• 제목/요약/키워드: cooling device

검색결과 461건 처리시간 0.024초

히트파이프 열교환기를 이용한 전자통신장비 콘솔의 냉각 기술에 관한 연구 (A Study on cooling technology of electronics communication device consoles using heat pipe exchangers)

  • 최지훈;유성열;성병호;이정환;김종만;전지환;서명원;김철주
    • 유체기계공업학회:학술대회논문집
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    • 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
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    • pp.483-486
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    • 2006
  • The fan is widely used to cool high heat flux generated as of the electronic communication device consoles. It, however, makes a lot of noises that interfere considerably with the operation environment. This study was conducted to obtain the cooling design technology of the consoles through being equipped with the Heat Pipe Heat Exchangers (HPHE) together with low revolution fans in place of existing fans for the cooling technology of the forced convection. Not only the sealed type consoles but the HPHE were also designed so as to cool effectively the heat generated from the inside of the console. The simulation was conducted by computational numerical analysis along with its experiments. The results of the numerical analysis and experiments were compared in order to improve the cooling technology of the consoles mounted with the HPHE. Consequently, instead of loud fan noise generated as of existing forced convection methods, the cooling technology of HPHE can remarkably improve many problems such as the operation environment, indoor dust, malfunction caused by pollution sources and so on.

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모바일 전자장비 냉각용 Micro-CPL내 형상크기변화에 따른 열성능 해석 (Effect of Groove and Channel Size on the Thermal Transport Capacity of Micro-Capillary Pumped Loop for Mobile Electronic Device Cooling System)

  • 김병기;서정세;황건;문석환;배찬효
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2005년도 동계학술발표대회 논문집
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    • pp.329-334
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    • 2005
  • As more high power wide band gap devices are being utilized. the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.

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사출성형에서 공정 중 금형의 진동 크기 변화를 활용한 냉각시간 모니터링에 대한 연구 (A study on the monitoring of cooling time using the change in the magnitude of mold vibration in injection molding)

  • ;김종선
    • Design & Manufacturing
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    • 제15권3호
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    • pp.45-49
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    • 2021
  • In this study, during the injection molding process, a device was manufactured and evaluated that calculates a cooling time by measuring a vibration signal generated from a mold using an acceleration. The last two parts, one of which has a large magnitude change in the measured vibration signal of a mold, were divided into a cooling start section (paking end section) and a mold opening section, and the time difference at the relevant points was calculated as the cooling time. The cooling time was monitored on a 5-inch light guide plate mold by applying the method. The manufactured device was attached to a fixed base of mold to measure the cooling time, and data was obtained remotely using Bluetooth technology. Then, the measured cooling time was compared with the cooling time set in the injection molding machine to evaluate the accuracy. As a result of the experiment, the cooling times measured by the devices were 15.675±0.024 sec, 20.637±0.014 sec and 25.623±0.079 sec of each conditions. Also, the measurement results were shown with errors of 0.655±0.044 sec, 0.637±0.014 sec, and 0.662±0.013 sec, respectively.

섬유코팅용 왁스링 성형을 위한 자동화 시스템 개발 (Development of Automatic Wax-Ring Manufacturing System for Silk Coating)

  • 조영학;맹희영
    • 한국생산제조학회지
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    • 제22권3_1spc호
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    • pp.531-536
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    • 2013
  • An automatic wax-ring manufacturing system for silk coating was developed, which consisted of a container, pallet with a cooling part, injection port, and removing device. The removing device is a system to load, lift, and cut the wax-ring, which is widelyused for various silk-coating industrial purposes. A novel removing device equipped with a water cooling circulation system is proposed in this paper. It has the benefit of easy control, as well as the convenience of loading and unloading without the use of other equipment. Three-dimensional modeling techniques were adopted to develop integrated functions for the automatic wax-ring manufacturing system, which made it possible to confirm the smooth integration/interface of each part and the system's interrelations with other manufacturing systems.

Development of the closed-loop Joule-Thomson cryoablation device for long area cooling

  • Lee, Cheonkyu;Park, Inmyong;Yoo, Donggyu;Jeong, Sangkwon;Park, Sang Woo
    • 한국초전도ㆍ저온공학회논문지
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    • 제15권3호
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    • pp.40-48
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    • 2013
  • Cryoablation device is a surgical instrument to produce the cooling effect to destroy detrimental biological tissue by utilizing low temperature around 110 K. Usually, this device has the concentrated cooling region, so that it is suitable for concentrated and thick target. Accordingly, it is hard to apply this device for the target which is distributed and thin target. In this study, the design procedure of a closed-loop cryoablation device with multiple J-T expansion part is developed for the treatment of incompetent of great saphenous vein. The developed cyoablation device is designed with the analysis of 1-dimensional (1-D) bio-heat equation. The energy balance is considered to determine the minimum mass flow rate of refrigerant for consecutive flow boiling to develop the uniform cooling temperature. Azeotropic mixed refrigerant R410A and zeotropic mixed refrigerant (MR) of R22 ($CHClF_2$) and R23 ($CHF_3$) are utilized as operating fluids of the developed cryoablation device to form the sufficient temperature and to verify the quality of the inside of cryoablation probe. The experimental results of R410A and the zeotropic MR show the temperature non-uniformity over the range are $244.8K{\pm}2.7K$ and $239.8K{\pm}4.7K$ respectively. The experimental results demonstrate that the probe experiences the consecutive flow boiling over the target range of 200 mm.

급속냉각·가열장치에 따른 사출성형품의 휨에 관한 연구 (A Study on the Warpage of Injection Molded Parts for the rapid Cooling and Heating Device)

  • 이민;김태완
    • 한국산학기술학회논문지
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    • 제16권8호
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    • pp.5074-5081
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    • 2015
  • 플라스틱 제품의 휨을 개선하기 위한 방법은 사출성형 공정에서 일어나는 불균일한 냉각을 균일하게 만들어 플라스틱 제품의 잔류응력을 제거하는 방법이다. 본 연구는 균일한 냉각을 위하여 펠티에 소자를 사용하여 급속가열 냉각 장치를 개발하였다. 급속냉각 가열 장치(RCHD)를 제작하여 전통적인 수냉 장치(TWCD)방식과 급속냉각 가열 장치방식에 따른 휨을 비교 분석하였고, 비결정성 수지인 ABS 수지를 사용하였다. 사출성형 조건인 보압시간, 금형온도, 냉각시간, 보압에 따라 휨의 변화량을 측정 비교하였고, 비결정성 ABS 수지에서 급속가열 냉각 장치 냉각방식이 전통적인 수냉방식 보다 휨이 더 적게 발생하고, 위의 결과들로 보아 조금 더 균일하게 냉각되는 것을 알 수 있었다. ABS 폴리머의 분포 상태를 SEM 사진을 통해서 확인하였다. 전통적인 수냉방식은 폴리머의 분포상태가 조밀하게 분포되어 있고, 급속냉각 가열 방식은 전통적인 수냉방식 보다 넓게 분포되어 있었다. 이것은 냉각이 균일하게 이루어지고, 금형의 온도가 서서히 진행되면서 폴리머의 입자가 커지게 되는데, 이것은 내부응력이 줄어든 것을 의미한다.

전자 장비 냉각에 있어서의 분리형 써모사이펀의 적용 (The application of separate type thermosyphon for cooling of electronic equipments)

  • 김지훈;박신보;윤정호;김시범;전철호
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2002년도 학술대회지
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    • pp.725-728
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    • 2002
  • A separate type thermosyphon can be utilized as a cooling device of electronic equipments (such as CPU of a personal computer or notebook). This study was carried out to investigate the cooling effect of separate type thermosyphon and to find the adequate parameters affecting the separate type thermosyphon. The heat transfer characteristics of separate type thermosyphon were obtained from experimental results. A $50{\times}50{\times}2 mm$ heat source was copied after CPU for the experiments. The results indicate that the device is capable of dissipating 60W of thermal energy and keeping the heat plate surface temperature under 50'E and the device can transfer heat from the evaporator to the condenser through natural circulation (without any external driving forces). Some transport phenomena of the working fluid and the heat transfer characteristics of the loop were observed in the experiments and are discussed in detail below.

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유수대류계수에 관한 실험적 연구 (Experimental Study on Coefficient of Flow Convection)

  • 정상은;오태근;양주경;김진근
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2000년도 봄 학술발표회 논문집
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    • pp.297-302
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    • 2000
  • Pipe cooling method is widely used for reduction of hydration heat and control of cracking in mass concrete structures. However, in order to effectively apply pipe cooling systems to concrete structure, the coefficient of flow convection relating the thermal transfer between inner stream of pipe and concrete must be estimated. In this study, a device measuring the coefficient of flow convection is developed. Since a variation of thermal distribution caused by pipe cooling has a direct effect in internal forced flows, the developed testing device is based on the internal forced flow concept. Influencing factors on the coefficient of flow convection are mainly flow velocity, pipe diameter and thickness, and pipe material. finally a prediction model of the coefficient of flow convection is proposed using experimental results from the developed device. According to the proposed prediction model, the coefficient of flow convection increases with increase in flow velocity and decreases with increase in pipe diameter and thickness. Also, the coefficient of flow convection is largely affected by the type of pipe materials.

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열전소자를 이용한 냉·온장시스템 개발 (Development of Cooling/Warming System Using Thermoelectric Device)

  • 김기환
    • 한국인터넷방송통신학회논문지
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    • 제9권3호
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    • pp.131-136
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    • 2009
  • 열전효과란 온도차를 전기적인 크기 즉 전압으로 변환시키는 것을 말한다. 또한 그 반대의 경우도 여기에 해당한다. 연전 소자는 소자의 영면에 온도 차가 존재할 때 전압이 발생하며 반대로 이 소자에 전압을 가할 경우 온도차가 발생하는 소자이다. 본 논문에서는 물질을 냉각과 가열을 할 수 있게 이러한 현상을 이용하여 열전소자를 사용한 냉 온장 시스템을 소개하였으며 PC와 LabVIEW를 이용하여 냉 온장 시스템을 제어하였다.

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