied Chemistry for Engineering
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    • v.8 no.6
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    • pp.973-978
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    • 1997
  • The toughness and morphology of epoxy resin based on diglycidyl ether of bisphenol A(DGEBA) cured with of tris (dimethylaminomethy]) phenol(DMP-30) and castor oil (CO) as a toughening modifier have been studied. Mixtures of CO and an epoxy resin showed a higher miscibility than the classical CTBN modified epoxy resin. The glass transition temperature($T_g$) was decreased with the CO content and the cure temperature. It is interpreted that the networks of epoxy matrix obtained at high temperature are apparently looser and more flexible due to the lower crosslinking density. The toughness was slightly increased with the CO content at $40^{\circ}C$ of curing temperature. The toughness increased with increasing the cure temperature and CO content.

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Dynamic Optimization of o Tire Curing Process for Product Quality (제품품질을 위한 타이어 가황공정의 동적 최적화)

  • Han, In-Su;Kang, Sung-Ju;Chung, Chang-Bock
    • Elastomers and Composites
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    • v.34 no.4
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    • pp.321-331
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    • 1999
  • The curing process is the final step in tire manufacturing whereby a green tire built from layers of rubber compounds is formed to the desired shape and the compounds are converted to a strong, elastic materials to meet tire performance needs under elevated pressure and temperature in a press. A numerical optimization procedure was developed to improve product quality in a tire curing process. First, a dynamic constrained optimization problem was formulated to determine the optimal condition of the supplied cure media during a curing process. The objective function is subject to an equality constraint representing the process model that describes the heat transfer and cures kinetic phenomena in a cure press and is subject to inequality constraints representing temperature limits imposed on cure media. Then, the optimization problem was solved to determine optimal condition of the supplied cure media for a tire using the complex algorithm along with a finite element model solver.

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Cure Monitoring of Epoxy Resin by Using Fiber Bragg Grating Sensor (광섬유 브래그 격자 센서를 이용한 에폭시 수지의 경화도 모니터링)

  • Lee, Jin-Hyuk;Kim, Dae-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.36 no.3
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    • pp.211-216
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    • 2016
  • In several industrial fields, epoxy resin is widely used as an adhesive for co-curing and manufacturing various structures. Controlling the manufacturing process is required for ensuring robust bonding performance and the stability of the structures. A fiber optic sensor is suitable for the cure monitoring of epoxy resin owing to the thready shape of the sensor. In this paper, a fiber Bragg grating (FBG) sensor was applied for the cure monitoring of epoxy resin. Based on the experimental results, it was demonstrated that the FBG sensor can monitor the status of epoxy resin curing by measuring the strain caused by volume shrinkage and considering the compensation of temperature. In addition, two types of epoxy resin were used for the cure-monitoring; moreover, when compared to each other, it was found that the two types of epoxy had different cure-processes in terms of the change of strain during the curing. Therefore, the study proved that the FBG sensor is very profitable for the cure-monitoring of epoxy resin.

Cure Kinetics for the Acid Anhydride-cured Epoxy System Using a Near-infrared Reflection Spectroscopy (근적외선 분광분석을 통한 산무수물경화 에폭시 시스템의 경화 동력학)

  • 곽근호;박수진;이재락
    • Polymer(Korea)
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    • v.24 no.1
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    • pp.65-71
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    • 2000
  • The latent properties and cure kinetics of an acid anhydride-cured epoxy resin have been investigated by a near-infrared (NIR) reflection spectroscopy. The assignments of the latent properties and cure behaviors were performed by the measurements of the NIR reflectance for epoxide and hydroxyl groups at different temperatures. A comprehensive analysis of the origin, location, and shifts during reaction of all major NIR absorption peaks in the spectral range from 4000 to 7100 $cm^{-1}$ / was provided. The extent of reaction was determined from NIR absorption band at the 4530 $cm^{-1}$ / depending on epoxide concentration and cure temperature.

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Effects of Hardeners on the Low-Temperature Snap Cure Behaviors of Epoxy Adhesives for Flip Chip Bonding (플립칩용 에폭시 접착제의 저온 속경화 거동에 미치는 경화제의 영향)

  • Choi, Won-Jung;Yoo, Se-Hoon;Lee, Hyo-Soo;Kim, Mok-Soon;Kim, Jun-Ki
    • Korean Journal of Materials Research
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    • v.22 no.9
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    • pp.454-458
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    • 2012
  • Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

Effect of solution temperature on the mechanical properties of dual-cure resin cements

  • Kang, En-Sook;Jeon, Yeong-Chan;Jeong, Chang-Mo;Huh, Jung-Bo;Yun, Mi-Jung;Kwon, Yong-Hoon
    • The Journal of Advanced Prosthodontics
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    • v.5 no.2
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    • pp.133-139
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    • 2013
  • PURPOSE. This study was to evaluate the effect of the solution temperature on the mechanical properties of dualcure resin cements. MATERIALS AND METHODS. For the study, five dual-cure resin cements were chosen and light cured. To evaluate the effect of temperature on the specimens, the light-cured specimens were immersed in deionized water at three different temperatures (4, 37 and $60^{\circ}C$) for 7 days. The control specimens were aged in a $37^{\circ}C$ dry and dark chamber for 24 hours. The mechanical properties of the light-cured specimens were evaluated using the Vickers hardness test, three-point bending test, and compression test, respectively. Both flexural and compressive properties were evaluated using a universal testing machine. The data were analyzed using a two way ANOVA with Tukey test to perform multiple comparisons (${\alpha}$=0.05). RESULTS. After immersion, the specimens showed significantly different microhardness, flexural, and compressive properties compared to the control case regardless of solution temperatures. Depending on the resin brand, the microhardness difference between the top and bottom surfaces ranged approximately 3.3-12.2%. Among the specimens, BisCem and Calibra showed the highest and lowest decrease of flexural strength, respectively. Also, Calibra and Multilink Automix showed the highest and lowest decrease of compressive strength, respectively compared to the control case. CONCLUSION. The examined dual-cure resin cements had compatible flexural and compressive properties with most methacrylate-based composite resins and the underlying dentin regardless of solution temperature. However, the effect of the solution temperature on the mechanical properties was not consistent and depended more on the resin brand.

The Evaluation of the thermal degradation and the degree of cure of glass/epoxy composite by ultrasonic technique (복합재료의 열화도 및 경화도에 따른 초음파 특성 연구)

  • 강길호;최원종;박상윤
    • Composites Research
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    • v.16 no.6
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    • pp.33-40
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    • 2003
  • The initial thermal degradation of polymer matrix composite is not observed easily. At the beginning of thermal degradation of polymer matrix composites, phase transformation such as chain scission, oxidation occur, and then micro delamination is produced in matrix and interface between matrix and fiber before blistering. Initial heat damage deteriorate mechanical properties of composites. We presented the detection method of the initial heat damage of composites conveniently using ultrasonic technique. Absorption coefficient and material velocity was measured with thermal degradation and degree of cure. The more thermal degradation was progressed, the more absorption coefficient was increased. When the cure temperature is more high, the absorption coefficient of cured composite is increased and material velocity is decreased. We concluded that cure temperature is more high, the defects such as void is increased and molecular structure cured at high temperature has cross-linking structure which is more absorb the ultrasonic waves.

Effects of Foaming Temperature and Carbon black Content on the Cure Behaviors and Foaming Characteristics of the Natural Rubber Foams (발포온도와 카본블랙 함량이 천연고무 발포체의 가황거동 및 발포특성에 미치는 영향)

  • Choi, Kyo-Chang;Kim, Joon-Hyung;Yoon, Jin-Min;Kim, Soo-Yeon
    • Elastomers and Composites
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    • v.41 no.3
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    • pp.147-156
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    • 2006
  • To investigate the influence of the foaming temperature and carbon black content on the cure behaviors and foaming characteristics of the foams. natural rubber (NR) was foamed at five temperature zones (145, 150, 155, 160 and $165^{\circ}C$) and different feeding ratios of the carbon black. A decreasing trend of the scorch time, $t_{s2}$ and cure time, $t_{90}$ was observed upon increasing foaming temperature and carbon black content. The optimal temperature for vulcanization and foaming of NRs in this study was considered to be $165^{\circ}C$ where density of the loomed NRs is lower than those at other four temperature regions. The rule rate index of the NRs foamed at $145^{\circ}C$ is smaller than those at 150, 155, 160 and $165^{\circ}C$. The results of the expansion ratio and micrographs of the foamed NRs were founded to support the density characteristics. The thickness of each of the struts formed inside the rubber matrix decreases with increasing the foaming temperature, while it increases with increasing the carbon black content.

Extension of Group Interaction Modelling to predict chemorheology of curing thermosets

  • Altmann, Nara;Halley, Peter J.;Nicholson, Timothy M.
    • Korea-Australia Rheology Journal
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    • v.21 no.2
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    • pp.91-102
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    • 2009
  • This paper describes an extension of viscoelastic Group Interaction Modelling (GIM) to predict the relaxation response of linear, branched and cross-linked structures. This model is incorporated into a Monte Carlo percolation grid simulation used to generate the topological structure during the isothermal cure of a gel, so enabling the chemorheological response to be predicted at any point during the cure. The model results are compared to experimental data for an epoxy-amine systems and good agreement is observed. The viscoelastic model predicts the same exponent power-law behaviour of the loss and storage moduli as a function of frequency and predicts the cross-over in the loss tangent at the percolation condition for gelation. The model also predicts the peak in the loss tangent which occurs when the glass transition temperature surpasses the isothermal cure temperature and the system vitrifies.