• Korean Journal of Materials Research
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• v.8 no.9
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• pp.797-801
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• 1998

The cure kinetics for diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA) system with or without lOphr of phenyl glycidyl ether(PGE)-acetamide(AcAm) was studied by autocatalytic cure expression. On the dynamic DSC curves, the exothermic peak temperature and the onset temperature of reaction decreased with the addition of PGE-AcAm. Regardless of the addition of PGE-AcAm, the shape of the conversion curve showed sigmoid, and this meant that DGEBA/MDA and DGEBA/MDA/PGE-AcAm systems followed autocatalytic cure reaction. When PGE-AcAm was added to DGEBA/MDA system, the cure rate increased about 1.2~1.4 times due to the catalytic role of hydroxyl groups in PGE-AcAm.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.467-472
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• 1999

The isothermal cure behavior of diglycidyl ether of bisphenol A(DGEBA) 4,4'-methylene dianiline(MDA) system with various contents of neopentyl glycol(NPG) has been analyzed by differential scanning calorimetry(DSC). TO increase the cure rate of DGEBA/MDA system, NPG was introduced as an accelerator. Regardless of the NPG content, the shape of the conversion curves showed sigmoid indication that DGEBA/MDA/NPG system followed autocatalytic cure reaction. The cure reaction of DGEBA/MDA system increased with the increment of NPG content and it was due to the catalytic role of hydroxyl groups of NPG.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Elastomers and Composites
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• v.33 no.4
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• pp.274-280
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• 1998

Order of reaction, rate constant, activation energy for vulcanization reaction, crosslinking density, and elastic constant of the network produced by sulfur curing were investigated on the SBR/BR blends containing silica and carbon black under same cure system. The reaction order was shown to be first order regardless of filler types. The carbon black filled rubber compounds showed higher rate constant compared to silica filled compounds. But activation energy appeared to be same regardless of filler type and rubber blend ratio. The crosslinking density and elastic constant is higher in the carbon black filled compound compared to silica filled compounds because of strong interaction between rubber and carbon black. On the other hand, crosslinking density and elastic constant were decreased with increasing the butadine rubber content in rubber blends. From the comparison of combined sulfur content in the vulcanized rubber, sulfur content in the silica filled compound become constant 20min later after reaction initiates but sulfur content in the carbon black filled compound become constant 10min later after reaction starts. The silica compound has a longer induction time ($t_2$) and optimum cure time($t_{90}$) compared to those of the carbon black filled compound.

• Composites Research
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• v.35 no.4
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• pp.288-297
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• 2022

This study investigated the effect of addition of zirconia(zirconium oxide) powder on the curing behavior of phenolic resins. The heating rate controlled curing and isothermal curing behaviors of the phenol resin according to the content of the zirconia powder were analyzed. The viscosity and thermal decomposition characteristics of the phenolic resin with the zirconia content were also examind. From the DSC analysis, the degree of cure and the rate of cure were obtained. Finally, the activation energy for the cure reaction were calculated from the DSC data of the zirconia added phenolic resin. As a found, the higher the zirconia content, the longer the curing was delayed and the greater the activation energy required for curing. Additionally, the TGA result that as the content of zirconia increased, less weight loss was observed. The surface tackiness of the Carbon/Phenol prepreg was partially changed according to the zirconia content, but had no significant effect.

• Transactions on Electrical and Electronic Materials
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• v.13 no.4
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• pp.204-207
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• 2012

Epoxy nanocomposite was synthesized through the exfoliation of organoclay in an epoxy matrix, which was composed of diglycidyl ether of bisphenol A (DGEBA), 4,4'-methylene dianiline (MDA) and malononitrile (MN). Organoclay was prepared by treating the montmorillonite with octadecyl trimethyl ammonium bromide (ODTMA). The exfoliation of the organoclay was estimated by wide angle X-ray diffraction (WAXD) analysis. In order to measure the cure rate of DGEBA/MDA (30 phr)/MN (5 phr)/organoclay (3 phr), differential scanning calorimetry (DSC) analysis was performed at various heating rates, and the data were interpreted by Kissinger equation. Thermal degradation kinetics of the epoxy nanocomposite were studied by thermogravimetric analysis (TGA), and the data were introduced to the Ozawa equation. The activation energy for cure reaction was 45.8 kJ/mol, and the activation energy for thermal degradation was 143 kJ/mol.

• Korean Journal of Materials Research
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• v.9 no.4
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• pp.373-377
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• 1999

The cure mechanicsm and cure kinetics of diglycidyl ether of bisphenol A(DGEBA)/4,4'-methylene dianiline(MDA)/nitrile(MN, SN, GN) systems were studied by FT-IR and DSC to develop new applications in the biomedical polymer fields. The network structure of the DGEBA/MDA system was changed to the chain-extended network structure by the addition of nitriles. The reactions contributed to the chain extension were the primary amine-nitrile and hydroxyl-nitrile reactions. The chain-extended network structure could be indirectly proved by the decrement of T\ulcorner and the increment of impact strength with the increasing nitrile content. The cure rate of DGEBA/MDA/nitrile system was lower than that of DGEBA/MDA system due to the disturbance of nitrile group in the reaction of primary amine and epoxide groups.

• Journal of the Korean Society of Propulsion Engineers
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• v.20 no.1
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• pp.37-42
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• 2016

In this study, we examined the burning rate of the uncured propellant (with and without a curing agent application) in order to inspect the process of the HTPB solid propellant. The burning rate of the uncured propellant, that did not contain the curing agent, was approximately 9.7 mm/s at 1000 psi. In relation to the curing time, the burning rate was constant. The propellant, with the curing agent application, was approximately 8.1 mm/s showed a tendency of slowing as it burned. When the cure reaction rate was low, in accordance to the time, there were small changes in burn rate. However, when the cure reaction rate was high, the difference in burning rate was increased. The burning rate of a fully-cured propellant was approximately 6.8 mm/s, which appeared to be the lowest in order.

• Bulletin of the Korean Chemical Society
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• v.21 no.1
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• pp.61-64
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• 2000

FT-IR/ATR analysis shows that the oriental lacquer coating network degrades mostly in the unsaturated side chain. The rate of increase in carbonyl intensity (a measure of photodegradation) during the accelerated weathering test was substantially different for the unstabilized and stabilized samples; adding 2 wt% HALS into the oriental lacquer formulation enhanced photostabilization up to three times. Weight loss measurements, another indication of photodegradation, and SEM analysis support this conclusion. Despite the presence of the photo-stabilizer, the other properties of the lacquer were not significantly affected. In particular, the curing behavior of purified lacquer (PL) and HALS-stabilized samples is similar, although the in-situ DETA analysis showed that addition of HALS can slightly retard the cure reaction rate in oriental lacquer coating. It is hypothesized that this cure retardation may be related to the salt formation between HALS and acid of oriental lacquer.