• 한국표면공학회지
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• 제25권6호
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• pp.309-317
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• 1992

Evaluation of electroplated gold has been carried out to obtain the data base for electrical, mechanical and environmental properties for telecommunication component applications. Gold plating was performed to a various thickness of $0.1\mu\textrm{m}$ to 1.$25\mu\textrm{m}$ after Ni plating of $3\mu\textrm{m}$ on C52100 bronze. Electrical properties were evaluated by measuring contact resistance using 4-wire method under static contact and dynamic contact during wear. Reciprocating wear test was performed to study the wear behavior as well as failure of gold contacts. Environmental characteristics were evaluated by using salt spray testing and SO2 test. Hardness of soft gold film was measured to be 53KHN under 5g load. Friction coefficient was initially obtained to be 0.15 and 0.25 under 100g and 200g loads respectively, and then raised up to 0.8 with increasing reciprocating wear cycles. Static contact resistance was 2 to 3m$\Omega$ regardless of gold film thickness while drastic changes of contact resistance were occured upon stripping of the gold film during wear. The lifetime of contact wear showing stable contact resistance increased up to 6 times for $1\mu\textrm{m}$ thickness compared to that of$ 0.1\mu\textrm{m}$ thickness under 100g load. All gold plating appeared to be stable under salt atmosphere while only the gold plating over 1$\mu\textrm{m}$ was stable under SO2 atmosphere.

• 한국정밀공학회지
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• 제24권5호
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• pp.44-55
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• 2007

The method for fatigue life prediction of ball bearing is proposed applying the algorithm of contact fatigue prediction based on stress analysis. In order to do this, a series of simulation such as initial surface stress analysis, EHL analysis, subsurface stress analysis and fatigue analysis are conducted from the loading at each ball location calculated for a bearing subjected to external bearing load and contact shape function. And uniaxial fatigue tests are performed to obtain fatigue parameter of AISI 52100 steel. It was found that since stress is usually higher at the inner raceway contact than at the outer raceway contact, fatigue failure occurs on the inner raceway first. When the fatigue life calculated in the stress-based method are compared with L50 life of L-P model, Crossland criterion for the radial load increment is similar to L50 life and Dang Van criterion for the axial load increment is similar. In the case of EHL contact, there is no difference of fatigue life between dry contact and EHL contact, when maximum Hertz pressure exceeds 2.5GPa.

• Tribology and Lubricants
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• 제30권3호
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• pp.146-155
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• 2014

In this study, we conduct fretting corrosion tests on tin-plated brass coupons to investigate the effect of temperature on fretting corrosion for various span amplitudes. We prepare a coupled fretting corrosion specimens using a tin-plated brass coupon with a thickness of $10{\mu}m$. One specimen is a flat coupon and the other specimen is a coupon with a protuberance in 1 mm radius, which is produced using 2 mm diameter steel ball. We conduct fretting corrosion tests at $25^{\circ}C$, $50^{\circ}C$, $75^{\circ}C$, $100^{\circ}C$ by rubbing the coupled coupons together at the contact between the flat and protuberance coupons. We measure electric resistance of the contact during the fretting corrosion test period. There is increase in resistance with fretting cycles. It is found that rate of increase in electric resistance becomes faster with increase in testing temperature. Magnitude of friction coefficient increases with fretting span amplitudes. And, change in friction coefficient becomes desensitized to the increment in span amplitude. Assuming that failure cycle is the cycle with an electric resistance of $0.01{\Omega}$, we find that failure lifetime ($N_f$) decreases with increase in testing temperature. Furthermore, based on the assumption that the damage rate of the connector is inversely related to the failure cycle, we calculate the activation energy for fretting damage to be 13.6 kJ/mole by using the Arrhenius equation. We propose a method to predict failure cycle at different temperatures for span amplitudes below $30{\mu}m$. Friction coefficients generally increase with increase in span amplitude and decrease in testing temperature.

• 콘크리트학회지
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• 제10권4호
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• pp.145-151
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• 1998

본 연구에서는 콘크리트 덧씌구기 보수체 손상의 주원인은 보수 모르타르와 기층 콘크리트 접촉면에서 발생되는 연직 응력, y, 으로 가정한 후 강우시 보수체의 온도변화에 따라서 이 응력의 크기를 조사하였다. 이 연직응력은 강우강도,보수 모르타르의 두께 및 종류를 변수로 하여 유한요소법을 사용하여 계산되었다. 강우강도는 강우빈도 nR= 1/a, 지속시간 tR=10min 및 60min을 가진 경우를 택하였으며, 보수층 두께, do,는 1, 2, 4, 10 cm 그리고 사용된 모르타트는 시멘트 모르타르(CM), 에폭시 시켄크 모르타르(ECM), 에폭시 모르타르(EM)의 세종류이었다. 본 연구결과 강우시 보수체 접촉면의 연직 인장응력 y 를 추정할 수 있는 공식이 유도되었다. 이 식을 이용하여 강우시 보수체의 온도변화로 인해 발생할 수 있는 접촉면의 파괴를 예방할 수 있는 보수재료의 성질 및 보수층의 두께가 결정될 수 있다.

• 한국재료학회지
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• 제22권10호
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• pp.545-551
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• 2012

In semiconductor manufacturing, the circuit integrity of packaged BGA devices is tested by measuring electrical resistance using test sockets. Test sockets have been reported to often fail earlier than the expected life-time due to high contact resistance. This has been attributed to the formation of Sn oxide films on the Au coating layer of the probe pins loaded on the socket. Similar to contact failure, and known as "fretting", this process widely occurs between two conductive surfaces due to the continual rupture and accumulation of oxide films. However, the failure mechanism at the probe pin differs from fretting. In this study, the microstructural processes and formation mechanisms of Sn oxide films developed on the probe pin surface were investigated. Failure analysis was conducted mainly by FIB-FESEM observations, along with EDX, AES, and XRD analyses. Soft and fresh Sn was found to be transferred repeatedly from the solder bump to the Au surface of the probe pins; it was then instantly oxidized to SnO. The $SnO_2$ phase is a more stable natural oxide, but SnO has been proved to grow on Sn thin film at low temperature (< $150^{\circ}C$). Further oxidation to $SnO_2$ is thought to be limited to 30%. The SnO film grew layer by layer up to 571 nm after testing of 50,500 cycles (1 nm/100 cycle). This resulted in the increase of contact resistance and thus of signal delay between the probe pin and the solder bump.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 추계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.116-118
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• 2003

This paper describes a Accelerated Life Test (ALT) with the electrical contact erosion suitable to the evaluations of high-reliability and durability devices such as magnetic contactor. Recently, an electrical devices company was interested in accelerated life test (ALT), the product liability (PL) and the short-term testing model of electrical life test (ELT). In order to estimate a model for testing fee and period, need to the statistical analysis method with the acceleration factor(AF). Usually customer/manufacturer regard their device failure to the over-current or heavy duty condition, while devices view shape of contact erosion owing to operational duty problem. In this paper, additional method of evaluation estimated the operated cycles by weight of contact erosion with a used of regression analysis by MINITAB.

• 한국세라믹학회지
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• 제54권1호
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• pp.66-69
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• 2017

In this study, the fabrication and electrical properties of aligned single-walled carbon nanotube (SWCNT) networks using a template-based fluidic assembly process are presented. This complementary metal-oxide-semiconductor (CMOS)-friendly process allows the formation of highly aligned lateral nanotube networks on $SiO_2/Si$ substrates, which can be easily integrated onto existing Si-based structures. To measure outstanding electrical properties of organized SWCNT devices, interfacial contact resistance between organized SWCNT devices and Ti/Au electrodes needs to be improved since conventional lithographic cleaning procedures are insufficient for the complete removal of lithographic residues in SWCNT network devices. Using optimized purification steps and controlled developing time, the interfacial contact resistance between SWCNTs and contact electrodes of Ti/Au is reached below 2% of the overall resistance in two-probe SWCNT platform. This structure can withstand current densities ${\sim}10^7A{\cdot}cm^{-2}$, equivalent to copper at similar dimensions. Also failure current density improves with decreasing network width.

• 대한기계학회논문집A
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• 제27권3호
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• pp.409-415
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• 2003

The purpose of this paper is to develop the 2-Dim Lagrangian Hydrocode for the analysis of large deformations of solids with implementation of the contact algorithm. First, th e governing equations are discretized into a system of algebraic equations. For more accurate and robust contact force computation. the defense node contact algorithm was adopted and implemented. For the verification of the code developed, two cases are carried out; the Taylor-Impact test and two bodies impact. The von -Mises criterion is implemented into the code with the Shock equation of state. The simulation results show a good agreement compared with the published experimental data and results from the commercial code. It is necessary to implement several material models and failure models for applications to different impact and penetration problems.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2000년도 학술대회논문집
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• pp.70-76
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• 2000

In the charge system, a contact type-convenient-charging method is insufficient because of the contact failure around moist environment and troublesome question to put in and pull out. For the solution of this problem, an electromagnetically coupled non-contact charger for the rechargeable cell is proposed using ZVS multi-resonant forward converter with synchronous rectifier. In this paper coupling coefficient(k), leaking inductance, coupling inductance and resonant frequency are observed for the air gap. By using the observed value, this circuit is designed and implemented. This proposed circuit is simulated by the PSPICE and experimented. The stress of a main switch and the output power are measured.

• 대한기계학회논문집A
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• 제32권5호
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• pp.430-436
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• 2008

This paper proposes a way to predict electrical lifetime of a relay using Accelerated Life Testings (ALTs). The relay of interest mounting on printed circuit boards is usually under an inrush current stress. The inrush current is generated and accelerated through controlling a lamp switching device in the ALT. We find that the dominant failure mechanism under high levels of inrush current would be contact welding in the contact surface of the relay and the contact welding process is accelerated according to increase in inrush current. The electrical lifetime model based on Inverse Power Law in term of inrush current is proposed, and parameters characterizing relay's lifetime distribution are statistically estimated using ALTA 6 PRO software.