• Title/Summary/Keyword: contact transition

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In situ Stress Measurements with Submonolayer Sensitivity As a Probe of Coherent-to-incoherent Matching at an Interface in Ultrathin Magnetic Films

  • Jeong, Jong-Ryul;Kim, Young-Seok;Shin, Sung-Chul
    • Journal of Magnetics
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    • v.7 no.4
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    • pp.151-155
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    • 2002
  • In situ stress changes at interfaces of ultrathin magnetic films were measured by means of a non-contact optical fiber bundle displacement detector. A bending of the substrate due to stress of a deposited film was detected in cantilever geometry. The highest sensitivity of 134 mV/$\mu$m for the displacement detector was realized with a help of computer simulation. The detector was applied to in situ stress measurements of Co/Pt and Ni/Pd magnetic multilayer films prepared on the glass substrates by dc magnetron sputtering. The detector turned out to have a submonolayer sensitivity that enables to observe coherent-to-incoherent transition in these mismatched multilayers and even detect the stress changes within the monoatomic coverage. This highly sensitive detector paves new way to probe the stress relaxation at an interface in ultrathin films.

Estimation of Fracture Toughness of Reactor Pressure Vessel Steels Using Automated Ball Indentation Test

  • Byun, Thak-Sang;Kim, Joo-Hark;Lee, Bong-Sang;Yoon, Ji-Hyun;Hong, Jun-Hwa
    • Proceedings of the Korean Nuclear Society Conference
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    • 1997.05b
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    • pp.129-136
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    • 1997
  • The automated ball indentation(ABI) test was utilized to develop a semi-nondestructive method for estimating the fracture toughness( $K_{JC}$ ) in the transition temperature range. The key concept of the method is that the indentation deformation energy to the load at which the mean ball-specimen contact pressure reaches the fracture stress is related to the fracture energy of the material. ABI tests were performed for the reactor pressure vessel(RPV) base and weld metals at the temperatures of-15$0^{\circ}C$~$0^{\circ}C$ and the fracture toughness (estimated $K_{JC}$ ) was calculated from the indentation load-depth data. For all steels the temperature dependence of the estimated fracture toughness was almost the same as that ASTM $K_{JC}$ master curve The reference temperatures( $T_{o}$)of the steels were determined form the estimated $K_{JC}$ versus temperature curves. The reference temperature was well correlated with the index temperature of 41J Charpy impact energy( $T_{41J}$).).).

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Traf4 is required for tight junction complex during mouse blastocyst formation

  • Lee, Jian;Choi, Inchul
    • Journal of Animal Reproduction and Biotechnology
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    • v.36 no.4
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    • pp.307-313
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    • 2021
  • Traf4 (Tumor necrosis factor Receptor Associated Factor 4) is a member of the tumor necrosis factor receptor (TNFR) - associated factors (TRAFs) family. TRAF4 is overexpressed in tumor cells such as breast cancer and associated with cytoskeleton and membrane fraction. Interestingly, TRAF4 was localized with tight junctions (TJs) proteins including OCLN and TJP1 in mammary epithelial cells. However, the expression patterns and biological function of Traf4 were not examined in preimplantation mouse embryos although Traf4-deficient mouse showed embryonic lethality or various dramatic malformation. In this study, we examined the temporal and spatial expression patterns of mouse Traf4 during preimplantation development by qRT-PCR and immunostaining, and its biological function by using siRNA injection. We found upregulation of Traf4 from the 8-cell stage onwards and apical region of cell - cell contact sites at morula and blastocyst embryos. Moreover, Traf4 knockdown led to defective TJs without alteration of genes associated with TJ assembly but elevated p21 expression at the KD morula. Taken together, Traf4 is required for TJs assembly and cell proliferation during morula to blastocyst transition.

Changes in bound water and microstructure during consolidation creep of Guilin red clay

  • Zhang, Dajin;Xiao, Guiyuan;Yin, Le;Xu, Guangli;Wang, Jian
    • Geomechanics and Engineering
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    • v.30 no.5
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    • pp.471-478
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    • 2022
  • Creep of soils has a significant impact on mechanical properties. The one-dimensional consolidation creep test, thermal analysis test, scanning electron microscope (SEM) test, and mercury compression test were performed on Guilin red clay to study the changes in bound water and microstructure during the creep process of Guilin red clay. According to the results of the tests, only free and weakly bound water is discharged during the creep of Guilin red clay. When the consolidation pressure p is in the 12.5-400.0 kPa range, it is primarily the discharge of free water; when the consolidation pressure p is in the 800.0-1600.0 kPa range, the weakly bound water is converted to free water and discharged. After consolidation creep, the microstructure of soil changes from granular overhead contact structure to flat sheet-like stacking structure, with a decrease in the number of large and medium pores, an increase in the number of small and micro pores, and a decrease in the fractal dimension of pores. The creep process of red clay is the discharge of weakly bound water as well as the compression of large pores into small pores and the transition of soil particles from loose to dense.

Analysis of Subwavelength Metal Hole Array Structure for the Enhancement of Quantum Dot Infrared Photodetectors

  • Ha, Jae-Du;Hwang, Jeong-U;Gang, Sang-U;No, Sam-Gyu;Lee, Sang-Jun;Kim, Jong-Su;Krishna, Sanjay;Urbas, Augustine;Ku, Zahyun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.334-334
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    • 2013
  • In the past decade, the infrared detectors based on intersubband transition in quantum dots (QDs) have attracted much attention due to lower dark currents and increased lifetimes, which are in turn due a three-dimensional confinement and a reduction of scattering, respectively. In parallel, focal plane array development for infrared imaging has proceeded from the first to third generations (linear arrays, 2D arrays for staring systems, and large format with enhanced capabilities, respectively). For a step further towards the next generation of FPAs, it is envisioned that a two-dimensional metal hole array (2D-MHA) structures will improve the FPA structure by enhancing the coupling to photodetectors via local field engineering, and will enable wavelength filtering. In regard to the improved performance at certain wavelengths, it is worth pointing out the structural difference between previous 2D-MHA integrated front-illuminated single pixel devices and back-illuminated devices. Apart from the pixel linear dimension, it is a distinct difference that there is a metal cladding (composed of a number of metals for ohmic contact and the read-out integrated circuit hybridization) in the FPA between the heavily doped gallium arsenide used as the contact layer and the ROIC; on the contrary, the front-illuminated single pixel device consists of two heavily doped contact layers separated by the QD-absorber on a semi-infinite GaAs substrate. This paper is focused on analyzing the impact of a two dimensional metal hole array structure integrated to the back-illuminated quantum dots-in-a-well (DWELL) infrared photodetectors. The metal hole array consisting of subwavelength-circular holes penetrating gold layer (2DAu-CHA) provides the enhanced responsivity of DWELL infrared photodetector at certain wavelengths. The performance of 2D-Au-CHA is investigated by calculating the absorption of active layer in the DWELL structure using a finite integration technique. Simulation results show the enhanced electric fields (thereby increasing the absorption in the active layer) resulting from a surface plasmon, a guided mode, and Fabry-Perot resonances. Simulation method accomplished in this paper provides a generalized approach to optimize the design of any type of couplers integrated to infrared photodetectors.

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Interfacial disruption effect on multilayer-films/GaN : Comparative study of Pd/Ni and Ni/Pd films

  • 김종호;강희재;김차연;전용석;서재명
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.113-113
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    • 2000
  • 직접천이형 wide band gap(3.4eV) 반도체중의 하나인 GaN를 청색 및 자외선 laser diode, 고출력 전자장비 등으로 응용하기 위해서는 낮은 접합저항을 갖는 Ohmic contact이 선행되어야 한다. 그러나 만족할만한 p-type GaN의 Ohmic contact은 아직 실현되고 있지 못하며, 이는 GaN와 접합 금속과의 구체적인 반응의 연구를 필요로 한다. 본 연구에서 앞서 Pt, Pt, Ni등의 late transition metal을 p-GaN에 접합시킨 결과 이들은 접합 당시 비교적 평탄하나 후열 처리과정에서 비교적 낮은 온도에서 기판과 열팽창계수의 차이로 인하여 평탄성을 잃어버리면서 barrier height가 증가한다는 사실을 확인하였다. 따라서 본 연구에서는 이러한 열적 불안정성을 극복하기 위하여 Ni과 Pd를 차례로 증착하고 가열하면서 interfacial reaction, film morphology, Fermi level의 움직임을 monchromatic XPS(x-ray photoelectron spectroscopy) 와 SAM(scanning Auger microscopy) 그리고 ex-situ AFM을 이용하여 밝히고자 하였다. 특히 후열처리에 의한 계면 반응에 수반되는 구성 금속원소 간의 합금현상과 금속 층의 평탄성이 밀접한 관계가 있다는 것을 확인하였다. 이러한 합금과정에서 나타나는 금속원소들의 중심 준위의 이동을 체계적으로 규명하기 위해서 Pd1-xNix와 Pd1-xGax 합금들의 표준시료를 arc melting method로 만들어 농도에 따른 금속원소들의 중심 준위의 이동을 측정하여, Pd/Ni/p-GaN 및 Ni/Pd/p-GaN 계에서 열처리 온도에 따른 interfacial reaction을 확인하였다. 그 결과 두 계가 상온에서 nitride 및 alloy를 형성하지 않고 고르게 증착되고, 열처리 온도를 40$0^{\circ}C$에서 $650^{\circ}C$까지 증가시킴에 따라 계면반응의 부산물인 metallic Ga은 증가하고 있으마 nitride는 여전히 형성되지 않는 것을 확인하였다. 증착당시 Ni이 계면에 있는 Pd/Ni/p-GaN의 경우에는 52$0^{\circ}C$까지의 열처리에 의하여 Ni과 Pd가 골고루 섞이고 그 평탄성도 유지되고 barier height의 변화도 없었다. 더 높은 $650^{\circ}C$ 가열에 의해서는 surface free energy가 작은 Ga의 활발한 편석 현상으로 인해 표면은 Ga이 풍부한 Pd-Ga의 합금층으로 덮이고, 동시에 작은 pinhole들이 발생하며 barrier height도 0.3eV 가량 증가하게 된다. 반면에 증착당시 Pd이 계면에 있는 Ni/Pd/p-GaN의 경우에는 40$0^{\circ}C$의 가열까지는 두 금속이 그들 계면에서부터 섞이나, 52$0^{\circ}C$의 가열에 의해 이미 barrier height가 0.2eV 가량 증가하기 시작하였다. 더 높은 $650^{\circ}C$가열에 의해서는 커다란 pinhole, 0.5eV 가량의 barrier height 증가, Pd clustering이 동시에 관찰되었다. 따라서 Ni과 Pd의 일함수는 물론 thermal expansion coefficient가 거의 같으며 surface free energy도 거의 일치한다는 점을 감안하면, 이렇게 뚜렷한 열적 안정성의 차이는 GaN와 contact metal과의 반응시작 온도(disruption onset temperature)의 차이에 기인함을 알 수 있었다. 즉 계면에서의 반응에 의해 편석되는 Ga에 의해 박막의 strain이 이완되면, pinhole 등의 박막결함이 줄어 들고, 이는 계면의 N의 out-diffusion을 방지하여 p-type GaN의 barrier height 증가를 막게 된다.

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Numerical Modeling of Thermoshearing in Critically Stressed Rough Rock Fracture: DECOVALEX-2023 Task G (임계응력 하 거친 암석 균열의 Thermoshearing 수치모델링: 국제공동연구 DECOVALEX-2023 Task G)

  • Jung-Wook Park;Chan-Hee Park;Li Zhuang;Jeoung Seok Yoon;Changlun Sun;Changsoo Lee
    • Tunnel and Underground Space
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    • v.33 no.3
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    • pp.189-207
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    • 2023
  • In the present study, the thermoshearing experiment on a rough rock fracture were modeled using a three-dimensional grain-based distinct element model (GBDEM). The experiment was conducted by the Korea Institute of Construction Technology to investigate the progressive shear failure of fracture under the influence of thermal stress in a critical stress state. The numerical model employs an assembly of multiple polyhedral grains and their interfaces to represent the rock sample, and calculates the coupled thermo-mechanical behavior of the grains (blocks) and the interfaces (contacts) using 3DEC, a DEM code. The primary focus was on simulating the temperature evolution, generation of thermal stress, and shear and normal displacements of the fracture. Two fracture models, namely the mated fracture model and the unmated fracture model, were constructed based on the degree of surface matedness, and their respective behaviors were compared and analyzed. By leveraging the advantage of the DEM, the contact area between the fracture surfaces was continuously monitored during the simulation, enabling an examination of its influence on shear behavior. The numerical results demonstrated distinct differences depending on the degree of the surface matedness at the initial stage. In the mated fracture model, where the surfaces were in almost full contact, the characteristic stages of peak stress and residual stress commonly observed in shear behavior of natural rock joints were reasonably replicated, despite exhibiting discrepancies with the experimental results. The analysis of contact area variation over time confirmed that our numerical model effectively simulated the abrupt normal dilation and shear slip, stress softening phenomenon, and transition to the residual state that occur during the peak stress stage. The unmated fracture model, which closely resembled the experimental specimen, showed qualitative agreement with the experimental observations, including heat transfer characteristics, the progressive shear failure process induced by heating, and the increase in thermal stress. However, there were some mismatches between the numerical and experimental results regarding the onset of fracture slip and the magnitudes of fracture stress and displacement. This research was conducted as part of DECOVALEX-2023 Task G, and we expect the numerical model to be enhanced through continued collaboration with other research teams and validated in further studies.

Perfluoropolymer Membranes of Tetrafluoroethylene and 2,2,4Trifluofo- 5Trifluorometoxy- 1,3Dioxole.

  • Arcella, V.;Colaianna, P.;Brinati, G.;Gordano, A.;Clarizia, G.;Tocci, E.;Drioli, E.
    • Proceedings of the Membrane Society of Korea Conference
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    • 1999.07a
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    • pp.39-42
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    • 1999
  • Perfluoropolymers represent the ultimate resistance to hostile chemical environments and high service temperature, attributed to the presence of fluorine in the polymer backbone, i.e. to the high bond energy of C-F and C-C bonds of fluorocarbons. Copolymers of Tetrafluoroethylene (TEE) and 2, 2, 4Trifluoro-5Trifluorometoxy- 1, 3Dioxole (TTD), commercially known as HYFLON AD, are amorphous perfluoropolymers with glass transition temperature (Tg)higher than room temperature, showing a thermal decomposition temperature exceeding 40$0^{\circ}C$. These polymer systems are highly soluble in fluorinated solvents, with low solution viscosities. This property allows the preparation of self-supported and composite membranes with desired membrane thickness. Symmetric and asymmetric perfluoropolymer membranes, made with HYFLON AD, have been prepared and evaluated. Porous and not porous symmetric membranes have been obtained by solvent evaporation with various processing conditions. Asymmetric membranes have been prepared by th wet phase inversion method. Measure of contact angle to distilled water have been carried out. Figure 1 compares experimental results with those of other commercial membranes. Contact angles of about 120$^{\circ}$for our amorphous perfluoropolymer membranes demonstrate that they posses a high hydrophobic character. Measure of contact angles to hexandecane have been also carried out to evaluate the organophobic character. Rsults are reported in Figure 2. The observed strong organophobicity leads to excellent fouling resistance and inertness. Porous membranes with pore size between 30 and 80 nanometers have shown no permeation to water at pressures as high as 10 bars. However high permeation to gases, such as O2, N2 and CO2, and no selectivities were observed. Considering the porous structure of the membrane, this behavior was expected. In consideration of the above properties, possible useful uses in th field of gas- liquid separations are envisaged for these membranes. A particularly promising application is in the field of membrane contactors, equipments in which membranes are used to improve mass transfer coefficients in respect to traditional extraction and absorption processes. Gas permeation properties have been evaluated for asymmetric membranes and composite symmetric ones. Experimental permselectivity values, obtained at different pressure differences, to various single gases are reported in Tab. 1, 2 and 3. Experimental data have been compared with literature data obtained with membranes made with different amorphous perfluoropolymer systems, such as copolymers of Perfluoro2, 2dimethyl dioxole (PDD) and Tetrafluorethylene, commercialized by the Du Pont Company with the trade name of Teflon AF. An interesting linear relationship between permeability and the glass transition temperature of the polymer constituting the membrane has been observed. Results are descussed in terms of polymer chain structure, which affects the presence of voids at molecular scale and their size distribution. Molecular Dyanmics studies are in progress in order to support the understanding of these results. A modified Theodoru- Suter method provided by the Amorphous Cell module of InsightII/Discover was used to determine the chain packing. A completely amorphous polymer box of about 3.5 nm was considered. Last but not least the use of amorphous perfluoropolymer membranes appears to be ideal when separation processes have to be performed in hostile environments, i.e. high temperatures and aggressive non-aqueous media, such as chemicals and solvents. In these cases Hyflon AD membranes can exploit the outstanding resistance of perfluoropolymers.

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The Effects of Coupling Agent and Crosslinking Agent in the Synthesis of Acrylic Pressure Sensitive Adhesive for Polarizer Film (편광필름용 아크릴 점착제의 합성에서 커플링제와 가교제의 효과)

  • Lim, Chang-Hyuk;Ryu, Hoon;Cho, Ur-Ryong
    • Polymer(Korea)
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    • v.33 no.4
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    • pp.319-325
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    • 2009
  • The solution polymerization was conducted to synthesize pressure sensitive adhesive for polarizer film using acrylic monomers. 2-Ethylhexylacrylate, butylacrylate, acrylic acid were used as acrylic monomers. The ratio was 2-ethylliexylacrylate:butylacrylate:acrylic acid=25:50:3.6 by reflecting $-40^{\circ}C$ of glass transition temperature in the pressure sensitive adhesive. When 1 wt% of coupling agent was added to the polymerized pressure sensitive adhesive, the light transmissivity was significantly increased. This result is due to the enhancement of adhesive power against liquid crystal cell by Si-O bond of coupling agents. Cross-linking agent was added by 0.5, 1.0, and 1.5 wt% with respect to the synthesized polymer. Initial tackiness decreased, while cohesion increased with increasing crosslinking agent. In the analysis of contact angle, the increase of crosslinking agents yielded the enhancement of surface energy, resulting in the decrease of contact angle. From the measurement of heat resistance, the acrylic pressure sensitive adhesive showed excellent heat resistance regardless of change in temperature and contents in crosslinking agent. In the observation of a cutting plane, the increased crosslinking agent represented a smoother and cleaner section. Comprehensively, the optimum additive amount of crosslinking agent was determined to be 1.0 wt% to monomer.

A Study on the Wetting Properties of UBM-coated Si-wafer (UBM(Under Bump Metallurgy)이 단면 증착된 Si-wafer의 젖음성에 관한 연구)

  • 홍순민;박재용;박창배;정재필;강춘식
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.2
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    • pp.55-62
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    • 2000
  • The wetting balance test was performed in an attempt to estimate the wetting properties of the UBM-coated Si-wafer on one side to the Sn-Pb solder. The wetting curves of the one and both side-coated UBM layers had the similar shape and the parameters characterizing the curve shape showed the similar transition tendency to the temperature. The wetting property estimation was possible with the new wettability indices from the wetting curves of one side-coated specimen; $F_{min}$, $F_{s}t_{s}$ and $t_s$. For UBM of Si-chip, Au/Cu/Cr UBM was better than Au/Ni/Ti in the point of wetting time. The contact angle of the one side coated Si-plate to the Sn-Pb solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

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