• Title/Summary/Keyword: cross sectional method

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A method of optimum design based on reliability for antenna structures

  • Chen, Jianjun;Wang, Fanglin;Sun, Huaian;Zhang, Chijiang
    • Structural Engineering and Mechanics
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    • v.8 no.4
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    • pp.401-410
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    • 1999
  • A method of optimum design based on reliability for antenna structures is presented in this paper. By constructing the equivalent event, the formula is derived for calculating the reliability of reflector accuracy of antenna under the action of random wind load. The optimal model is developed, in which the cross sectional areas of member are treated as design variables, the structure weight as objective function, the reliability of reflector accuracy and the strength or stability of structural elements as constraints. The improved accelerated convergence gradient algorithm developed by the author is used. The design results show that the method in this paper is feasible and effective.

A variational asymptotic approach for thermoelastic analysis of composite beams

  • Wang, Qi;Yu, Wenbin
    • Advances in aircraft and spacecraft science
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    • v.1 no.1
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    • pp.93-123
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    • 2014
  • A variational asymptotic composite beam model has been developed for thermoelastic analysis. Composite beams, including sandwich structure and laminates, under different boundary conditions are examined. Previously developed beam model, which is based on variational-asymptotic method, is extended to incorporate temperature-dependent materials experiencing large temperature changes. The recovery relations have been derived so that the temperatures, heat fluxes, stresses, and strains can be recovered over the cross-section. The present theory is implemented into the computer program VABS (Variational Asymptotic Beam Sectional analysis). Numerical results are compared with the 3D analysis for the purpose of demonstrating advantages of the present theory and use of VABS.

A study onthe stability of a missile body ina simplified model by finite element method (유한요소법에 의한 단순화된 미사일 몸체 모델의 안정성에 관한 연구)

  • ;;Kim, Chan Soo
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.5 no.4
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    • pp.293-302
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    • 1981
  • In this paper, the stability of a flexible missle, idealized as a free-free beam, is evaluated by using the finite element method. For the study, heavy machinery part is modeled as a concentrated mass and the thrust, which is controlled by a feedback sensor located at a predetermined position, is considered as a constant follower force. The aerodynamic forces, the structural damping, the cross sectional variation servo lag effect are neglected in this study. With unconstrained variational principle, the finite element method is applied to the nondimensionalized beam eqution. The matrix eigenvalue equation is obtained and the eigenvalues are calculated by a computer for the stability analysis. The stability is evaluated by the inspection of the eigenvalues are calculated by a computer for the stabilith analysis. The stabilith is evaluated by the inspection of the eigenvalues of the problem. For the study, the behaviors of the eigenvalues at various thrusts and the effects of the magnitudes and positions of the concentrated mass and directional control constant are analyzed.

Preparation and Permeation Characteristics of Finely Porous Ultrafiltration Membranes by Phase Inversion Method (상전환법에 의한 미세다공성 한외여과막의 제조 및 투과특성)

  • 홍영기;배기서
    • Textile Coloration and Finishing
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    • v.15 no.2
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    • pp.68-75
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    • 2003
  • In this work, ultrafiltration(UF) membranes were prepared using polyethersulfone(PES). The polymer was dissolved in various solvent, such as N, N-dimethyl formamide(DMF), N,-dimethyl acetamide (DMAc), N,N-dimethyl sulfoxide(DMSO) and N-methyl-2- pynolidone(NMP). Each polymer solution was casted on the glass plate, and immersed into non-solvent bath. In this way finely porous UF membranes were prepared by phase inversion method. The cross sectional structure of PES membrane was asymmetric which was consist of sponge-like sublayer, finger-like toplayer, and active skin layer. From the solute rejection experiments, the molecular weight cut off of the prepared membrane in various solvent was evaluated 10,000 for DMF, 30,000 for DMAc, 50,000 for DMSO, and 10,000 for NMP respectively.

Impedance Tomography using Internal Current Density Distribution Measured by Nuclear Magnetic Resonance (자기공명촬영상에서 구한 내부 전류밀도를 이용한 임피던스 단층촬영법)

  • Lee, Su-Yeol;U, Eung-Je;Mun, Chi-Ung
    • Journal of Biomedical Engineering Research
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    • v.15 no.4
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    • pp.413-418
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    • 1994
  • In electrical impedance tomography (EIT), we use boundary current and voltage measurements to provide the information about the cross-sectional distribution of electrical impedance or resistivity One of the major problems in EIT has been the inaccessibility of internal voltage or current data in finding the internal impedance values. We propose a new image reconstruction method using internal current density data measured by NMR. We obtained a two-dimensional current density distribution within a phantom by processing the real and imaginary MR images from a 4.7T NMR machine. We implemented a resistivity image reconstruction algorithm using the finite element method and sensitivity matrix. We presented computer simulation results of the image reconstruction algorithm and furture direction of the research.

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Comparision of 3-D Geometrical Modelling of the Lumbar Spine Using Parameterized and Cross-sectional CT Image Reconstruction Method (요추에 있어서 파라미터 기법과 단면CT영상을 이용한 3차원 형상 모델링의 비교)

  • Kim, S.M.;Kim, S.J.;Tack, K.R.;Kim, N.H.
    • Proceedings of the KOSOMBE Conference
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    • v.1998 no.11
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    • pp.159-160
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    • 1998
  • In this study, a three-dimensional geometrical parameterized finite element modeling of the lumbar spine is compared with the 3-D reconstruction model from 2-D CT image. feasibility and accuracy of the parameterized modeling method is evaluated compared with conventional 3-D reconstruction method from 2-D CT image.

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Quantitative Evaluation Method for Etch Sidewall Profile of Through-Silicon Vias (TSVs)

  • Son, Seung-Nam;Hong, Sang Jeen
    • ETRI Journal
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    • v.36 no.4
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    • pp.617-624
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    • 2014
  • Through-silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as three-dimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo- and heterogeneous device integration. In TSV, a destructive cross-sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer-to-wafer variation in volume manufacturing.

Reflection Wave Property of Electromagnetic Radar according to Change of Depth and Thickness of Voids under Concrete Tunnel Lining (콘크리트 터널 라이닝 배면공동의 깊이 및 두께변화에 따른 전자파 레이더의 반사파 특성)

  • Park, Seok-Kyun
    • Proceedings of the Korea Concrete Institute Conference
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    • 2004.11a
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    • pp.789-792
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    • 2004
  • This study aims to detect only voids and estimate the cross-sectional size and thickness of voids using radar. A new method based on radar image processing is carried out with various void sizes and depths. The regression relationship between void size which has different depth and the amplitude characteristics of the radar return is considered in a new method of this research. For the purpose of examining; this regression relationship, experiments with change of void depth, surface area and thickness were carried out. Finally, the threshold value for image processing which aims to represent only voids to be fitted size (width) can be obtained. As the results, a proposed method in this study has a possibility of detecting only voids and estimating void size and thickness with good accuracy.

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Optimum Design of Truss on Sizing and Shape with Natural Frequency Constraints and Harmony Search Algorithm (하모니 서치 알고리즘과 고유진동수 제약조건에 의한 트러스의 단면과 형상 최적설계)

  • Kim, Bong-Ik;Kown, Jung-Hyun
    • Journal of Ocean Engineering and Technology
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    • v.27 no.5
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    • pp.36-42
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    • 2013
  • We present the optimum design for the cross-sectional(sizing) and shape optimization of truss structures with natural frequency constraints. The optimum design method used in this paper employs continuous design variables and the Harmony Search Algorithm(HSA). HSA is a meta-heuristic search method for global optimization problems. In this paper, HSA uses the method of random number selection in an update process, along with penalty parameters, to construct the initial harmony memory in order to improve the fitness in the initial and update processes. In examples, 10-bar and 72-bar trusses are optimized for sizing, and 37-bar bridge type truss and 52-bar(like dome) for sizing and shape. Four typical truss optimization examples are employed to demonstrate the availability of HSA for finding the minimum weight optimum truss with multiple natural frequency constraints.

A Study on a Splice Method of YBCO Coated Conductors with Curvature for HTS Magnet Application (고온초전도 마그넷 적용을 위한 YBCO Coated Conductor의 곡률 접합방법 연구)

  • Kim, Hyung-Jun;Jo, Hyun-Chul;Chang, Ki-Sung;Yang, Min-Kyu;Ahn, Min-Cheol;Ko, Tae-Kuk
    • Progress in Superconductivity and Cryogenics
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    • v.12 no.1
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    • pp.17-21
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    • 2010
  • In the case of designing superconducting power apparatuses using the second generation high temperature superconducting wire, it is necessary to have a tape-splicing technique to achieve low splice resistance between coated conductor (CC) tapes. In this paper, an experimental splice method between YBCO CC tapes is proposed for a coil application. Splices were performed with a 37Pb-63Sn solder. YBCO samples were fabricated with various pressures and cooling rates. Joint resistances of the spliced samples of jointed YBCO CC tapes were measured and evaluated from V-I curves. In addition, optical micrographs were obtained to analyze the cross sectional microstructure of jointed samples.