• 제목/요약/키워드: copper electrode

검색결과 377건 처리시간 0.025초

Corrosion Performance of Cu Bonded Grounding-Electrode by Accelerated Corrosion Test

  • Choi, Sun Kyu;Kim, Kyung Chul
    • Corrosion Science and Technology
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    • 제17권5호
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    • pp.211-217
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    • 2018
  • Natural degradation of grounding-electrode in soil environment should be monitored for several decades to predict the lifetime of the grounding electrode for efficient application and management. However, long-term studies for such electrodes have many practical limitations. The conventional accelerated corrosion test is unsuitable for such studies because simulated soil corrosion process cannot represent the actual soil environment. A preliminary experiment of accelerated corrosion test was conducted using existing test standards. The accelerated corrosion test that reflects the actual soil environment has been developed to evaluate corrosion performances of grounding-electrodes in a short period. Several test conditions with different chamber temperatures and salt spray were used to imitate actual field conditions based on ASTM B162, ASTM B117, and ISO 14993 standards. Accelerated degradation specimens of copper-bonded electrodes were made by the facile method and their corrosion performances were investigated. Their corrosion rates were calculated to $0.042{\mu}m/day$, $0.316{\mu}m/day$, and $0.11{\mu}m/day$, respectively. These results indicate that accelerated deterioration of grounding materials can be determined in a short period by using cyclic test condition with salt spray temperature of $50^{\circ}C$.

전극선 성분 변화에 따른 냉간금형용강의 와이어방전가공 특성 (Characteristics of Wire EDM for Cold Die Steel due to the Different Wire Electrode Component)

  • 왕덕현;정순성
    • 한국기계가공학회지
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    • 제2권2호
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    • pp.98-105
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    • 2003
  • In the experimental study, wire EDM was conducted for cold die steel by changing the Wire electrode, peak discharge current and number of finish cut. From the micro structure analysis of SEM photographs, the size of irregular welded and added component on the EDMed surface is decreasing and size of EDMed plane surface is increasing as the decreasing peak current and increasing number of finish cut. From the analysis of coating effect, Zn component is highly contained in Br and Zn Wire EDMed surface and copper component is highly contained in Br and Al wire EDMed surface. Hardness values are Increasing as the increasing peak current and decreasing the number of finish cut The value of hardness is decreasing as Cu, Al, Zn and Br wire electrode because of the residual austenite effect of solid solution copper on solidification, and finally EDMed surface has the highest hardness values for every wire electrode. Yield strength values becomes larger and bending strength values become smaller due to the increasing the hardness. These results are increased as increasing brittleness with hardness.

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초정밀 반도체 금형 제작을 위한 슈퍼드릴 방전가공기 전극가이드 개발과 미세홀 방전가공 (Development of Electrode Guide of Super-drill EDM and Electrical Discharge Machining of Small Hole for High Precision Semiconductor Die)

  • 박찬해;김종업;왕덕현;김원일
    • 한국기계가공학회지
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    • 제4권3호
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    • pp.32-38
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    • 2005
  • Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the electrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1mm to 3.0mm with the error of from 0.02mm to 0.12mm. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.

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구리 집전판에 직접 합성한 탄소나노튜브의 전기이중층 커패시터 특성 (Characterization of Electric Double-Layer Capacitors with Carbon Nanotubes Directly Synthesized on a Copper Plate as a Current Collector)

  • 정동원;이창수;박순;오은석
    • 대한금속재료학회지
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    • 제49권5호
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    • pp.419-424
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    • 2011
  • Carbon nanotubes (CNTs) were directly synthesized on a copper (Cu) plate as a current collector by the catalytic thermal vapor deposition method for an electric double-layer capacitor (EDLC) electrode. The diameters of vertically aligned CNTs grown on the Cu plate were 20~30 nm. From cyclic voltammetry (CV) results, the CNTs/Cu electrode showed high specific capacitance with typical profiles of EDLCs. Rectangularshaped CV curves suggested that the CNTs/Cu electrode could be an excellent candidate for an EDLC electrode. The specific capacitances were in a range of 25~75 F/g with a scan rate of 10~100 mV/s and KOH electrolyte concentration 1~6 M, and were maintained up to 1000 charge/discharge cycles due to strong adhesion between the Cu substrate and the CNTs.

PECVD법으로 구리 막 위에 증착된 실리콘 박막의 이차전지 음전극으로서의 전기화학적 특성 (Electrochemical Characteristics of the Silicon Thin Films on Copper Foil Prepared by PECVD for the Negative Electrodes for Lithium ion Rechargeable Battery)

  • 심흥택;전법주;변동진;이중기
    • 전기화학회지
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    • 제7권4호
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    • pp.173-178
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    • 2004
  • 플라즈마 화학 기상 증착법으로 구리 막$(foil,\;35{\mu}m)$표면 위에 $SiH_4$와 Ar혼합가스를 공급하여 실리콘 박막을 증착 한 후 리튬 이온전지의 음극으로 활용하였다. 증착 온도에 따라 비정질 실리콘 박막과 copper silicide박막 형태의 다른 두 종류의 실리콘 박막 구조가 형성되는 것이 관찰되었다. $200^{\circ}C$ 이하의 온도에서는 비정질 실리콘 박막이 증착되었고, $400^{\circ}C$ 이상의 온도에서는 실리콘 라디칼과 확산된 구리 이온의 반응에 의한 그래뉼러 형태의 copper silicide박막이 형성되었다. 비정질 실리콘 박막은 copper silicide박막 보다 높은 용량을 나타냈으나 충·방전 반응에 의한 급격한 용량 손실을 나타냈다. 이것은 비정질 실리콘 박막의 부피 팽창에 의한 것으로 추정된다. 그러나 copper silicide 박막을 음극으로 사용했을 때는 copper silicide를 형성한 실리콘과 구리의 화학결합이 막 구조의 부피변화를 감소 시켜줄 뿐 아니라 낮은 전기 저항을 갖기 때문에 싸이클 특성이 향상되었다.

구리 나노 큐브를 전기 도금한 레이저 유도 그래핀 전극 기반의 글루코스 측정용 유연 센서 개발 (Development of Flexible Glucose Measurement Sensor Based on Copper Nanocubes Electroplated Laser Induced Graphene Electrode)

  • 김건종;김태헌;박정호
    • 전기학회논문지
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    • 제67권3호
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    • pp.413-418
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    • 2018
  • In this paper, we describe the development of a non-enzymatic glucose sensor based on copper nanocubes(Cu NCs) electroplated laser induced graphene(LIG) electrodes which can detect a certain range of glucose concentrations. $CO_2$ laser equipment was used to form LIG electrodes on the PI film. This fabrication method allows easy control of the LIG electrode size and shape. The Cu NCs were electrochemically deposited on the LIG electrodes to improve electron transfer rates and thus enhancing electrocatalytic reaction with glucose. The average sheet resistances before and after electroplating were $15.6{\Omega}/{\Box}$ and $19.6{\Omega}/{\Box}$, respectively, which confirmed that copper nanocubes were formed on the laser induced graphene electrodes. The prepared electrode was used to measure the current according to glucose concentration using an electrochemical method. The LIG electrodes with Cu NCs demonstrated a high degree of sensitivity ($1643.31{\mu}A/mM{\cdot}cm^2$), good stability with a linear response to glucose ranging from 0.05 mM to 1 mM concentration, and a limit of detection of 0.05 mM. In order to verify that these electrodes can be used as flexible devices, the electrodes were bent to $30^{\circ}$, $90^{\circ}$, and $180^{\circ}$ and cyclic voltammetry measurements were taken while the electrodes were bent. The measured data showed that the peak voltage was almost constant at 0.42 V and the signal was stable even in the flexed condition. Therefore, it is concluded that these electrodes can be used in flexible sensors for detecting glucose in the physiological sample like saliva, tear or sweat.

EDSA 프로그램을 이용한 배전계통에 사용되는 동봉 접지전극의 과도 접지임피던스 특성 (Transient Grounding Impedance Characteristics of a Copper Rod-type Grounding Electrode used for Electric Distribution Systems Using EDSA Program)

  • 김경철;오경훈;김민성;최종기;김동명
    • 조명전기설비학회논문지
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    • 제23권8호
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    • pp.26-32
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    • 2009
  • 접지시스템은 전기설비의 기준 전위점을 확보할 뿐만 아니라 대지에 낮은 저항으로 고장전류나 과도전류를 흐르게 한다. 주파수에 대한 함수로 접지 임피던스는 고장이나 과도전류가 넓은 범위의 주파수 성분을 포함하기 때문에 접지성능을 평가하는데 필요하다. 동봉은 배전계통에서 가장 많이 쓰이는 접지전극이다. 본 논문에서는 동봉의 접지 임피던스를 주파수 60[Hz] 에서 100[kHz] 범위까지 측정하여 등가 접지임피던스 모델을 구하였다. 뇌격서지가 유입되었을 때 EDSA 프로그램으로 과도접지임피던스의 수치와 파형을 시뮬레이션 하였다.

Effect of Surface Roughness, Thickness and Current Density on Surface Resistance of Electro-deposited Copper Layer

  • Kim, Y.M.;Cho, S.K.;Choi, Y.;Lee, J.Y.;Kim, M.
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2013년도 춘계학술대회 논문집
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    • pp.179-179
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    • 2013
  • Surface resistance of electro-deposited copper with its thickness, current density and surface roughness was determined by using a 4-point probe analyzer. The copper was prepared electrochemically on 316 stainless steel substrate in copper sulfate solution at the condition of $1A/dm^2$, 298 K, and 6.5 cm-electrode distance. The surface resistance of the copper sheet in the range of $0.93-0.97{\Omega}$ increased with the copper thickness in the range of $21-70{\mu}m$. The surface resistance in the range of $0.963-1.009{\Omega}$ also increased with current density in the range of $0.5-2A/dm^2$. The increased surface resistances corresponded to 11% for thickness and 25% for current density, respectively.

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Biomimetic Copper Complex Containing Polymer Modified Electrode for Electrocatalytic Reduction of Oxygen

  • Saravanakumar, D.;Nagarale, Rajaram Krishna;Jirimali, Harish Chandra;Lee, Jong Myung;Song, Jieun;Lee, Junghyun;Shin, Woonsup
    • Journal of Electrochemical Science and Technology
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    • 제7권4호
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    • pp.298-305
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    • 2016
  • The development of non-precious metal based electrocatalysts is highly desired for the oxygen reduction reaction (ORR) as alternates to noble metal based ORR electrocatalysts. Herein, we report mononulcear copper(II) complex $[CuLbpy]ClO_4$ (L=4-[(2-hydroxyphenylimino)methyl]benzoic acid) containing poly(allylamine.HCl) polymer (PAlACuLbpy) as an electrocatalyst for oxygen reduction reaction (ORR). PAlACuLbpy was mixed with poly(acrylic acid) and tetraethylortho silicate to prepare a composite and then deposited on the screen printed electrode surface. The modified electrode (PAlACuLbpy/PCE) is highly stable and showed a quasi-reversible redox behavior with $E_{1/2}=-0.2V$ vs. Ag/AgCl(3 M KCl) in 0.1 M phosphate buffer at pH 7 under argon atmosphere. PAlACuLbpy/PCE exhibited a remarkable ORR activity with an onset potential of -0.1 V vs Ag/AgCl in 0.1 M PB (pH 7) in the presence of oxygen. The kinetics for ORR was studied by rotating disk voltammetry in neutral aqueous medium and the results indicated that the number of electrons involving in the ORR is four and the conversion products are water and hydrogen peroxide.