• Title/Summary/Keyword: copper-containing

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Use of succimer as an alternative antidote in copper sulfate poisoning: A case report (황산구리 중독에서 대안 해독제로의 succimer 사용 1례)

  • Han, Sang Kyoon;Park, Sung Wook;Cho, Young Mo;Wang, Il Jae;Bae, Byung Kwan;Yeom, Seok Ran;Park, Soon Chang
    • Journal of The Korean Society of Clinical Toxicology
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    • v.19 no.1
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    • pp.59-63
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    • 2021
  • Copper sulfate is widely used as a fungicide and pesticide. Acute copper sulfate poisoning is rare but potentially lethal in severe cases. Copper sulfate can lead to cellular damage of red blood cells, hepatocytes, and myocytes. Toxic effects include intravascular hemolysis, acute tubular necrosis and, rhabdomyolysis. A 76-year-old man presented with vomiting and epigastric pain. He had ingested a copper-containing fungicide (about 13.5 g of copper sulfate) while attempting suicide 2 hours prior to presentation. From day 3 at the hospital, laboratory findings suggesting intravascular hemolysis were noted with increased serum creatinine level. He was treated with a chelating agent, dimercaptosuccinic acid (succimer). His anemia and acute kidney injury gradually resolved with a 19-day regimen of succimer. Our case suggests that succimer can be used for copper sulfate poisoning when other chelating agents are not available.

Effect of CeO2 Coating on the Grain Growth of Cu Particles (CeO2 코팅을 통한 Cu 입자의 입성장 억제 효과에 관한 연구)

  • Yoo Hee-Jun;Moon Ji-Woong;Oh You Keun;Moon Jooho;Hwang Hae Jin
    • Journal of Powder Materials
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    • v.12 no.6 s.53
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    • pp.413-421
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    • 2005
  • Copper is able to work as a current collector under wide range of hydrocarbon fuels without coking in Solid oxide fuel cells (SOFCs). The application of copper in SOFC is limited due to its low melting point, which result in coarsening the copper particle. This work focuses on the sintering of copper powder with ceria coating layer. Ceria-coated powder was prepared by thermal decomposition of urea in $Ce(NO_3)_3\cdot6H_2O$ solution, which containing CuO core particles. The ceria-coated powder was characterized by XRD, ICP, and SEM. The thermal stability of the ceria-coated copper in fuel atmosphere $(H_2)$ was observed by SEM. It was found that the ceria coating layer could effectively hinder the grain growth of the copper particles.

Movement Responses of Sludge Worm Tubifex tubifex (Annelida, Oligochaeta) in Three Different Copper Concentrations

  • Hyejin Kang;Mi-Jung Bae;Young-Seuk Park
    • Korean Journal of Ecology and Environment
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    • v.55 no.3
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    • pp.251-257
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    • 2022
  • Monitoring and assessing aquatic ecosystems using the behavior of organisms is essential for sustainable ecosystem management. Oligochaetes, which inhabit various freshwater ecosystems, are frequently used to evaluate the environmental conditions of freshwater ecosystems. Tubifex tubifex (Müller, 1774) (Oligochaeta, Tubificidae) is tolerant to organic pollution and has been used to evaluate the toxicity of toxicants, including heavy metals. We studied the behavioral responses of T. tubifex to three different copper concentrations (0.1, 0.5, and 1.0 mg L-1). The specimens were exposed to copper in an observation cage containing 150 mL of dechlorinated water. Movement behavior (diameter, speed, acceleration, meander, and turning rate) was continuously observed for two hours before and after the copper treatments. After the treatments, the diameter shrank and showed rapid twisting movement under all the copper conditions. The turning rate had a positive correlation with meander and acceleration both before and after treatment at all three concentrations, whereas speed and meander had a negative correlation. Length and turning rate also showed a negative correlation. The correlation coefficient between speed and acceleration in the highest copper concentration changed from positive before treatment (r=0.64) to negative (r= -0.52) after treatment. Our results present the possibility of using behavioral parameters to detect copper contamination in freshwater ecosystems.

A study on the removal of As, Sb, Bi from the copper sulfate solutions by Ion exchange resin containing Aminophosphosphonic acid as a functional group (황산동용액(黃酸銅溶液)에서 Aminophosphosphonic acid 관능기를 가진 이온교환수지에 의한 As, Sb, Bi 제거(除去)에 관한 연구(硏究))

  • Ahn, Jae-Woo;Seo, Jae-Seong
    • Resources Recycling
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    • v.21 no.5
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    • pp.50-57
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    • 2012
  • A comparative study has been carried out on the removal of impurities such As, Sb, Bi from the copper sulfate solution by ion exchange resin containing aminophosphosphonic acid as functional group. The various parameters which affect the removal of impurities; such as the reaction temperature, the reaction time, the amount of ion-exchange resins, the concentration of sulfuric acid in electrolyte, were studied. The basic experimental results showed that about 88% of Sb & 94% of Bi can be adsorbed in these chelate resins and removed from the copper sulfate solutions but As was removed below 10% from the solutions. And the selective elution of Bi and Sb from the adsorbed ion exchange resin also can be achieved by $H_2SO_4$ or HCl solutions. The results also showed that 98.1% of Sb and 96.6% of Bi can be adsorbed from the copper sulfate solutions after 2 Bed-volume of continuous ion exchange column test.

Preparation of Soft Etchant to Improve Adhesion Strength between Photoresist and Copper Layer in Copper Clad Laminates (CCL 표면과 포토리지스트와의 접착력 향상 위한 Soft 에칭액의 제조)

  • Lee, Soo;Moon, Sung-Jin
    • Journal of the Korean Applied Science and Technology
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    • v.32 no.3
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    • pp.512-521
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    • 2015
  • In this research, environmental friendly organic acid containing microetching system to improve adhesion strength between photoresist resin and Copper Clad Laminate(CCL) was developed without using strong oxidant $H_2O_2$. Etching rate and surface contamination on CCL were examined with various etching conditions with different etchants, organic acids and additives. to develope an optimum microetching condition. Etching solution with 0.04 M acetic acid showed the highest etching rate $0.4{\mu}m/min$. Etching solution with the higher concentration of APS showed the higher etching rate but surface contamination on CCL is very serious. In addition, stabilizer solution also played an important role to control the surface contamination. As a result of research, the etching solution containing 0.04 M of acetic acid, 0.1 M of APS with 4 g/L of stabilizer solution(ST-1) was best to improve adhesion between CCL and photoresist resin as well as showed the most clean and rough surface with the etching rate of $0.37{\mu}m/min$.