• Computers and Concrete
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• 제11권5호
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• pp.441-462
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• 2013

When using the conventional finite element method, a great number of grid nodes are necessary to describe the large and uneven temperature gradients in the concrete around cooling pipes when calculating the temperature field of mass concrete with cooling pipes. In this paper, the temperature gradient properties of the concrete around a pipe were studied. A new calculation method was developed based on these properties and an explicit iterative algorithm. With a small number of grid nodes, both the temperature distribution along the cooling pipe and the temperature field of the concrete around the water pipe can be correctly calculated with this new method. In conventional computing models, the cooling pipes are regarded as the third boundary condition when solving a model of concrete with plastic pipes, which is an approximate way. At the same time, the corresponding parameters have to be got by expensive experiments and inversion. But in the proposed method, the boundary condition is described strictly, and thus is more reliable and economical. And numerical examples were used to illustrate that this method is accurate, efficient and applicable to the actual engineering.

• 설비공학논문집
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• 제10권2호
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• pp.137-146
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• 1998

The experimental study is concerned with two-phase closed thermosyphons, (i.e., wickless heat pipes) for the cooling of high power electronic components in telecommunication system. The thermosyphon which can deal with a high heat flux of up to $4.9W/cm^2$ is developed, and the cooling characteristics of thermosyphon is analyzed according to design parameters which are the types of and quantity of working fluid, number of pipes, wire insertion in pipe, inclination angle of thermosyphon, and cooling air velocity. Using water as working fluid is superior cooling performance compared to using acetone, and cooling performance is improved as the number of thermosyphon becomes larger, inserting wires in the pipes, and inclination of $30~60^{\circ}$.

• 한국도로학회논문집
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• 제15권1호
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• pp.75-86
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• 2013

PURPOSES: The purpose of asphalt pavement reducing surface temperature by using Pipe cooling system is to make pleasant city life environment. METHODS: We considered building condition to lay the pipes under asphalt pavement and figured out that temperature reducing effect with pipe cooling system. In addition, we guessed rutting through wheel tracking test with a laid the pipes under asphalt mixture and performed fatigue cracking through a flexural fatigue test for performance evaluation of pipe cooling system. RESULTS: When pipe cooling system worked, the temperature of pavement model reduced quickly in test. The system can turn down the degree by 4 or 5 quickly as well. It didn't affect rutting to lay the pipes under the pavement, but it can get damaged to asphalt pavement in early stage by the result of performance evaluation. CONCLUSIONS: We figured out that pipe cooling system can turn down the temperature of aspalt pavement surface through tests. We suggest that pipe cooling system should be considered one of the effective way to solve urban heat island problem.

• Journal of Advanced Marine Engineering and Technology
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• 제32권4호
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• pp.563-569
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• 2008

During braking operation, the surfaces of disk have severe contact conditions and high frictional heat would be generated between disk and pad surfaces. The heat makes high temperature gradient on disk surfaces and results in thermal deformation. To enhance the frictional heat dissipation, heat pipes are embedded in the ventilated type disk along the radial direction. The temperatures of the inner vent type disk and the brake disk with heat pipes are compared at the same operating conditions. By comparison a brake disk with heat pipes has higher cooling performance than the inner vent type disk.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.315-316
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• 2006

The paper presents some results regarding the obtaining of some copper heat pipes with a porous copper internal layer for electronic components cooling. The heat pipes were realized by sintering of spherical copper powders of $90{\div}125\;{\mu}m$ size directly on the internal side of a copper pipe of 18 mm in diameter. The obtained pipes were then brazed in order to obtain a heat pipe of 0.5 m in length. After that, the heat pipe was sealed and filled with a small quantity of distilled water as working fluid. To establish the total heat transport coefficient and the thermal flow transferred at the evaporator, some external devices were realized to allow the heating of the evaporator and the cooling of the condenser. Water heat pipes are explored in the intermediate temperature range of 303 up to 500 K. Test data are reported for copper water heat pipe, which was tested under different orientations. The obtained results show that the water heat pipe has a good thermal transfer performance in the temperatures range between 345 and 463 K.

• 한국전산유체공학회지
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• 제21권2호
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• pp.90-98
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• 2016

A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of $240mm{\times}240mm{\times}20mm$, in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.

• 반도체디스플레이기술학회지
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• 제15권2호
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• pp.74-80
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• 2016

This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

• 생물환경조절학회지
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• 제7권3호
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• pp.237-245
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• 1998

극심한 고온으로 인해 정상적인 작물의 재배가 어려운 여름철의 온실 내 기온을 억제시키기 위한 방법 중 가장 효율을 인정받고 있는 증발냉각법은 실내 습도의 증가로 인해 그 사용에 제한을 받게 된다. 본 연구에서는 온실에서 증발냉각법의 냉방효율을 높이기 위한 방법으로 냉수파이프를 설치하여, 그 열적 특성을 분석하고, 제습효과를 조사하였으며, 그 결과를 요약하면 다음과 같다. 동파이프와 아연도금스틸파이프의 총열전달량을 비교한 결과, 동파이프가 다소 크게 나타났으나, 유의성이 없었으며, 두 가지 파이프 모두 이론값 보다 실측값이 더 작게 나타났다. 냉수파이프 표면에 응축되어 제거된 수증기의 양은 동파이프와 아연도금스틸파이프 사이에서 큰 차이를 보이지 않았으나, 두 가지 파이프 모두에서 제습효과는 충분히 큰 것으로 나타났다. 냉수파이프를 설치함으로써 증발냉각시스템의 냉방효율을 평균 48%만큼 높일수 있으며, 평균 1.3$^{\circ}C$만큼의 실내기온을 추가로 냉각시킬 수 있는 것으로 예측되었다. 또한, 냉수파이프를 이용해 증발냉각시스템의 가동으로 인한 실내의 과습문제를 해결하기 위해서는 파이프표면의 응축된 수분을 효과적으로 제거할 수 있는 장치나 방법에 대한 추가적인 연구가 필요할 것으로 판단된다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1999년도 봄 학술발표회 논문집(I)
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• pp.275-280
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• 1999

It was analysed the effect of pipe cooling as a measure to avoid thermal cracks due to the heat of hydration during the curing process of a massive prestressed concrete (PSC) slab. PSC slab has a complex three-dimensional shape of which the maximal and minimal thicknesses of cross-section were 2.8 and 0.95m, respectively. Steel pipes of which the diameter was 1 inch were employed for cooling. The horizontal and vertical distances between the contiguous pipes were 0.5 and 0.6m, respectively. One the four layers of cooling pipe were arranged according to the thickness of cross-section. Temperature distribution was calculated by the program developed by the authors, of which the accuracy was verified on a few published papers by the authors. Based on the temperature analysis of the cross-section which had four layers of cooing pipe, the maximum temperature of concrete interior was 54.2$^{\circ}C$ and the maximum differenced between the interior and surface temperatures of concrete was 14.$0^{\circ}C$ and, thereby, the thermal cracking index was 1.1. Upon the stress analysis, the thermal cracking index was 0.92 and the probability of thermal-crack development was 52%. Therefore, it was expected to make it possible to reduce the probability of thermal-crack development in a massive PSC slab by adopting pipe cooling.