• Title/Summary/Keyword: cure systems

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Cure Kinetics of Self-Extinguishing Epoxy Resin Systems with Charge Transfer Complex Type Latent Catalyst for Semiconductor Encapsulation (전하전이착체형 잠재성 촉매를 사용한 반도체 성형용 자소성 에폭시 수지 시스템의 경화 반응속도 연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.13 no.4
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    • pp.27-32
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    • 2014
  • The cure properties of self-extinguishing epoxy resin systems with different charge transfer type latent catalysts were investigated, which are composed of YX4000H as a biphenyl epoxy resin, MEH-7800SS as a hardener, and charge transfer type latent catalysts. We designed and used five kinds of charge transfer type latent catalyst and compared to epoxy resin systems with Triphenylphosphine-Benzoquinone(TPP-BQ) as reference system. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The epoxy resin systems with Triphenylphosphine-Quinhydrone(TPP-QH), Triphenylphosphine-Benzanthrone(TPP-BT) and Triphenylphosphine-Anthrone(TPP-AT) as a charge transfer type latent catalyst showed a cure conversion rate of equal or higher rate than those with TPP-BQ. These systems with TPP-QH and Triphenylphosphine-Tetracyanoethylene(TPP-TCE) showed a critical cure reaction conversion of equal or higher conversion than those with TPP-BQ. The increases of cure conversion rates could be explained by the decrease of the activation energy of these epoxy resin systems. It can be considered that the increases of critical cure reaction conversion would be dependent on the crystallinity of the biphenyl epoxy resin systems.

Cure Properties of Isocyanurate Type Epoxy Resin Systems for FO-WLP (Fan Out-Wafer Level Package) Next Generation Semiconductor Packaging Materials (FO-WLP (Fan Out-Wafer Level Package) 차세대 반도체 Packaging용 Isocyanurate Type Epoxy Resin System의 경화특성연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.65-69
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    • 2019
  • The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials (새로운 반도체 Packaging용 Ethoxysilyl Bisphenol A Type Epoxy Resin System의 경화특성 연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.2
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    • pp.19-26
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    • 2017
  • The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

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Binary Cure Systems of 1,6-Bis(N,N'-dibenzylthiocarbamoyldithio)-hexane and Benzothiazole Sulfenamides in Carbon Black-filled Natural Rubber Compounds

  • Choi, Sung-Seen;Park, Byung-Ho;Lee, Seung-Goo;Kim, Beom-Tae
    • Bulletin of the Korean Chemical Society
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    • v.23 no.2
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    • pp.320-324
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    • 2002
  • Binary cure system is composed of different two cure accelerators, which can cause a synergy effect to delay the scorch time and to increase the cure rate. In this study, binary cure systems between 1,6-bis(N,N'-dibenzylthiocarbamoyldithio)-hexane (DBTH) and benzothiazole sulfenamides were investigated using carbon black-filled natural rubber compounds. N-Cyclohexyl-2-benzothiazole sulfenamide (CBS), N-tert-butyl-2-benzothiazole sulfenamide (TBBS), and 2-(morpholinothio) benzothiazole (MOR) were employed as benzothiazole sulfenamides. The binary cure systems show scorch safty at high temperature. The binary cure systems have faster cure rate and better reversion resistance than the single cure system of the benzothiazole sulfenamides. DBTH is found to be more effective to decrease the viscosity of a compound than the benzothiazole sulfenamides. Physical properties of the vulcanizates with the binary cure system are better than those of the vulcanizates with the single one.

Cure Characteristics of Naphthalene Type Epoxy Resins for SEMC (Sheet Epoxy Molding Compound) for WLP (Wafer Level Package) Application (WLP(Wafer Level Package)적용을 위한 SEMC(Sheet Epoxy Molding Compounds)용 Naphthalene Type Epoxy 수지의 경화특성연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.1
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    • pp.29-35
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    • 2020
  • The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

Cure Characteristics of Foaming EVA Compounds: Influence of EVA Types and Cure Systems

  • Choi, Sung-Seen;Bae, Jong Woo;Kim, Jung-Soo;Han, Dong-Hun
    • Elastomers and Composites
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    • v.51 no.3
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    • pp.212-217
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    • 2016
  • Influence of poly(ethylene-co-vinyl acetate) (EVA) types and cure systems on cure characteristics of foaming EVA compounds were investigated. Three kind EVAs with different VA contents were employed. Influence of triallyl cyanurate (TAC) and dicumylperoxide (DCP) content on the cure characteristics were examined. The minimum torque ($T_{min}$) and delta torque (${\Delta}T$) decreased as the VA content increased. The ${\Delta}T$ was increased by adding TAC and by increasing the DCP content. For the foaming EVA compounds without TAC, the cure times such as the minimum cure time ($t_{min}$), scorch time ($t_2$), and optimal cure time ($t_{90}$) did not show a specific trend according to the DCP contents. For the foaming EVA compounds containing TAC, the cure times decreased as the DCP content increased. From the experimental results, it was found that efficienct DCP/TAC ratio for improvement of the crosslink density was 1.1~2.0.

Thermal Aging Properties of NR Vulcanizates with Different Cure Systems (가교 시스템이 다른 NR 가황물의 열노화 특성)

  • Choi, Sung-Seen;Park, Byung-Ho
    • Elastomers and Composites
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    • v.40 no.3
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    • pp.181-187
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    • 2005
  • Changes of physical properties or NR vulcanizates with different cure systems by thermal aging were investigated. Two sulfur cure systems and one resole cure system were employed, and total contents of the curatives were varied. For the NR vulcanizates with sulfur cure systems, hardness and modulus after the thermal aging at $90^{\circ}C$ for 3 days were increased, but elongation at break and tensile strength were decreased. For the NR vulcanizates with resloe cure system, the physical properties after the thermal aging were decreased. The change of physical properties by the thermal aging was explained with the crosslink density change. The crosslink densities or the NR vulcanizates with sulfur cure systems were increased after the thermal aging, but those with resole cure system were decreased. Influence of the migration of antidegradant on the changes of physical properties was also investigated. However, the changes of physical properties by the thermal aging were not explained sufficiently with the migration of antigradant.

Influence of the Cure Systems on Long Time Thermal Aging Behaviors of NR Composites

  • Choi, Sung-Seen;Kim, Jong-Chul;Lee, Seung-Goo;Joo, Yong-L.
    • Macromolecular Research
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    • v.16 no.6
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    • pp.561-566
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    • 2008
  • NR composites with different curing systems were aged thermally at 60, 70, 80, and $90^{\circ}C$ for 2-185 days in a convection oven, and the changes in the crosslink density were investigated as a function of the accelerated thermal aging. The overall crosslink densities increased with increasing aging time irrespective of the aging temperatures and curing systems. The changes in crosslink density were enhanced by increasing the aging temperature. The degree of the increased crosslink density was in the following order: "the conventional cure system > the semi-EV system > the EV system". For short term thermal aging, the change in crosslink density with the aging time was complicated, particularly for low temperature aging. The activation energies of the change in crosslink density with thermal aging using the conventional and semi-EV cure systems increased and then remained relatively constant with increasing aging time, whereas that of the specimen with an EV cure system tended to increase linearly. The experimental results were explained by the dissociation of the existing polysulfidic linkages and the formation of new cross links through the crosslinking-related chemicals remaining in the sample.

Studies on the Crosslinking Density and Reinforcement of Rubber Compounds by Cure System (가황조건별 배합고무의 가교밀도와 고무보강성에 관한 연구)

  • Park, Nam-Cook;Lee, Seog
    • Elastomers and Composites
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    • v.33 no.5
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    • pp.315-323
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    • 1998
  • The purpose of this study was to investigate the crosslinking density and reinforcement of rubber compounds with various carbon black loadings, cure systems and cure temperatures. Bound rubber content increased with volume fraction of carbon black in rubber compounds, but total crosslinking density decreased with increasing the bound rubber content. Rate constant of cure reaction was changed significantly by cure system and cure temperature, especially it showed strong dependence on the cure temperature. High activation energys of cure reaction were shown in the rubber compound with high loading of carbon black under EC system and in the rubber compound with low loading of carbon black under CC system. High total crosslinking density of vulcanized compounds appeared in the rubber compound with low loading of carbon black and CC system among cure systems. Typical change of total crosslinking density by EC system was not shown. The highest elastic constant by Mooney-Rivlin equation was shown in the rubber compound with low loading of carbon black and SEC system. Modulus increased as increasing the loading of carbon black in the rubber compounds and showed the order of SEC, CC, and EC system for cure system.

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