• Title/Summary/Keyword: cooling pipes

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A Study on Automatic Sensing Device for Water Leakage of Cooling Pipe at Blast Furnace by Use The Electronic System (전자제어 장치를 이용한 용광로 냉각관 누수 지동 감지장치 개발에 관한 연구)

  • Kang, Chang-Soo;Kang, Ki-Seong
    • 전자공학회논문지 IE
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    • v.46 no.4
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    • pp.25-30
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    • 2009
  • The cooling water circulation pipes had been used to drop the temperature of refractory outside shell of blast furnace by cooling plate or stave type. They were attacked by surrounding CO gas and it was the cause that they were corroded and the water inflow in the refractory due to leakage of water. So, the life of refractory material was shorten and changed for the worse the conditions of blast furnace. The automatic sensing device for water leakage of cooling pipe was developed to check the position of trouble by use the micro-process system when cooling water leak and then CO gas will be inflowed into the cooling pipe at the leakage position. The inflowed CO gas will be detected in the micro-process system and delivered the detected position of cooling plate or stave to main control room through the wireless-radio relay station. This system can be possible to detect the position of cooling plate or stave the water leakage part immediately and then deliver the signal to main control room by use the micro-process system and wireless-radio relay station. This system will develop the working condition from manual system to unmanned auto alarm system.

Design and Thermal Analysis of Focal Plane Assembly Cooling Unit of Earth Observation Camera (저궤도 지구관측위성 주탑재체 냉각유닛 설계와 열해석)

  • Seo, Joung-Ki;Cho, Hee-Ken;Lee, Deog-Gyu;Lee, Seung-Hoon;Choi, Hae-Jin;Kang, Seok-Bong
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.37 no.6
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    • pp.580-585
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    • 2009
  • Thermal analysis and design of FPA(Focal Plane Assembly)-CU(Cooling Unit) for Earth observation camera is performed. FPA-CU is the first cooling device for a spacecraft which is designed and manufactured by its own technology in Korea. FPA-CU has a special feature, TBM(Thermal Buffer Mass) which is discriminated from typical cooling devices using heat pipes and radiator. TBM can be regarded as a thermal energy reservoir and it shows thermally transient characteristics, which make it difficult to design the size and shape of TBM. In current study, a method to determine the volume and the size of TBM is proposed and validated. The transient thermal analysis for FPA-CU for 5 operational scenarios is performed and validates the final design of FPA-CU (Radiator,TBM, Heat pipe I/F). In case of an abnormal operation of a heat pipe among three radiator heat pipes, the temperature of FPA can be increased $3{\sim}4^{\circ}C$ according to the numerical simulation.

Experiment and Analysis of the Residual Stress for Multipass Weld Pipes by the Neutron Diffraction Method

  • Kim S. H.;Lee J. H.
    • International Journal of Korean Welding Society
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    • v.5 no.1
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    • pp.1-9
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    • 2005
  • Multipass welds of 316L stainless steel have been widely employed to the pipes of Liquid Metal Reactors. Owing to localized heating and a subsequent rapid cooling by the welding process, residual stress arises in the weld of the pipe. In this study, the residual stresses in the 316L stainless steel pipe welds were calculated by the finite element method using the ANSYS code. Also, the residual stresses both on the surface and in the interior of the thickness were measured by the HRPD(High Resolution Powder Diffractometer) instrumented in the HANARO Reactor. The experimental data and the calculated results were compared and the characteristics of the distribution of the residual stress were discussed.

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A Study on the Operational Characteristics of a U-shape Heat Pipe (U형 히트파이프의 작동 특성에 관한 연구)

  • Gang, Hwan-Guk;Kim, Cheol-Ju;Lee, Yong-Su
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.25 no.12
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    • pp.1711-1720
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    • 2001
  • In this study, the heat transfer characteristics of a U-shape heat pipes were investigated. Heat is supplied to the U heat pipe through its middle zone(evaporator), and is released to the environment through its both arms(condensers). Both heat transfer coefficients and heat transport limitations were measured and compared with correlations previously developed for straight type heat pipes. Special concerns were focused to the cases, when each of condensers were submitted to a different cooling conditions, relatively. As a result. the heat transfer limitation of a U-shape heat pipe was found out to be 10∼15% less than the value for a straight heat pipe with an equivalent size.

A Study on the Design of the Automatic Cutting Mechanism of the Perforation Pipes in an Automobile Muffler (차량 소음기용 다공파이프 자동절단 메커니즘 설계에 관한 연구)

  • Kim, Yong-Seok;Jeong, Chan-Se;Yang, Soon-Young
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.3
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    • pp.350-356
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    • 2011
  • In this paper, we proposed the automatic cutting mechanism of the perforation pipes in an automobile muffler. This cutting mechanism makes continuous work possible, because it performs the batch work via the sequential operation of loading, feeding, cutting, and discharging. The proposed cutting mechanism consists of the frame unit, escape unit, turning unit, feeding unit, vision system, clamping unit, spindle/cutting unit and cooling unit. And, these mechanisms have been modularized through mechanical, dynamical and structural optimized design using the SMO (SimDesigner Motion) analysis module. Also, the virtual prototype was carried out using the 3-D CAD program. The cutting process cycle is performed in the order of loading, vision processing, feeding, clamping, cutting and discharging. And the cycle time for cutting one piece was designed to be completed in four seconds.

Construction Method and Control System of the Heat of Hydration for Inchon International Airport Elevated Road Way (인천국제공항 여객터미널 전면 고가 교량 공사 시공방법 및 수화열 대책)

  • 임채만;박명웅;조용기;조선규;김은겸
    • Proceedings of the Korea Concrete Institute Conference
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    • 1999.10a
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    • pp.869-881
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    • 1999
  • Inchon International Airport Elevated Road Way is located between the Passenger Terminal Building and Transportaion Center which are Inchon International Airport core construction projects. The deck of the bridge is consists of 5-span or 6-span continuous pre-stressed concrete slab. Steel form has been used to enhance the quality of texture on concrete slab. Steel form has been used to enhance the quality of texture on concrete surface, lower surface of deck slab with the two way arch has been manufactured by highly professional manner in order to get an beautiful exterior architectural looks. The prestressed concrete deck slab is mass concrete structures with a high-specified concrete strength and a varying section in the range of 0.95-2.8m thickness. Therefore high risks of thermal cracking occurrence by heat of hydration highly are expected. To resolve such problem, we adopted type 1 cement and pipe cooking method at construction site through mass concrete specimen test and 3-dimensional analysis. For Pipe cooling we used 25mm diameter stainless pipes with wrinkles. Cooling pipe with spacing 50-60cm has been installed. And continuous pipe cooling with cooling water of 15$^{\circ}C$ was conducted for 2days. In present 8 span of all 29 spans construction has been completed. No thermal cracking heat hydration has been observed yet.

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Heating and Cooling Performance Characteristics of Ground Source Heat Pump System Utilizing Building Structures as Heat Source and Sink (빌딩 구조체 활용 지열원 열펌프 시스템의 냉난방성능 특성)

  • Kim, Namtae;Choi, Jong Min;Sohn, Byonghu;Baek, Sung-Kwon;Lee, Dong-Chul;Yang, Hee-Jung
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.143.2-143.2
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    • 2011
  • Energy foundations and other thermo-active ground structure, energy wells, energy slab, and pavement heating and cooling represent an innovative technology that contributes to environmental protection and provides substantial long-term cost savings and minimized maintenance. This paper focuses on earth-contact concrete elements that are already required for structural reasons, but which simultaneously work as heat exchangers. Pipes, energy slabs, filled with a heat carrier fluid are installed under conventional structural elements, forming the primary circuit of a geothermal energy system. The natural ground temperature is used as a heat source in winter and heat sink in summer season. The system represented very high heating and cooling performance due to the stability of EWT from energy slab. Maximum heat pump unit COP and system COP were 4.9 and 4.3.

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ON-POWER DETECTION OF PIPE WALL-THINNED DEFECTS USING IR THERMOGRAPHY IN NPPS

  • Kim, Ju Hyun;Yoo, Kwae Hwan;Na, Man Gyun;Kim, Jin Weon;Kim, Kyeong Suk
    • Nuclear Engineering and Technology
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    • v.46 no.2
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    • pp.225-234
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    • 2014
  • Wall-thinned defects caused by accelerated corrosion due to fluid flow in the inner pipe appear in many structures of the secondary systems in nuclear power plants (NPPs) and are a major factor in degrading the integrity of pipes. Wall-thinned defects need to be managed not only when the NPP is under maintenance but also when the NPP is in normal operation. To this end, a test technique was developed in this study to detect such wall-thinned defects based on the temperature difference on the surface of a hot pipe using infrared (IR) thermography and a cooling device. Finite element analysis (FEA) was conducted to examine the tendency and experimental conditions for the cooling experiment. Based on the FEA results, the equipment was configured before the cooling experiment was conducted. The IR camera was then used to detect defects in the inner pipe of the pipe specimen that had artificially induced defects. The IR thermography developed in this study is expected to help resolve the issues related to the limitations of non-destructive inspection techniques that are currently conducted for NPP secondary systems and is expected to be very useful on the NPPs site.

A Study on Cooling Characteristics of Miniature Heat Pipes with Woven-Wired Wick (편조형 윅을 갖는 소형 히트파이프의 냉각특성에 관한 연구)

  • 문석환;김광수;최춘기
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.12 no.3
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    • pp.227-234
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    • 2000
  • An experimental study was performed for understanding the limiting power and heat transfer characteristics of an MHP having the diameter of 3 or 4 mm which could be applied to cooling of miniature electronic equipment such as the notebook PC CPU etc. The experimental parameters which are inclination, structure of the wick, the length of the condenser and the total heat pipe were considered. The MHP with a woven-wired wick has the advantages of the improvement in capillary limit, the effective attachment tightly toward wall and the convenience in construction of wick. Cooling performance of the present MHP was compared with that of MHP with grooved, fine fiber and sintered type wick which were applied by existing enterprises. With respect to the inclination of$ -5^{\circ}$ , an MHP having the diameter of 3 or 4 mm shows the limiting power of 6~14 W. Therefore, it is expected that the MHP of the present study has sufficient applicability of cooling of notebook PC of which the amount of heat generated is about 12 W.

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Heat Dissipation Trends in Semiconductors and Electronic Packaging (반도체 및 전자패키지의 방열기술 동향)

  • S.H. Moon;K.S. Choi;Y.S. Eom;H.G. Yun;J.H. Joo;G.M. Choi;J.H. Shin
    • Electronics and Telecommunications Trends
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    • v.38 no.6
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.