• Title/Summary/Keyword: contact interface

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Performances of $C_{60}$ based n-type Organic Thin Film Transistor with A Doped Interlayer Using Bathophenanthroline (Bathophenanthroline를 interlayer로 적용한 $C_{60}$ 기반의 n형 유기박막트랜지스터의 성능)

  • Kim, Jeong-Su;Son, Hee-Geon;Yi, Moon-Suk
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.8
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    • pp.7-12
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    • 2010
  • In this paper, $C_{60}$ based Organic thin film transistor OTFTs) have been fabricated using BPhen(Bathophenanthroline) and BPhen doped with Cs interlayers between $C_{60}$ active layer and Al electrodes to improve the electrical performance. The addition of the BPhen layer resulted in enhanced performances by reducing surface roughness between organic-metal interface. And the contact resistance was reduced by using the BPhen doped with Cs interlayer with co-evaporation method. These performances suggests that the $C_{60}$ based OTFT with BPhen doped with Cs interlayer is a promising application in the fabrication of n-type organic transistors.

Study of Plasma Polymerization on Wood Powder/PP Composites Interface (플라즈마 처리가 목분/폴리프로필렌 복합재의 계면에 미치는 영향 연구)

  • Ha, Jong-Rok;Kim, Byung Sun;Yi, Jin Woo
    • Composites Research
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    • v.26 no.3
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    • pp.170-174
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    • 2013
  • Atmospheric glow plasma polymerization was applied to wood powder before fabricating polypropylene (PP) matrix composites. Seven different types of monomers (Oxygen, Benzene, CH4, Acrylic-acid, Hexafluoroethane, Trifluorotolune, Hexamethyl-disiloxane) were analyzed to determine the most suitable precursor for plasma polymerization. The surface energy was calculated from measured contact angle about each monomer on PP. Hexamethyl-disiloxane (HMDSO) had a highest surface energy and is selected as the most suitable monomer. Wood powder and polypropylene were mixed as pellets by twin screw extruder and then 50 wt% wood powder/PP composites were produced by an injection machine. Tensile strength and Flexural strength have improved by 7.59% and 12.43% at the maximum respectively. SEM (Scanning Electron Microscope) observation on the fracture surface revealed that the plasma polymerization have improved the interfacial bonding and the mechanical properties of the composites.

Seasonal properties of airborne chlorides to the result of 3 year-measurement (3년간의 측정결과에 따른 비래염분의 계절별 특성)

  • Lee, Jong-Suk;Ahn, Ki-Hong;Kim, Do-Gyeum;Lee, Jang-Hwa
    • Proceedings of the Korea Concrete Institute Conference
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    • 2008.04a
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    • pp.573-576
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    • 2008
  • When the concrete structures are in contact with seawater, concentration of chloride for estimating chloride diffusion coefficient can be defined as the chloride concentration of sea water. However, in case the concrete structures, constructed in the seashore, aren't directly in contact with seawater, it is difficult to establish the interface concentration of chloride. In addition, marine concrete structures are greatly affected by salt attack such as rebar corrosion, among the cause of salt attack, airborne chlorides is primary factor. Therefore, in this study, salt attack environment by airborne chlorides was investigated in terms of a seasonal distribution at 72 spots, 27 areas in the East, West, South coast for 3 years from July '03 to June '06. Results indicated that in the East and South coast, the amount of the airborne chlorides is comparatively higher in summer, in the West coast, higher in winter according to the seasonal wind.

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Stereo-digital image correlation in the behavior investigation of CFRP-steel composite members

  • Dai, Yun-Tong;Wang, Hai-Tao;Ge, Tian-Yuan;Wu, Gang;Wan, Jian-Xiao;Cao, Shuang-Yin;Yang, Fu-Jun;He, Xiao-Yuan
    • Steel and Composite Structures
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    • v.23 no.6
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    • pp.727-736
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    • 2017
  • The application of carbon fiber reinforced polymer (CFRP) in steel structures primarily includes two categories, i.e., the bond-critical application and the contact-critical application. Debonding failure and buckling failure are the main failure modes for these two applications. Conventional electrometric techniques may not provide precise results because of the limitations associated with single-point contact measurements. A nondestructive full-field measurement technique is a valuable alternative to conventional methods. In this study, the digital image correlation (DIC) technique was adopted to investigate the bond behavior and buckling behavior of CFRP-steel composite members. The CFRP-to-steel bonded joint and the CFRP-strengthened square hollow section (SHS) steel column were tested to verify the suitability of the DIC technique. The stereo-DIC technique was utilized to measure continuous deformation. The bond-slip relationship of the CFRP-to-steel interface was derived using the DIC data. Additionally, a multi-camera DIC system consisting of four stereo-DIC subsystems was proposed and applied to the compressive test of CFRP-strengthened SHS steel column. The precise buckling location and CFRP delamination of the CFRP-strengthened SHS steel column were identified. The experimental results confirm that the stereo-DIC technique can provide effective measurements for investigating the behaviors of CFRP-steel composite members.

Parallel Computing Strategies for High-Speed Impact into Ceramic/Metal Plates (세라믹/금속판재의 고속충돌 파괴 유한요소 병렬 해석기법)

  • Moon, Ji-Joong;Kim, Seung-Jo;Lee, Min-Hyung
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.22 no.6
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    • pp.527-532
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    • 2009
  • In this paper simulations for the impact into ceramics and/or metal materials have been discussed. To model discrete nature for fracture and damage of brittle materials, we implemented cohesive-law fracture model with a node separation algorithm for the tensile failure and Mohr-Coulomb model for the compressive loading. The drawback of this scheme is that it requires a heavy computational time. This is because new nodes are generated continuously whenever a new crack surface is created. In order to reduce the amount of calculation, parallelization with MPI library has been implemented. For the high-speed impact problems, the mesh configuration and contact calculation changes continuously as time step advances and it causes unbalance of computational load of each processor. Dynamic load balancing technique which re-allocates the loading dynamically is used to achieve good parallel performance. Some impact problems have been simulated and the parallel performance and accuracy of the solutions are discussed.

A STUDY ON THE BONE FORMATION OF OPEN TYPE AND CLOSED TYPE IMPLANTS (개방형과 폐쇄형 임플랜트 매식후 주위골 형성에 관한 실험적 연구)

  • Kim Jeong-Ho;Yang Jae-Ho;Chung Hun-Young;Lee Sun-Hyung
    • The Journal of Korean Academy of Prosthodontics
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    • v.32 no.4
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    • pp.573-592
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    • 1994
  • A two-stage procedure is ideal for getting a successful osseointegration. But if a one-stage procedure can achieve a similar osseointegration, the one-stage procedure has several advantages. The purpose of this study was to observe the initial bone formation and bone remodeling of open type (nonsubmerged) and closed type (submerged) titanium implants. Eight ITI hollow-screws and eight Branemark fixtures were divided into two groups (submerged and nonsubmerged) and were installed on the lower jaws of four mongrel dogs. The animals were sacrificed three months later and bone sections with implants were processed for light microscopic and fluorescent microscopic observation. The results were as follows : 1 There was no significant difference in bone-to-implant contact between submerged and nonsubmerged implants. 2. Smooth surface titanium implants showed more bone-to-implant contact than that of titanium plasma coated implants histologically. 3. Under fluorescent microscopy, the active bone remodeling and new bone formation were observed in the interface zone. 4. Under fluorescent microscopy, submerged and nonsubmerged implants had no difference in bone remodeling pattern, and intramembranous bone formation was more prominent. 5. The connective tissue fibers orienting perpendicularly toward implant surface were oberved in the neck of implants.

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Electroplating process for the chip component external electrode

  • Lee, Jun-Ho
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2000.11a
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    • pp.1-2
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    • 2000
  • In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

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Stability Analysis of Concrete Plugs Installed in Pilot Tunnels for the Storage of Compressed Air (압축공기 저장용 파일롯 터널에 설치된 콘크리트 플러그의 안정성 해석)

  • Lee, Youn-Kyou;Song, Won-Kyoung;Park, Chul-Whan;Choi, Byung-Hee
    • Tunnel and Underground Space
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    • v.20 no.6
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    • pp.446-454
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    • 2010
  • CAES-G/T (Compressed Air Energy Storage - Gas Turbine) power generation is a likely option for the buffer facility stabilizing the fluctuation of the renewable powers, such as wind and solar powers. Considering the geological conditions, the underground CAES facility is most probable if the CAES-G/T generation is planed in Korea. In this kind of facility, a concrete plug is installed to seal the compressed air in the container, so that the selection of the shape and dimension of concrete plug could be a critical design factor. The stability evaluation of two types of plug was carried out by investigating the distribution of the factor of safety in the plugs and the distribution of contact pressure over the contact surface. The analysis result shows that the taper-shaped plug is more structurally stable than the wedge-shaped plug for the given geological condition. Possible separation of the rock-concrete interface around the spring line of the wedge-shaped plug is anticipated, which means the possible leakage of compressed air through the side wall and also means the poor mobilization of frictional resistance on that area.

Evaluation of Micro Crack Using Nonlinear Acoustic Effect (초음파의 비선형 특성을 이용한 미세균열 평가)

  • Lee, Tae-Hun;Jhang, Kyung-Young
    • Journal of the Korean Society for Nondestructive Testing
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    • v.28 no.4
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    • pp.352-357
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    • 2008
  • The detection of micro cracks in materials at the early stage of fracture is important in many structural safety assurance problems. The nonlinear ultrasonic technique (NUT) has been considered as a positive method for this, since it is more sensitive to micro crack than conventional linear ultrasonic methods. The basic principle is that the waveform is distorted by nonlinear stress-displacement relationship on the crack interface when the ultrasonic wave transmits through, and resultantly higher order harmonics are generated. This phenomenon is called the contact acoustic nonlinearity (CAN). The purpose of this paper is to prove the applicability of CAN experimentally by detection of micro fatigue crack artificailly initiated in Aluminum specimen. For this, we prepared fatigue specimens of Al6061 material with V-notch to initiate the crack, and the amplitude of second order harmonic was measured by scanning along the crack direction. From the results, we could see that the harmonic amplitude had good correlation with COD and it can be used to detect the crack depth in more accurately than the common 6 dB drop echo method.

Chemical Mechanical Polishing: A Selective Review of R&D Trends in Abrasive Particle Behaviors and Wafer Materials (화학기계적 연마기술 연구개발 동향: 입자 거동과 기판소재를 중심으로)

  • Lee, Hyunseop;Sung, In-Ha
    • Tribology and Lubricants
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    • v.35 no.5
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    • pp.274-285
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    • 2019
  • Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.