• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.632-638
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• 2021

With the copper interconnection in the semiconductor process, complex residues including copper oxide, fluoride, and polymeric fluorocarbon are formed by plasma etching. In this study, a cleaning solution was prepared with a component having an amine group (-NH₂) and a carboxyl group (-COOH), and the characteristics of removing post-etch residues in the copper wiring process were analyzed. In the cleaning solution containing an amine group, the length of the component substituted with nitrogen and the length of the carbon chain influenced the cleaning effect, and the etching rate of copper oxide increased as the pH of the cleaning solution increased. The activity of the amine group is in the basic region, and the activity of the carboxyl group is in the acidic region, and the cleaning process proceeds through complex formation with copper or copper oxide in each region.

• Bulletin of the Korean Chemical Society
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• v.30 no.10
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• pp.2467-2470
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• 2009

• Bulletin of the Korean Chemical Society
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• v.29 no.2
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• pp.511-514
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• 2008

• Bulletin of the Korean Chemical Society
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• v.33 no.7
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• pp.2381-2384
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• 2012

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.448-452
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• 2001

An Experimental study was carried out to develop a simple method of processing copper waste sludge which is produced by PBC manufacturing. The procedure is based on leaching of wet sludge in 2N H$_2$SO$_4$, and the solid / liquid ratio is controlled approximately at 1/10. The recovery of copper is 85.4%, and pH of the leachate is 3.20. Adding ammonia solution into leachate forms ammine, and hydroxide compounds derived from other impurities in leachate at pH 10. The hydroxide compound can be treated by ferrite process, and the product is a stable oxide compound. Then the ammine solution is heated to evaporate ammonia, and the copper hydroxide is formed. Heating at 8$0^{\circ}C$by aeration, copper hydroxide is transformed into copper oxide with a purity of 98.4%. This process can recover most copper from sludge and the residue can be stabilized by the formation of a stable oxide compound which is not hazardous to environment.

• Tribology and Lubricants
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• v.12 no.2
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• pp.32-40
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• 1996

The tribological role of copper alloy fine particles in an additive is not well known compared to solid lubricants such as $MoS_{2}$ and PTFE. In this experimental investigation, a series of friction and wear test was undertaken to gain a better understanding of an additive containing copper alloy fine particles and to identify the effectiveness of copper alloy particles in improving tribological performance of the lubricant. Friction and wear of specimens under lubricated contact condition were studied and the worn surfaces were characterized by AES (Auger Electron Spectroscopy), SEM (Scanning Electron Microscopy) and optical microscopy. It was revealed that a copper-contained layer was formed and this layer resulted in considerable reduction in both friction and wear due to its lubricity and anti-wear property. The analysis of worn surface revealed that copper of the fine alloy particles in the additive helps healing the worn surface by plating and filling wear pits.

• Journal of Powder Materials
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• v.17 no.4
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• pp.276-280
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• 2010

In the present work, ethylene glycol-based (EG) copper oxide nanofluids were synthesized by pulsed wire evaporation method. In order to explode the pure copper wire, high voltage of 23 kV was applied to the both ends of wire and argon/oxygen gas mixture was used as reactant gas. EG-based copper oxide nanofluids with different volume fraction were prepared by controlling explosion number of copper wire. From the transmission electron microscope (TEM) image, it was found that the copper oxide nanoparticles exhibited an average diameter about 100 nm with the oxide layer of 2~3 nm. The synthesized copper oxide consists of CuO/$Cu_2O$ phases and the Brunauer Emmett Teller (BET) surface area was estimated to be $6.86\;m^2\;g^{-1}$. From the analyses of thermal properties, it is suggested that viscosity and thermal conductivity of EG-based copper oxide nanofluids do not show temperature-dependent behavior over the range of 20 to $90^{\circ}C$. On the other hand, the viscosity and thermal conductivity of EG-based copper oxide nanofluids increase with volume fraction due to the active Brownian motion of the nanoparticles, i.e., nanoconvection.

• Membrane Journal
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• v.23 no.1
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• pp.92-99
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• 2013

In this study the nanofiltration (NF) membrane treatment of a sulfuric acid waste solutions containing copper ion ($Cu^{+2}$) discharging from the etching processes of the printed circuit board (PCB) manufacturing industry has been studied for the recycling of acid etching solution. SelRO MPS-34 4040 NF membrane from Koch company was tested to obtain the basic NF data for recycling of etching solution and separation efficiency (total rejection) of copper ion. NF experiments were carried out with a dead-end membrane filtration laboratory system. The pure water flux was increased with the increasing storage time in sulfuric acid solution and lowering pH of acid solution because of the enhancement of NF membrane damage by sulfuric acid. The permeate flux of acid solution was decreased with the increasing copper ion concentration. Total rejection of copper ion was decreased with the increasing storage time in sulfuric acid solution and copper ion concentration, and lowering the pH of acid solution. The total rejection of copper ion was decreased from initial 37% to 15% minimum value.

• Asian-Australasian Journal of Animal Sciences
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• v.9 no.4
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• pp.359-362
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• 1996

A study was conducted to assess the influence of copper on the total sulphur amino acid requirements of broiler chickens reared under two growing periods. The TSAA levels used were 0.73, 0.83, 0.93% with copper levels of 0, 125, 250 and 375 mg/kg for the starter period and the TSAA levels of 0.72, 0.79 and 0.86% with copper levels of 0, 125, 250 and 375 mg/kg for the grower period. Total feed consumption, body weight gain and feed L gain ratio were used as the parameters for the assessment. The results showed that adding copper at 250 mg/kg to the diets improved feed : gain ratio of the starter broilers and resulted in small improvement of body weight gain and feed : gain ratio of the grower broilers. Growth was depressed in relation to the reduction of feed intake on the chicks fed diet containing 375 mg/kg copper. There was a significant interaction between dietary TSAA and copper levels for feed intake, hence, indicating that the supplementation of copper at the level of 375 mg/kg increased the TSAA requirement of the starter broilers, although no interference with the requirement of grower broilers.

• Korean Journal of Microbiology
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• v.11 no.3
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• pp.109-114
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• 1973

It is well known that the ornithine-containing lipids were separated and identified from the other lipids of Rhodopseudomonas spheroides, Rhodospirillum, and Thiobacillus thiooxidans. An ornithine-containing lipid that lacks phosphorus and glycerol has been observed in Ferrobacillus ferrooxidans which was isolated from dalsung copper mine in Korea. The aminolipid was extracted from F.ferrooxidans and furthr purified by thin layer chromatography, and the product was identified as an ornithine-containing lipid by paper and liquid chromatography respectively.