• Title/Summary/Keyword: contact effect

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Analysis of Efficiency of Bacillus subtilis To Treat Bagasse Based Paper and Pulp Industry Wastewater-A Novel Approach

  • Karichappan, Thirugnanasambandham;Venkatachalam, Sivakumar;Jeganathan, Prakash Maran
    • Journal of the Korean Chemical Society
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    • v.58 no.2
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    • pp.198-204
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    • 2014
  • In this present study, bagasse based pulp and paper industry wastewater was treated under different operating conditions such as initial pH (6-8), temperature ($25-35^{\circ}C$) and contact time (3-7 days) by using Bacillus subtilis. Response surface methodology (RSM) coupled with Box-Behnken response surface design (BBD) was employed to investigate the effect of process variables on the responses such as turbidity, biological oxygen demand (BOD) and chemical oxygen demand (COD) removal. The experimental data were analyzed by Pareto analysis of variance (ANOVA) and the second order polynomial models were developed. Interactive effects of the process variables on the responses were studied using plotting 3D response surface contour graph and the optimum process conditions were found to be: initial pH of 7, temperature of $30^{\circ}C$ and contact time of 5 days. Under these conditions, removal efficiencies of turbidity, BOD and COD were found to be 85%, 93% and 80% respectively which are close agreement with real experiments. These results indicate that the treatment of bagasse based pulp and paper industry wastewater using Bacillus subtilis is an effective and novel technique.

Performance Optimization Study of FinFETs Considering Parasitic Capacitance and Resistance

  • An, TaeYoon;Choe, KyeongKeun;Kwon, Kee-Won;Kim, SoYoung
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.5
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    • pp.525-536
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    • 2014
  • Recently, the first generation of mass production of FinFET-based microprocessors has begun, and scaling of FinFET transistors is ongoing. Traditional capacitance and resistance models cannot be applied to nonplanar-gate transistors like FinFETs. Although scaling of nanoscale FinFETs may alleviate electrostatic limitations, parasitic capacitances and resistances increase owing to the increasing proximity of the source/drain (S/D) region and metal contact. In this paper, we develop analytical models of parasitic components of FinFETs that employ the raised source/drain structure and metal contact. The accuracy of the proposed model is verified with the results of a 3-D field solver, Raphael. We also investigate the effects of layout changes on the parasitic components and the current-gain cutoff frequency ($f_T$). The optimal FinFET layout design for RF performance is predicted using the proposed analytical models. The proposed analytical model can be implemented as a compact model for accurate circuit simulations.

Analyzing the Effect of Si Surface Morphology on Front Electrode Formation (전면 전극 형성 시 표면 형상이 미치는 영향 분석)

  • Han, Hyebin;Choi, Dongjin;Kang, Dongkyun;Park, HyunJung;Bae, Suhyun;Kang, Yoonmook;Lee, Hae-Seok
    • Current Photovoltaic Research
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    • v.7 no.4
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    • pp.130-133
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    • 2019
  • The Ag crystallite formed during the formation of the front electrode forms a contact between the metal of the electrode and the emitter of the cell. Contact between the electrode and emitter plays an important role in collecting electrons generated by the solar cell. Therefore, Ag crystallite formation is an important factor. In order for solar cells to have good characteristics, it is important to understand the factors influencing the Ag crystallite formation. Factors affecting the formation of Ag crystallites include Si emitter, morphology, Si defect and firing temperature. The influence of surface morphology on Ag crystallite formation was confirmed throughout this study. In the case of fine texturing, the Ag crystallites were formed at the pointed parts. The finer the texturing, the sharper areas and more Ag crystallites were formed. This was confirmed by SEM image and FF calculation.

Investigation of Weldline Strength with Various Heating Conditions (국부 금형가열에 조건에 따른 사출성형품 웰드라인의 강도 고찰)

  • Park, Keun;Sohn, Dong-Hwi;Seo, Young-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.1
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    • pp.105-112
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    • 2010
  • Weldlines are generated during the injection molding process when two or more melt flows are brought into contact. The weldlines are unavoidable in the cases of presence of holes or inserts, multi-gated delivery systems, significant thickness change, etc. At the welded contact region, a 'V'-shaped notch is formed on the surface of the molded part. This 'V'-notch deteriorates not only surface appearance but also mechanical strength of the molded part. To eliminate or reduce weldlines so as to improve the weldline strength, the mold temperature at the corresponding weld locations should be maintained higher than the glass transition temperature of the resin material. The present study implements high-frequency induction heating in order to rapidly raise mold surface temperature without a significant increase in cycle time. This induction heating enables to local mold heating so as to eliminate or reduce weldlines in an injection-molded plastic part. The effect of induction heating conditions on the weldline strength and surface appearance of an injection-molded part is investigated.

Estimation of Machinability of Lead Brass Based on In-Situ Observation in Scanning Electron Microscope (전자현미경 In-Situ 관찰방법을 이용한 황동의 절삭성평가)

  • Jung, Seung-Boo;Lim, Ok-Dong;An, Seong-Uk
    • Applied Microscopy
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    • v.24 no.3
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    • pp.87-93
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    • 1994
  • In order to elucidate the machinability of lead brass, orthogonal machining experiment was conducted in SEM(Scanning Electron Microscope) equipped with a micro-machining device at a cutting speed of $7{\mu}m/s$ for brass containing 0.2 to 3wt% Pb. The microfactors (i.e., shear angle, contact length between chip and tool) were determined by in-situ observations. Machinability of brass containing lead is discussed in terms of the microfactors and the cutting resistant force tested by lathe cutting. The dynamic behavior of the chip formation of lead brass during the machining process was examined: The chips of lead brass form as a shear angle type. The shear angle increases with the content of lead in (6:4) brass. The pronounced effect of lead on the contact length between chip and tool was observed above 1% Pb. The cutting resistant force tested by lathe decreases remarkably with the lead content in brass. The observed microfactors are in close relation to the tested resistant force in macromachining.

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Measurements of film thickness and temperature distribution in EHL point contact at high roll/slip ratios (높은 구름/미끄럼 비를 갖는 점 접촉 EHL 하에서의 온도분포와 유막 두께 분포의 측정)

  • Kim, Sung-Gi;Yagi, Kazuyuki;Nakahara, Tsunamitsu;Kyougoku, Keizi;Kim, Kyung-Woong
    • Proceedings of the KSME Conference
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    • 2001.06c
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    • pp.293-298
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    • 2001
  • In this paper, film thickness and temperature distribution are measured in EHL point contact at high roll/slip ratios. Infrared temperature mapping with two band pass filters, proposed by Ausherman (1976), is used to measure temperature distribution. And the optical interferometric method with two filters (red and green filters) is used to measure film thickness. Result of experiment showed that temperature rising at film and ball surface occurred very dramatically in Dimple zone. As slip velocity, roll/slip ratio and load increased, size of Dimple and temperature rising became more large. In addition, position and shape of Dimple were changed by roll/slip ratios, and increasing of Dimple size decreased traction coefficient. In short, it is appointed that the Dimple phenomenon be developed by the effect of viscosity wedge.

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Flow Phenomena in Micro-channel Filling Process (II) - Numerical Analysis - (마이크로 채널 충전 과정의 유동 현상 (II) - 수치 해석 -)

  • Kim, Dong-Sung;Lee, Kwang-Cheol;Kwon, Tai-Hun;Lee, Seung-S.
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.5
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    • pp.657-665
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    • 2003
  • Several interesting results were obtained from the flow visualization experiment in the accompanying paper, Part I. in the present study, Part II, a numerical study has been carried out to explain the detailed flow phenomena in micro-channel filling process. Hele-Shaw flow approximation was applied to the micro-channel geometry based on the small characteristic length. And surface tension effect has been introduced on the flow front as the boundary condition with the help of a dynamic contact angle concept between the melt front and the wall. A dimensional analysis for numerical results was carried out and a strong relationship between dimensionless pressure and Capillary number is obtained. The numerical analysis results are compared with the flow visualization experimental observations. And the numerical system developed in the present study seems to be able to predict the interesting micro-channel filling flow characteristics observed from experiments.

Load/Unload Dynamics of Slider on Ramp for Various Ramp Shape (램프 형상에 대한 램프 상의 로드/언로드 동특성 해석)

  • Lee, Yong-Hyun;Park, Kyoung-Su;Park, No-Cheol;Yang, Hyun-Seok;Park, Young-Pil
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2005.05a
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    • pp.467-472
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    • 2005
  • Load/Unload(L/UL) technology includes the benefits, that is, increased areal density, reduced power consumption and improved shock resistance contrary to contact start stop(CSS). It has been widely used in portable hard disk drive and will become the key technology for developing the small form factor hard disk drive. The main objectives of L/UL are no slider disk contact or no media damage. For realizing those, we must consider many design parameters in L/UL systems. In this paper, we focus on the effect of the ramp profile. We can find out the lateral velocities in L/UL process through experiments and simulations for force of voice coil motor and friction force on ramp. And then, we will gain the optimal design of ramp slope to maintain the minimum clearance of suspension dimple and slider with FE model. In special, after finding the point at which air bearing breaks and designing the ramp, we will identify the results for improving unload performance.

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Inorgainc fouling and it fouling reduction in direct contact membrane distillation process (직접 접촉식 막 증발공정에서 무기 막오염 특성 분석 및 저감방법)

  • Lee, Tae-Min;Kim, Seung-Hyun
    • Journal of Korean Society of Water and Wastewater
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    • v.34 no.2
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    • pp.115-125
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    • 2020
  • This study was aimed to examine inorganic fouling and fouling reduction method in direct contact membrane distillation(DCMD) process. Synthetic seawater of NaCl solution with CaCO3 and CaSO4 was used for this purpose. It was found in this study that both CaCO3 and CaSO4 precipitates formed at the membrane surface. More fouling was observed with CaSO4(anhydrite) and CaSO4·0.5H2O(bassanite) than CaSO4·2H2O(gypsum). CaCO3 and gypsum were detected at the membrane surface when concentrates of SWRO(seawater reverse osmosis) were treated by the DCMD process, while gypsum was found with MED(multi effect distillation) concentrates. Air backwash(inside to out) was found more effective in fouling reduction than air scouring.

Design and analysis of disk bump to Improve unloading performance (언로드 성능향상을 위한 디스크 범프의 디자인 및 해석)

  • Lee, Hyung-Jun;Lee, Yong-Hyun;Kim, Ki-Hoon;Park, No-Cheol;Park, Young-Pil
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2006.11a
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    • pp.140-143
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    • 2006
  • Load/Unload(L/UL) technology includes the benefits, that is, increased areal density, reduced power consumption and improved shock resistance. The main issues of L/UL are no slider-disk contact and no media damage. To make sure L/UL stability, we consider many design parameters in L/UL systems. This paper is focused on disk design parameters through designing a disk bump in outer guard band(OGB). In the case of bump design on the disk, we create a bump by changing bump design parameters as like size and amplitude. From dynamic analysis, we choose optimal bump model with the highest flying height and the longest rising time. When a slider passes over a bump in dynamic system, the slider rise above bump according to bump shape. On the basis of this rising effect on the bump, we apply bump design to classical L/UL system having slider-disk contact possibility. This study is based on the simulation, we finally realize improved slider unloading performance by applying slider dynamic result on unload simulation.

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