• Journal of the Korean Ceramic Society
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• v.49 no.5
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• pp.417-422
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• 2012

Copper nano particles have been considered as the materials for conductive ink due to its good thermal, electrical conductivity and low cost. However, copper nanoparticles oxidize easily, decreasing dispersion stability and electrical conductivity. Therefore, it is important to develop a method to minimize oxidation of copper nano particles to improve its dispersion stability property in copper nano ink. In this study, copper nano particles were coated with 1-Octanethiol VSAM(Vaporized Self Assembled Multilayers) to prevent oxidation and coated copper powders were dispersed in conductive ink successfully by studying its relationship of different chain length of solvents to 1-Octanethiol coating layer to fabricate nano ink. Various alcohol solvents, such as 1-Hexanol, 1-Octanol, and 1-Decanol were used. The coating layer was observed using FESEM and TEM. Furthermore, dispersion of copper nano particles in nano inks, was characterized using Turbiscan analyzer, viscometer, and contact angle measurement tool.

• Journal of Powder Materials
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• v.22 no.1
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• pp.6-9
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• 2015

In this study, the behavior of densification of copper powders during high-pressure torsion (HPT) at room temperature is investigated using the finite element method. The simulation results show that the center of the workpiece is the first to reach the true density of copper during the compressive stage because the pressure is higher at the center than the periphery. Subsequently, whole workpiece reaches true density after compression due to the high pressure. In addition, the effective strain is increased along the radius during torsional stage. After one rotation, the periphery shows that the effective strain is increased up to 25, which is extensive deformation. These high pressure and severe strain do not only play a key role in consolidation of copper powders but also make the matrix harder by grain refinement.

• Journal of Powder Materials
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• v.4 no.2
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• pp.106-112
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• 1997

$Cu-Al_20_3 $ composite powders were prepared by hydrogen reduction of $Cu^{2+}$ from ammoniacal copper sulfate solution on alumina core using autoclave. The copper reduction rate and the properties of copper layer were investigated using Scanning Electron Microscope(SEM), X-ray diffractometer, size and chemical analyzers. The reduction rate of $Cu^{2+}$ showed the maximum value when the molar ratio of [$NH_3$]/[$Cu^{2+}$] was 2. In order to prevent the agglomeration of Cu powder and ethane reduction rate, $Fe^{2+}$ and anthraquinone which act as catalysis were added in the solution. Catalysis was effectively chanced with the addition of two elemerts at a time. Optimum conditions obtained in this study were hydrogen reduction temperature of 205$^{\cire}C$, stirring speed of 500 rpm and hydrogen partial pressure of 300 psi. Obtained $Cu-Al_20_3 $ composite Powders were found to have the uniform and continuous copper coating layer of nodule shape with 3~5 $\mu$m thickness.

• Transactions of the Korean hydrogen and new energy society
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• v.3 no.2
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• pp.9-15
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• 1992

Electroless copper plating method using an alkaline bath have been employed in copper coating of the (LM)Ni4.5Co0.1MnO.2A10.2 hydrogen storage alloy powders for electrode preparation. The plating were conducted without any pretreatment of alloy powders. For the preparation of the electrodes, about 0.12g of the copper coated alloy powder (copper to alloy ratio 1/3 by weight) was compacted with pressure of 6 tons/cm2 at room temperature. The disk-type compacts had a diameter of 10mm and thickness of about 0.24mm. The electrode characteristics were examined through SEM observations and electrochemical measurements in a half cell. The electrochemical measurement showed that the maximum discharge capacity of the electrodes prepared by using alkaline bath were 245mAh per gram of coated alloy (327mAh per gram of alloy) and appeared a considerable degradation with increasing number of cycles. The decrease of the discharge capacity after 100 cycles was about 30% It can be suggested that, with a slight of improvement, this electroless copper plating method could be applied to the preparation of the rare earth-nickel based alloy electrode.

• Korean Chemical Engineering Research
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• v.45 no.6
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• pp.560-565
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• 2007

Copper fine particles, ranging from $0.11{\mu}m$ to $0.64{\mu}m$ in average size, were prepared by a chemical reduction method using hydrazine ($N_2H_4$) as a reduction agent in waste copper solutions. The effect of the amount of hydrazine addition was investigated on the properties of the obtained powders. Also, the effect of the addition of dispersing agents [Polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP)] during particle synthesis was studied. The powders, obtained from 1 M waste copper solutions, showed the mixtures of Cu and $Cu_2O$ crystals at low hydrazine addition amounts of 0.8 mol and 1.0 mol, while those exhibited pure Cu crystals at adequate hydrazine addition amount of 0.12 mol. The average size of the Cu powders decreased with increasing the concentrations of hydrazine and dispersing agents. The addition of PVA to the solutions as a dispersing agent was more effective than that of PVP in preventing the aggregation of particles.

• Journal of Powder Materials
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• v.21 no.3
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• pp.207-214
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• 2014

In this study, nano-scale copper powders were reduction treated in a hydrogen atmosphere at the relatively high temperature of $350^{\circ}C$ in order to eliminate surface oxide layers, which are the main obstacles for fabricating a nano/ultrafine grained bulk parts from the nano-scale powders. The changes in composition and microstructure before and after the hydrogen reduction treatment were evaluated by analyzing X-ray diffraction (XRD) line profile patterns using the convolutional multiple whole profile (CMWP) procedure. In order to confirm the result from the XRD line profile analysis, transmitted electron microscope observations were performed on the specimen of the hydrogen reduction treated powders fabricated using a focused ion beam process. A quasi-statically compacted specimen from the nano-scale powders was produced and Vickers micro-hardness was measured to verify the potential of the powders as the basis for a bulk nano/ultrafine grained material. Although the bonding between particles and the growth in size of the particles occurred, crystallites retained their nano-scale size evaluated using the XRD results. The hardness results demonstrate the usefulness of the powders for a nano/ultrafine grained material, once a good consolidation of powders is achieved.

• Journal of Powder Materials
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• v.21 no.1
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• pp.39-43
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• 2014

Bulk nanostructured copper was fabricated by a shock compaction method using the planar shock wave generated by a single gas gun system. Nano sized powders, average diameter of 100 nm, were compacted into the capsule and target die, which were designed to eliminate the effect of undesired shock wave, and then impacted with an aluminum alloy target at 400 m/s. Microstructure and mechanical properties of the shock compact specimen were analyzed using an optical microscope (OM), scanning electron microscope (SEM), and micro indentation. Hardness results showed low values (approximately 45~80 Hv) similar or slightly higher than those of conventional coarse grained commercial purity copper. This result indicates the poor quality of bonding between particles. Images from OM and SEM also confirmed that no strong bonding was achieved between them due to the insufficient energy and surface oxygen layer of the powders.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.474-475
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• 2007

Wire electrical explosion(WEE) has been used for the production of fine metal particles. In WEE, electrical powder was stored and compressed into capacitor and released to produce fine particles through evaporation and condensation. In this study, the effect of applied voltage on the size of copper powders was investigated. High tension was added up to the explosion device by dividing 4 steps. At voltages lower than 5.2 kV, the fraction of powders finer than $44{\mu}m$ was almost negligible. The effectiveness of explosion increased sharply with increased voltage over 5.8 kV. At the highest voltage of 6.4 kV, more than 80% of explosion products were finer than $44{\mu}m$.

• Journal of Powder Materials
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• v.18 no.6
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• pp.546-551
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• 2011

Ag spot-coated Cu nanopowders were synthesized by a hydrothermal-attachment method (HA) using oleic acid capped Ag hydrosol. Cu nano powders were synthesized by pulsed wire exploding method using 0.4 mm in diameter of Cu wire (purity 99.9%). Synthesized Cu nano powders are seen with comparatively spherical shape having range in 50 nm to 150 nm in diameter. The oleic acid capped Ag hydrosol was synthesized by the precipitation-redispersion method. Oleic acid capped Ag nano particles showed the narrow size distribution and their particle size were less than 20 nm in diameter. In the case of nano Ag-spot coated Cu powders, nanosized Ag particles were adhered in the copper surface by HAA method. The components of C, O and Ag were distributed on the surface of copper powder.

• Journal of the Korean Ceramic Society
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• v.35 no.7
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• pp.749-756
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• 1998

TiC-Ni and TiC-Ni-Mo cermet powders were produced by Self-propagating High temperature Synthesis (SHS) process. The cooling rate of synthesized powders were controlled by using the V-shaped copper jig and the carbide size decreased with increasing the cooling rate I. e decreasing the width of copper jig Round shape carbide particles were produced after SHS reaction in TiC-Ni as well as TiC-Ni-Mo powders. Local segregation of Mo rich phases was observed in SHS powder of TiC-Ni-Mo and the uneven dis-triobution of Mo promoted the faster growth rate of carbide particles during sintering compared to the same composition specimen with commercial TiC powder. Howogeneous microstructure of TiC-Ni-Mo cermet was obtained when the elemental Mo powder was mixed with the SHS powder of TiC-Ni.