• Title/Summary/Keyword: cooling pipes

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A new method solving the temperature field of concrete around cooling pipes

  • Zhu, Zhenyang;Qiang, Sheng;Chen, Weimin
    • Computers and Concrete
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    • v.11 no.5
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    • pp.441-462
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    • 2013
  • When using the conventional finite element method, a great number of grid nodes are necessary to describe the large and uneven temperature gradients in the concrete around cooling pipes when calculating the temperature field of mass concrete with cooling pipes. In this paper, the temperature gradient properties of the concrete around a pipe were studied. A new calculation method was developed based on these properties and an explicit iterative algorithm. With a small number of grid nodes, both the temperature distribution along the cooling pipe and the temperature field of the concrete around the water pipe can be correctly calculated with this new method. In conventional computing models, the cooling pipes are regarded as the third boundary condition when solving a model of concrete with plastic pipes, which is an approximate way. At the same time, the corresponding parameters have to be got by expensive experiments and inversion. But in the proposed method, the boundary condition is described strictly, and thus is more reliable and economical. And numerical examples were used to illustrate that this method is accurate, efficient and applicable to the actual engineering.

Experimental study on the cooling characteristics of thermosyphon for the high power electronic components (고발열 전자부품 냉각용 써모사이폰의 냉각특성에 관한 연구)

  • 김광수;김원태;송규섭;이기백
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.10 no.2
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    • pp.137-146
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    • 1998
  • The experimental study is concerned with two-phase closed thermosyphons, (i.e., wickless heat pipes) for the cooling of high power electronic components in telecommunication system. The thermosyphon which can deal with a high heat flux of up to $4.9W/cm^2$ is developed, and the cooling characteristics of thermosyphon is analyzed according to design parameters which are the types of and quantity of working fluid, number of pipes, wire insertion in pipe, inclination angle of thermosyphon, and cooling air velocity. Using water as working fluid is superior cooling performance compared to using acetone, and cooling performance is improved as the number of thermosyphon becomes larger, inserting wires in the pipes, and inclination of $30~60^{\circ}$.

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A Study of the Surface Temperature Reduction Using Pipe Cooling System in Asphalt Pavement (아스팔트 도로포장에 물순환 파이프 시스템을 이용한 표면온도저감에 관한 연구)

  • Yoon, Yong Kyu;Park, Kyung Won;Lee, Suk Keun
    • International Journal of Highway Engineering
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    • v.15 no.1
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    • pp.75-86
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    • 2013
  • PURPOSES: The purpose of asphalt pavement reducing surface temperature by using Pipe cooling system is to make pleasant city life environment. METHODS: We considered building condition to lay the pipes under asphalt pavement and figured out that temperature reducing effect with pipe cooling system. In addition, we guessed rutting through wheel tracking test with a laid the pipes under asphalt mixture and performed fatigue cracking through a flexural fatigue test for performance evaluation of pipe cooling system. RESULTS: When pipe cooling system worked, the temperature of pavement model reduced quickly in test. The system can turn down the degree by 4 or 5 quickly as well. It didn't affect rutting to lay the pipes under the pavement, but it can get damaged to asphalt pavement in early stage by the result of performance evaluation. CONCLUSIONS: We figured out that pipe cooling system can turn down the temperature of aspalt pavement surface through tests. We suggest that pipe cooling system should be considered one of the effective way to solve urban heat island problem.

A Study for the Cooling Performance of a Brake with Heat Pipes (히트 파이프를 장착한 디스크브레이크의 냉각 성능에 관한 연구)

  • Kim, Moo-Geun;Ko, Sung-Kyu;Lee, Moon-Wan
    • Journal of Advanced Marine Engineering and Technology
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    • v.32 no.4
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    • pp.563-569
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    • 2008
  • During braking operation, the surfaces of disk have severe contact conditions and high frictional heat would be generated between disk and pad surfaces. The heat makes high temperature gradient on disk surfaces and results in thermal deformation. To enhance the frictional heat dissipation, heat pipes are embedded in the ventilated type disk along the radial direction. The temperatures of the inner vent type disk and the brake disk with heat pipes are compared at the same operating conditions. By comparison a brake disk with heat pipes has higher cooling performance than the inner vent type disk.

Electronics Cooling Using the Porous Metallic Materials

  • Lucaci, Mariana;Orban, Radu L.;Lungu, Magdalena;Enescu, Elena;Gavriliu, Stefania
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.315-316
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    • 2006
  • The paper presents some results regarding the obtaining of some copper heat pipes with a porous copper internal layer for electronic components cooling. The heat pipes were realized by sintering of spherical copper powders of $90{\div}125\;{\mu}m$ size directly on the internal side of a copper pipe of 18 mm in diameter. The obtained pipes were then brazed in order to obtain a heat pipe of 0.5 m in length. After that, the heat pipe was sealed and filled with a small quantity of distilled water as working fluid. To establish the total heat transport coefficient and the thermal flow transferred at the evaporator, some external devices were realized to allow the heating of the evaporator and the cooling of the condenser. Water heat pipes are explored in the intermediate temperature range of 303 up to 500 K. Test data are reported for copper water heat pipe, which was tested under different orientations. The obtained results show that the water heat pipe has a good thermal transfer performance in the temperatures range between 345 and 463 K.

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A NUMERICAL STUDY ON THERMAL DESIGN OF A LARGE-AREA HOT PLATE FOR THERMAL NANOIMPRINT LITHOGRAPHY (나노임프린트 장비용 대면적 열판 열설계를 위한 수치 연구)

  • Park, G.J.;Lee, J.J.;Kwak, H.S.
    • Journal of computational fluids engineering
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    • v.21 no.2
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    • pp.90-98
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    • 2016
  • A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of $240mm{\times}240mm{\times}20mm$, in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.

Improvement of Temperature Uniformity in a Hot Plate for Thermal Nanoimprint Lithography by Installing Heat Pipes (히트 파이프를 이용한 열경화성 나노임프린트 장비용 열판의 온도 균일도 향상)

  • Park, Gyu Jin;Yang, Jin Oh;Lee, Jae Joong;Kwak, Ho Sang
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.2
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    • pp.74-80
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    • 2016
  • This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

Dehumidification and Evaporative Cooling Efficiency by Water Pipes in Greenhouse (냉수파이프에 의한 온실의 제습 및 증발냉각효율)

  • 김문기;남상운;윤남규
    • Journal of Bio-Environment Control
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    • v.7 no.3
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    • pp.237-245
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    • 1998
  • Greenhouse crop production under critical summer climate In Korea has considerable difficulties because of high temperature and relative humidity. In this study, some water pipes were tested as a means of the dehumidification and increment of evaporative cooling efficiency. As a result of heat transfer characteristic analysis, overall heat transfer coefficient of copper pipe was larger than steel pipe, and estimated values were smaller than measured values. The condensed quantities of vapor were not significantly different between copper pipe and steel pipe, however dehumidifying effect by the water pipes was significantly large. It was estimated based on the results that the evaporative cooling system by the water pipe will be able to increase the evaporative cooling efficiency of about 48%, and decrease the temperature of about 1.3$^{\circ}C$.

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Cooling Technique for Electronic Equipments using a small scale CPL heat pipe (소형 CPL 히트파이프를 이용한 전자장치 냉각 기술)

  • Kang, Sarng-Woo;Lee, Yoon-Pyo
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1241-1246
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    • 2004
  • The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

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Numerical analysis of temperature and stress distributions in a prestressed concrete slab with pipe cooling (파이프쿨링을 실시한 대형 프리스트레스트 콘크리트 슬래브의 수화열 해석)

  • 주영춘;김은겸;신치범;조규영;박용남
    • Proceedings of the Korea Concrete Institute Conference
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    • 1999.04a
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    • pp.275-280
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    • 1999
  • It was analysed the effect of pipe cooling as a measure to avoid thermal cracks due to the heat of hydration during the curing process of a massive prestressed concrete (PSC) slab. PSC slab has a complex three-dimensional shape of which the maximal and minimal thicknesses of cross-section were 2.8 and 0.95m, respectively. Steel pipes of which the diameter was 1 inch were employed for cooling. The horizontal and vertical distances between the contiguous pipes were 0.5 and 0.6m, respectively. One the four layers of cooling pipe were arranged according to the thickness of cross-section. Temperature distribution was calculated by the program developed by the authors, of which the accuracy was verified on a few published papers by the authors. Based on the temperature analysis of the cross-section which had four layers of cooing pipe, the maximum temperature of concrete interior was 54.2$^{\circ}C$ and the maximum differenced between the interior and surface temperatures of concrete was 14.$0^{\circ}C$ and, thereby, the thermal cracking index was 1.1. Upon the stress analysis, the thermal cracking index was 0.92 and the probability of thermal-crack development was 52%. Therefore, it was expected to make it possible to reduce the probability of thermal-crack development in a massive PSC slab by adopting pipe cooling.

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