• Applied Chemistry for Engineering
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• v.10 no.3
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• pp.419-426
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• 1999

In this study, the reaction rate constant, activation energy, total crosslinking density, elastic constant, cure properties ($t_5,\;t_{90}$), modulus, and abrasion resistance of rubber compounds were investigated as a function of cure temperatures, cure systems and reinforcing filler loadings. Reaction rate constants showed strong dependence on thc carbon black loading, cure temperature and cure system, and increased sharply with increasing the reaction temperatures. The lowest activation energy was obtained in the efficient cure (EC) system which corresponds to the high level of sulfur to accelerator ratio, and the activation energy was decreased with decreasing the carbon black loadings. The change of carbon black loadings directly affects the modulus and abrasion resistance, but the change of cure system showed various effects on the rubber compounds. Increased carbon black loadings showed the high modulus, improved abrasion resistance and short scorch time but decrease in crosslinking density and elastic constant. Higher crosslinking density and elastic constant were shown in the EC cure system regardless of carbon black loadings, but scorch timc ($t_5$) was not affected by the change of the ratio of sulfur to accelerator. Rapid optimum cure time ($t_{90}$) were showen in the EC cure system. Also, the equivalent cure curve coefficient of rubber compound was 0.96 for conventional cure (CC) system, and 0.94 for semi-efficient cure (SEC) and EC system regardless carbon black loadings. As regarding the abrasion resistance, wear volume showed the logarithmic increase for the loaded weight.

• Macromolecular Research
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• v.9 no.3
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• pp.157-163
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• 2001

The influences of carbon black loading and cure type on the cure characteristics including kinetics and dynamic mechanical properties were investigated for a styrene-butadiene rubber (SBR). The rate constants of accelerated sulfur vulcanization reaction at three different temperatures were determined using a cure rheometer, and they were compared with those from the direct measurement of sulfur concentration. The strain softening behavior under dynamic deformation, known as the Payne effect was also discussed depending on the carbon black loading and cure type.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.548-551
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• 1999

The cure characteristics of metal particle filled DGEBA/MDA/SN/ zeolite epoxy resin composite system for EMI shielding were investigated by dynamic DSC run method and FT-lR spectroscopy. As the heating rate increased, the peak temperature on dynamic DSC curve increased because of the rapid cure reaction. From the straight line of the Kissinger plot, the curing reaction activation energy and pre-exponential factor could be obtained. As the post-curing time at 15$0^{\circ}C$ increased, the glass increased the glass transition temperature or the thermal stability increased. When the post curing time is too long, the system filled with metallic Al particle can be thermally oxidized by the catalytic reaction of metal filler and the thermal stability of the composite for the EMI shielding application may be decreased.

• Bulletin of the Korean Chemical Society
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• v.18 no.11
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• pp.1199-1203
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• 1997

The investigation of cure kinetics of biphenyl epoxy (4,4-diglycidyloxy-3,3,5,5-tetramethyl biphenyl)-xylok resin system with four different catalysts was performed by differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP) and 1-benzyl-2-methylimidazole (1B2MI) as a catalyst proceeds through a first order kinetic mechanism, whereas that of the formulations using diazabicyloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP-TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used the semiempirical relationship proposed by Chern and Poehlein. By combining an nth order kinetic model or an autocatalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion.

• Macromolecular Research
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• v.17 no.2
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• pp.121-127
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• 2009

The cure kinetics of the epoxy-layered, silicate nanocomposites were studied by differential scanning calorimetry under isothermal and dynamic conditions. The materials used in this study were o-cresol novolac epoxy resin and phenol novolac hardener, with organically modified layered silicates. Various kinetic parameters, including the reaction order, activation energy, and kinetic rate constants, were investigated, and the storage stability of the epoxy-layered silicate nanocomposites was measured. To synthesize the epoxy-layered silicate nanocomposites, the phenolic hardener underwent pre-intercalation by layered silicate. From the cure kinetics analyses, the organically modified layered silicate decreased the activation energy during cure reaction in the epoxy/phenolic hardener system. In addition, the storage stability of the nanocomposite with the pre-intercalated phenolic hardener was significantly increased compared to that of the nanocomposite with direct mixing of epoxy, phenolic hardener, and layered silicate. This was due to the protective effect of the reaction between onium ions and epoxide groups.

• Design & Manufacturing
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• v.17 no.1
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• pp.1-5
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• 2023

In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Applied Chemistry for Engineering
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• v.5 no.4
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• pp.731-736
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• 1994

Cure kinetics of DGEBA/MDA/MN system with and without HQ were studied by Fractional life method and Kissinger equation. And the effect of HQ as a catalyst was studied. As cure temperature increased, the reaction rate increased and reaction order was almost constant. The activation energy of the system with HQ was lower about 13% and the reaction rate was higher than that of the system without HQ. It was because hydroxyl group of HQ formed a transition state with epoxide group and amine group and opened the epoxide ring easily and rapidly.

• Elastomers and Composites
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• v.33 no.5
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• pp.315-323
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• 1998

The purpose of this study was to investigate the crosslinking density and reinforcement of rubber compounds with various carbon black loadings, cure systems and cure temperatures. Bound rubber content increased with volume fraction of carbon black in rubber compounds, but total crosslinking density decreased with increasing the bound rubber content. Rate constant of cure reaction was changed significantly by cure system and cure temperature, especially it showed strong dependence on the cure temperature. High activation energys of cure reaction were shown in the rubber compound with high loading of carbon black under EC system and in the rubber compound with low loading of carbon black under CC system. High total crosslinking density of vulcanized compounds appeared in the rubber compound with low loading of carbon black and CC system among cure systems. Typical change of total crosslinking density by EC system was not shown. The highest elastic constant by Mooney-Rivlin equation was shown in the rubber compound with low loading of carbon black and SEC system. Modulus increased as increasing the loading of carbon black in the rubber compounds and showed the order of SEC, CC, and EC system for cure system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.134-137
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• 2001

The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of $160^{\circ}C ~220^{\circ}C$. The kinetic analysis was carried out by fitting dynamic/isothermal heating experimental data to the kinetic expressions to determine the reaction parameters, such as order of reaction and reaction constants. Diffusion-controlled reaction has been observed as the cure conversion increases and successfully analyzed by incorporating the diffusion control term into the rate equation. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperature.