• Korean Journal of Metals and Materials
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• v.48 no.3
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• pp.218-224
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• 2010

Direct copper electroplating on Mg alloy AZ31B was carried out in a traditional pyrophosphate copper bath containing potassium fluoride. Electrochemical impedance spectroscopy and polarization methods were used to study the effects of added potassium fluoride on electrochemical behavior. The chemical state of magnesium alloy in the electroplating bath was analyzed by X-ray photoelectron spectroscopy. Adhesion of the copper electroplated layer was also tested. Due to the added potassium fluoride, a magnesium fluoride film was formed in the pyrophosphate copper bath. This fluoride film inhibits dissolution of Mg alloy and enables to electroplate copper directly on it. A dense copper layer was formed on the Mg alloy. Moreover, this copper layer has a good adhesion with Mg alloy substrate.

• Journal of the Korean institute of surface engineering
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• v.48 no.1
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• pp.1-6
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• 2015

Amino-carboxyl acid as a complexing agent in acid copper sulfate solution was utilized to improve the adhesion of immersion copper layer for steel wire. According to the tape test results, regardless of alloy composition of the wire, the adhesion of immersion copper layer was improved with the addition of amino-carboxyl acid. The incorporation of H and Fe in the plating layer was analyzed by TOF-SIMS. The H and Fe were detected at the entire coating layer without any addition of amino-carboxyl acid. However, with addition of amino-carboxyl acid, the H and Fe were scarcely detected at the coating layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.7
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• pp.622-626
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• 2003

We report the electrical properties of organic light emitting diodes (OLEDs) depending on the crystal structure of hole injection layer of copper(II)-phthalocyanine(CuPc) and the light irradiation the carrier mobility of copper(II)-phthalocyanine(CuPc) of light source. OLEDs were constructed with indium tin oxide(ITO)/CuPc/triphenyl-diamin(TPD)/tris-(8-hydroxyquinoline)aluminum(Alq$_3$)/Al.Photocurrent multiplication of OLEDs was varied by the heat-treatment condition of CuPc thin film and the light irradiation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.2
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• pp.38-43
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• 2019

Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.21-24
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• 1998

The properties of ZrN layer deposited by Sputtering system have been investigated in the application of diffusion barrier layer to copper. ZrN layer exhibited a excellent barrier property up to $700^{\circ}$ and higher resistivity. If an excess $O_2$is protected during the process of ZrN deposition, ZrN layer will be possible to use a diffusion barrier layer to copper.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.163-163
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• 2015

본 연구는 금속 캐리어 소재상에 화학 동도금(Chemical Copper)으로 형성된 극박 동박 표면 및 석출막의 특성을 평가하기 위하여 다양한 진공 분석장비들을 활용하여 평가한 결과이다. 연구에 사용된 극박 동박은 현재 캐리어박 선점률이 높은 M, J, Y사의 제품이다. 최상층 구리 표면에서 조직, 조성, 표면조도를 평가하였고, 계면 평가에서는 copper layer 및 nodule layer, adhesion layer, anti-corrosion layer, release layer, substrate에서의 물성 및 특성 정밀평가 결과 각 특성치 및 구조는 Cr, Zn, Ni, Co, Cr계 thermal anti layer임의 확인이 가능하였다.

• Polymer(Korea)
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• v.33 no.6
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• pp.525-529
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• 2009

In order to manufacture 2-layer flexible copper clad laminate (FCCL) s having the excellent performance high adhesion properties between copper foil and polyimide film are required. Silane coupling agents with specific functional groups as an adhesion promoter are generally used to enhance the adhesion. In our study, we synthesized a novel silane coupling agent for increasing the adhesive property between copper layer and polyimide layer. The surface morphology of rolled copper foil, as a function of the concentrations of the coated silane coupling agent, was fully characterized. As fabricated 2-layer FCCL, we observed that adhesive properties were changed by the surface morphology and we confirmed that the novel silane coupling agent affects adhesive properties in FCCL with two types of poly (amic acid)s.

• Korean Journal of Materials Research
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• v.21 no.5
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

• Journal of Korea Foundry Society
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• v.14 no.6
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• pp.558-565
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• 1994

The horizontal continuous casting process with the heated mold was applied to obtain the unidirectionally solidified rods($4{\sim}8mm$ dia.) of pure copper with good surface quality. The results could be summarized as follows. 1. The unidirectional solidification of pure copper rods with good surface(mirror surface) quality could be obtained by placing the S/L interface inside the heated mold cavity even though the cast copper rods were covered with thin copper oxide layer. 2. The casting speed for 4mm dia. rods with mirror surfaces was affected significantly by the mold-cooler distance rather than the cooling flow rate when other casting conditions were fixed. 3. The casting speed was the main factor affecting the oxidation of copper during the continuous casting and the thickness of copper oxide layer decreased almost linearly as the casting speed increased.

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.6-9
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• 1996

The Joining of copper rod and zirconia tube was carried out in Ar gas atmosphere. There are two type of the joining. The one is the reaction bond consisting of Cu and zirconia was dominated by surface reaction wi th a undetctable very thin layer. It was found that copper elements were diffused to zirconia side, but that most of Z $r^{4+}$ ions were not diffused to copper side. This result means application of a DC voltage to migrate oxygen to the copper/zirconia interface can oxidize metal at the copper /zirconia interface, and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result means application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cr.