• 제목/요약/키워드: control transistor

검색결과 329건 처리시간 0.025초

Electrical Characteristics of Pentacene Thin-Film Transistors with Polyvinylpyrrolidone Gate Insulator

  • Kim, Dong-Wook;Lee, Jong-Won;Noh, Jung-Chul;Choi, Jong-Sun
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
    • /
    • pp.579-582
    • /
    • 2009
  • This paper reports the electrical characteristics of polyvinylpyrrolidone (PVPy) and the performance of organic thin-film transistors with PVPy as a gate insulator. PVPy shows a dielectric constant of about 3 and contributes to the upright growth of pentacene molecules with 15.3${\AA}$ interplanar spacing. These results will be discussed.

  • PDF

터널 전계 효과 트랜지스터의 양자모델에 따른 특성 변화

  • 이주찬;안태준;유윤섭
    • 한국정보통신학회:학술대회논문집
    • /
    • 한국정보통신학회 2017년도 추계학술대회
    • /
    • pp.454-456
    • /
    • 2017
  • 다양한 양자모델(Quantum model)을 적용한 터널 전계 효과 트랜지스터(tunnel field effect transistor; TFET)의 전류 및 커패시턴스(Capacitance)-전압 특성을 조사하였다. 사용된 양자 모델은 density gradient, Bohm Quantum Potential(BQP), Vandort quantum correction 모델을 슈뢰딩거-푸아송 모델과 calibration하여 사용하였다. BQP, Vandort, density gradient 모두 구동전류는 감소하였다. BQP를 단독으로 사용한 경우에 SS(subthreshold swing)와 on-set 전압($V_{onset}$)은 일정하지만 구동전류에서만 약 3배 전류가 감소하였으며, BQP와 Vandort 사용한 경우와 density gradient를 사용한 경우에 모두 $V_{onset}$이 약 0.07 eV 이동하였으며, SS가 40 mV/dec 이상으로 증가하였다.

  • PDF

공정개선을 통한 고전류이득 저포화전압 전력 트랜지서터의 성능향상 (Performance improvement of high $\beta$ and low saturation voltage power transistor through new process)

  • 김준식;이재곤;최시영
    • 전자공학회논문지D
    • /
    • 제35D권8호
    • /
    • pp.8-14
    • /
    • 1998
  • A new process is developed to improve the electrical characteristics of high .beta. and low saturation voltage power transistor for lamp solenoid driver application. To prevent punch-through breakdown, appropriate combination of base doping and base width is necessary in the range of operating voltage of the circuit. The optimum values of base doping and sheet resistance are $Q_{D}$= $1.5{\times}10^{14}$atoms/$\textrm{cm}^2$ and $R_{s}$= 350 $\Omega/\square$ base wodtj $W_{B}$= $2.5{\mu}m$respectively. Under this condition it is possible to control $\beta$ of the transistor to 1500, maintaining $VB_{CBO}$ =200V. To reduce scattered distribution of .beta. of the devices on the wafer, it is necessary to improve emittter predeposition process. As a result, scattered distribution of .beta. of the devices on the wafer was reduced to 1/6 by using the new process. To improve collector to emitter forward voltage drop, $V_{ECF}$ of damper diode, an additional silicon etching process is used, which resulted in improving the value of $V_{eCF}$ from 2.8 V to 1.8V. With the suggested process superior device performance and higher yield are achieved.

  • PDF

대기압 아르곤 플라즈마 처리를 통한 IGZO TFT의 전기적 특성 향상 연구 (High Performance InGaZnO Thin Film Transistor by Atmospheric Pressure Ar Plasma Treatment)

  • 정병준;정준교;박정현;김유정;이희덕;최호석;이가원
    • 반도체디스플레이기술학회지
    • /
    • 제16권4호
    • /
    • pp.59-62
    • /
    • 2017
  • In this paper, atmospheric pressure plasma treatment was proposed for high performance indium gallium zinc oxide thin film transistor (IGZO TFT). RF Ar plasma treatment is performed at room temperature under atmospheric pressure as a simple and cost effective channel surface treatment method. The experimental results show that field effect mobility can be enhanced by $2.51cm^2/V{\cdot}s$ from $1.69cm^2/V{\cdot}s$ to $4.20cm^2/V{\cdot}s$ compared with a conventional device without plasma treatment. From X-ray photoelectron spectroscopy (XPS) analysis, the increase of oxygen vacancies and decrease of metal-oxide bonding are observed, which suggests that the suggested atmospheric Ar plasma treatment is a cost-effective useful process method to control the IGZO TFT performance.

  • PDF

Recent Advances in a-IGZO Thin Film Transistor Devices: A Short Review

  • Jingwen Chen;Fucheng Wang;Yifan Hu;Jaewoong Cho;Yeojin Jeong;Duy Phong Pham;Junsin Yi
    • 한국전기전자재료학회논문지
    • /
    • 제36권5호
    • /
    • pp.463-473
    • /
    • 2023
  • In recent years, the transparent amorphous oxide thin film transistor represented by indium-gallium-zinc-oxide (IGZO) has become the first choice of the next generation of integrated circuit control components. This article contributes an overview of IGZO thin-film transistors (TFTs), including their fundamental principles and recent advancements. The paper outlines various TFT structures and places emphasis on the fabrication process of the active layer. The result showed that the size of the active layer including the length-to-width ratio and the width could have a significant effect on the mobility. And the process of TFT could influence the crystal structure of IGZO thin film. Furthermore, the article presents an overview of recent applications of IGZO TFTs, such as their use in display drivers and TFT memories. At last, the future development of IGZO TFT is forecasted in this paper.

Schottky Barrier Tunnel Field-Effect Transistor using Spacer Technique

  • Kim, Hyun Woo;Kim, Jong Pil;Kim, Sang Wan;Sun, Min-Chul;Kim, Garam;Kim, Jang Hyun;Park, Euyhwan;Kim, Hyungjin;Park, Byung-Gook
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • 제14권5호
    • /
    • pp.572-578
    • /
    • 2014
  • In order to overcome small current drivability of a tunneling field-effect transistor (TFET), a TFET using Schottky barrier (SBTFET) is proposed. The proposed device has a metal source region unlike the conventional TFET. In addition, dopant segregation technology between the source and channel region is applied to reduce tunneling resistance. For TFET fabrication, spacer technique is adopted to enable self-aligned process because the SBTFET consists of source and drain with different types. Also the control device which has a doped source region is made to compare the electrical characteristics with those of the SBTFET. From the measured results, the SBTFET shows better on/off switching property than the control device. The observed drive current is larger than those of the previously reported TFET. Also, short-channel effects (SCEs) are investigated through the comparison of electrical characteristics between the long- and short-channel SBTFET.

VT-Modulation of Planar Tunnel Field-Effect Transistors with Ground-Plane under Ultrathin Body and Bottom Oxide

  • Sun, Min-Chul;Kim, Hyun Woo;Kim, Hyungjin;Kim, Sang Wan;Kim, Garam;Lee, Jong-Ho;Shin, Hyungcheol;Park, Byung-Gook
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • 제14권2호
    • /
    • pp.139-145
    • /
    • 2014
  • Control of threshold voltage ($V_T$) by ground-plane (GP) technique for planar tunnel field-effect transistor (TFET) is studied for the first time using TCAD simulation method. Although GP technique appears to be similarly useful for the TFET as for the metal-oxide-semiconductor field-effect transistor (MOSFET), some unique behaviors such as the small controllability under weak ground doping and dependence on the dopant polarity are also observed. For $V_T$-modulation larger than 100 mV, heavy ground doping over $1{\times}10^{20}cm^{-3}$ or back biasing scheme is preferred in case of TFETs. Polarity dependence is explained with a mechanism similar to the punch-through of MOSFETs. In spite of some minor differences, this result shows that both MOSFETs and TFETs can share common $V_T$-control scheme when these devices are co-integrated.

철도차량용 IGBT Gate Driver Unit 기술 동향 분석 연구 (Research on Technical Trends of IGBT Gate Driver Unit for Railway Car)

  • 조인호;이재범;정신명;이병희
    • 한국철도학회논문집
    • /
    • 제20권3호
    • /
    • pp.339-348
    • /
    • 2017
  • 철도차량용 전원창치는 추진제어용 전원장치와 보조전원장치로 구분된다. 추진제어용 전원장치는 철도차량의 추진 및 회생제동 등의 동작을 위한 것이며, 보조전원장치는 추진제어용 전원을 제외한 공기압축기, 조명기기, 차량제어전원 등의 보조전원에 사용되는 것이다. 각 전원장치는 고전압, 고전류 사양 특성에 따라 일반적으로 insulated-gate bipolar transistor (IGBT)를 스위칭 소자로 사용하고 있다. 스위칭 소자를 사용하기 위해서는 적절한 스위칭 동작을 구현하기 위한 구동회로(Gate Driver Unit, GDU)가 필수적이다. 본 논문에서는 철도차량에 적용되고 있는 IGBT용 GDU에 적용되고 있는 기술 동향을 분석하고 철도차량용 IGBT GDU 설계 시 고려사항에 대해 알아보고자 한다.

투명 유연 박막 트랜지스터의 구현을 위한 열처리된 산화아연 박막의 전사방법 개발 (Transfer of Heat-treated ZnO Thin-film Plastic Substrates for Transparent and Flexible Thin-film Transistors)

  • 권순열;정동건;최영찬;이재용;공성호
    • 센서학회지
    • /
    • 제27권3호
    • /
    • pp.182-185
    • /
    • 2018
  • Zinc oxide (ZnO) thin films have the advantages of growing at a low temperature and obtaining high charge mobility (carrier mobility) [1]. Furthermore, the zinc oxide thin film can be used to control application resistance depending on its oxygen content. ZnO has the desired physical properties, a transparent nature, with a flexible display that makes it ideal for use as a thin-film transistor. Though these transparent flexible thin-film transistors can be manufactured in various manners, manufacturing large-area transistors using a solution process is easier owing to the low cost and flexible substrate. The advantage of being able to process at low temperatures has been attracting attention as a preferred method. However, in the case of a thin-film transistor fabricated through a solution process, it is reported that charge mobility is lower. To improve upon this, a method of improving the crystallinity through heat treatment and increasing electron mobility has been reported. However, as the heat treatment temperature is relatively high at $500^{\circ}C$, an application where a flexible substrate is absent would be more suitable.

A Study On the Retention Time Distribution with Plasma Damage Effect

  • Yi Jae Young;Szirmay Laszlo;Yi Cheon Hee
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2004년도 학술대회지
    • /
    • pp.460-462
    • /
    • 2004
  • The control of the data retention time is a main issue for realizing future high density dynamic random access memory. There are several leakage current mechanisms in which the stored data disappears. The mechanisms of data disappear is as follow, 1 )Junction leakage current between the junction, 2) Junction leakage current from the capacitor node contact, 3)Sub-threshold leakage current if the transfer transistor is affected by gate etch damage etc. In this paper we showed the plasma edge damage effect to find out data retention time effectiveness. First we measured the transistor characteristics of forward and reverse bias. And junction leakage characteristics are measured with/without plasma damage by HP4145. Finally, we showed the comparison TRET with etch damage, damage_cure_RTP and hydrogen_treatment. As a result, hydrogen_treatment is superior than any other method in a curing plasma etch damage side.

  • PDF