• Journal of the Korean Society for Precision Engineering
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• v.15 no.8
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• pp.174-182
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• 1998

This paper describes a research work of developing a computer-aided design and machining of irregular shaped-sheet metal product for blanking or piercing operation. An approach to the CAD/CAM system is based on the knowledge-based rules. Knowledge for the CAD/CAM system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. The system has been written in AutoLISP on the AutoCAD and in customer tool kit on the SmartCAM with a personal computer and is composed of nine modules, which are input and shape treatment, flat pattern-layout, production feasibility check, blank-layout, strip-layout, die-layout, data conversion, modelling, and post-processor module. Based on knowledge-based rules, the system is designed by considering several factors, such as material and thickness of product, complexities of blank geometry and punch profile, diameter and material of a wire, and availability of press. This system is capable of generating NC data automatically according to drawings of die-layout module. Results which are carried out in each module will provide efficiencies to the designer and the manufacturer of blanking or piercing die in this field.

• Journal of IKEEE
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• v.25 no.1
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• pp.69-75
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• 2021

In this work, we consider the fabrication method and electrical characteristics of dye-sensitized solar cells (DSSCs), which use titanium (Ti) metal thin films to replace expensive fluorine tin oxide (FTO) electrodes. The thickness of the Ti thin film was changed by adjusting the deposition time of the Ti, and the surface resistance decreased as the thickness of the Ti thin film became thicker. The thickness of the Ti thin film was shown to be similar to the surface resistance of the FTO thin film at approximately 190nm and the DSSC with a thickness of approximately 250nm showed the highest energy conversion efficiency of 4.24%. Furthermore, the possibility of commercialization was confirmed by fabricating and evaluating the DSSC module.

• Journal of Power Electronics
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• v.11 no.2
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• pp.179-187
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• 2011

This paper proposes a MATLAB Simulink simulator for photovoltaic (PV) systems. The main contribution of this work is the utilization of a two-diode model to represent a PV cell. This model is known to have better accuracy at low irradiance levels which allows for a more accurate prediction of PV system performance. To reduce computational time, the input parameters are reduced to four and the values of $R_p$ and $R_s$ are estimated by an efficient iteration method. Furthermore, all of the inputs to the simulator are information available on a standard PV module datasheet. The simulator supports large array simulations that can be interfaced with MPPT algorithms and power electronic converters. The accuracy of the simulator is verified by applying the model to five PV modules of different types (multi-crystalline, mono-crystalline, and thin-film) from various manufacturers. It is envisaged that the proposed work can be very useful for PV professionals who require a simple, fast and accurate PV simulator to design their systems.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2018.05a
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• pp.197-199
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• 2018

Recently, many industrial instruments face the problem of protocol compatibility with the external monitoring and control system. This paper is prepared in the main control board to support the industrial communication protocol conversion, control, and monitoring. The industrial communication gateway module is also designed to ensure that the protocol conversion of CAN bus and Ethernet. The main board processor is used the Atmega2560, and placed 4ea RS485 serial slots for sub-board. One of them is used for communication CAN bus and Ethernet. It provides analog and digital I / O through each of the slots is used for control and monitoring.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.7
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• pp.74-80
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• 2006

This paper describes a solar energy conversion strategy is applied to grid-connected single phase inverter by the maximum power point of conversion strategy. The maximum power point of tracking is controlled output power of PV(photovoltaic)modules, based on generated circuit control MOSFET switch of two boost converter for a connected single phase inverter with four IGBT's switch in full bridge. The generation control circuit allows each photovoltaic module to operate independently at peak capacity, simply by detecting of the output power of PV module. Furthermore, the generation control circuit attenuates low-frequency ripple voltage. which is caused by the full-bridge inverter, across the photovoltaic modules. The effectiveness of the proposed inverter system is confirmed experimentally and by means of simulation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.819-823
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• 2016

DSSC (dye-sensitized solar cell) is expected to be one of the next-generation photovoltaics because of its environment-friendly and low-cost properties. However, commercialization of DSSC is difficult because of the electrolyte leakage. We propose thermal curable base on silicon resin and apply a unit cell and large area ($200{\times}200mm$) dye-sensitized solar cell. The resin aimed at sealing of DSSC and gives a promising resolution for sealing of practical DSSC. In result, the photoelectric conversion efficiency of the unit cell and the module was 6.63% and 5.49%, respectively. In the durability test result, the photoelectric conversion efficiency of the module during 500, 1,000, 1,500 and 2,000 hours was 0.73%, 0.73%, 1.82% and 2.36% respectively. It was confirmed that the photoelectric conversion efficiency characteristics are constant. We have developed encapsulation material of thermal curing method excellent in chemical resistance. A sealing material was applied to the dye-sensitized solar cell and it solved the problem of durability the dye-sensitized solar cell. Sealing material may be applied to verify the possibility of practical application of the dye-sensitized solar cell.

• Advances in nano research
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• v.13 no.5
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• pp.475-485
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• 2022

Crystalline silicon photovoltaic cells have advantages of zero pollution, large scale and high reliability. A major challenge is that sunlight wavelength with photon energy lower than semiconductor band gap is converted into heat and increase its temperature and reduce its conversion efficiency. Traditional cooling PV method is using water flowing below the modules to cool down PV temperature. In this paper, the idea is proposed to reduce the temperature of the module and improve the energy conversion efficiency of the module through the modulation of the solar spectrum. A spectrally selective nanofilm reflector located directly on the surface of PV is designed, which can reflect sunlight wavelength with low photon energy, and even enhance absorption of sunlight wavelength with high photon energy. The results indicate that nanofilm reflector can reduce spectral reflectivity integral from 9.0% to 6.93% in 400~1100 nm wavelength range, and improve spectral reflectivity integral from 23.1% to 78.34% in long wavelength range. The nanofilm reflector can reduce temperature of PV by 4.51℃ and relatively improved energy conversion efficiency of PV by 1.25% when solar irradiance is 1000 W/m². Furthermore, the nanofilm reflector is insensitive in sunlight's angle and polarization state, and be suitable for high irradiance environment.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.609-610
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• 2006

A 77GHz MMIC transceiver module consisting of a power amplifier, a low noise amplifier, a drive amplifier, a frequency doubler and a down-mixer has been developed for automotive forward-looking radar sensor. The MMIC chip set was fabricated using $0.15{\mu}m$ gate-length InGaAs/InAlAs/GaAs mHEMT process based on 4-inch substrate. The power amplifier demonstrated a measured small signal gain of over 20dB from $76{\sim}77GHz$ with 15.5dBm output power. The chip size is $2mm{\times}2mm$. The low noise amplifier achieved a gain of 20dB in a band between $76{\sim}77\;GHz$ with an output power of 10dBm. The chip size is $2.2mm{\times}2mm$. The driver amplifier exhibited a gain of 23dB over a $76{\sim}77\;GHz$ band with an output power of 13dBm. The chip size is $2.1mm{\times}2mm$. The frequency doubler achieved an output power of -16dBm at 76.5GHz with a conversion gain of -16dB for an input power of 10dBm and a 38.25GHz input frequency. The chip size is $1.2mm{\times}1.2mm$. The down-mixer demonstrated a measured conversion gain of over -9dB. The chip size is $1.3mm{\times}1.9mm$. The transceiver module achieved an output power of 10dBm in a band between $76{\sim}77GHz$ with a receiver P1dB of -28dBm. The module size is $8{\times}9.5{\times}2.4mm^3$. This MMIC transceiver module is suitable for the 77GHz automotive radar systems and related applications in W-band.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.2
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• pp.110-114
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• 2021

In this study, we fabricated light-weight solar module for various applications such as building integrated photovoltaics (BIPV), vehicles, trains, etc. Ethylene tetra fluoro ethylene (ETFE) film was applied as a material to replace the cover glass, which occupies more than 65% of the weight of the PV module. Glass fiber reinforced plastic (GRP) was applied to the ones with a low durability by replacing the cover glass to ETFE. Moreover, to achieve a high solar power conversion in this study, we applied a shingled design to weight reduced solar modules. The shingled module with GRP shows 183.7 W of solar-to-power conversion, and the output reduction rate after weight load test was 1.14%.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.12
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• pp.1673-1678
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• 2019

There are various networks and communication methods are used in industrial communication. Enterprises need to convert communications between industrial devices and networks for production line expansion, factory upgrades, network segmentation, and SI. This requires designers manufactured by many manufacturers to provide communication equipment for data or protocol conversion in order to connect and transmit various other mechanical devices to the network. This paper designed industrial communication gateway that can support the transformation of industrial communication protocol using multi-layered communication module. Industrial communication gateways have a structure that connects individual communication modules using RS485 communication to multiple layers. Each communication module consisted of analog and digital data card, LAN, and CAN-enabled card. The main board processor used Atmega micro-processor, and the RS485 slot was placed to have a multi-layer communication module structure. These additive layer type communication modules support analog and digital I/O functions and LAN and CAN for wide use in industrial communication control and monitoring.