• Structural Engineering and Mechanics
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• v.34 no.3
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• pp.377-390
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• 2010

This paper studies fracture initiation direction of two parallel non-coplanar cracks of equal length. Using the dislocation pile-up modelling, singular integral equations for two parallel cracks subjected to mixed-mode loading are derived and the crack-tip field including singular and non-singular terms is obtained. The kinking angle is determined by using the maximum hoop stress criterion, or the ${\sigma}_{\theta}$-criterion. Results are presented for simple uniaxial tension and biaxial loading. The biaxiality ratio has a noticeable influence on crack growth direction. For the case of biaxial tension, when neglecting the T-stress the crack branching angle is overestimated for small crack inclination angles relative to the largest applied principal stress direction, and underestimated for large crack inclination angles.

• Structural Engineering and Mechanics
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• v.55 no.1
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• pp.93-109
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• 2015

Finite element analysis (FEA) combined with the concepts of linear elastic fracture mechanics (LEFM) provides a practical and convenient means to study the fracture and crack growth of materials. In this paper, a numerical modeling of crack propagation in the cement mantle of the reconstructed acetabulum is presented. This work is based on the implementation of the displacement extrapolation method (DEM) and the strain energy density (SED) theory in a finite element code. At each crack increment length, the kinking angle is evaluated as a function of stress intensity factors (SIFs). In this paper, we analyzed the mechanical behavior of cracks initiated in the cement mantle by evaluating the SIFs. The effect of the defect on the crack propagation path was highlighted.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.