• Proceedings of the KSME Conference
• /
• 2007.05b
• /
• pp.2488-2493
• /
• 2007

A gap conductance is very important factor which can affect nuclear fuel temperature. Especially, in case of an annular fuel, a gap conductance effect can lead an unexpected heat split phenomena which is caused by a large difference of an inner and outer gap conductance. The gap conductance mechanism is very complicated behavior due to the its strong dependency on microscopic factors such as a contact surface roughness, local contact pressure and local temperature. In this paper, for the decision of test temperature and pressure range, a procedure and calculation results of in-reactor fuel temperature and pressure analysis are summarized which can be applied to test equipment design and determination of test matrix. Based upon analysis results, it is concluded that the minimum and maximum test temperature are $300^{\circ}C$ and $530^{\circ}C$ respectively, and the maximum pellet/cladding interfacial contact pressure should be observed up to 45MPa.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.6
• /
• pp.1008-1012
• /
• 2012

Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

• Nuclear Engineering and Technology
• /
• v.22 no.1
• /
• pp.75-81
• /
• 1990

Experiments to predict the thermal contact conductance between the fuel pellet and cladding have been performed, which is important to determine the temperature distibution within the fuel rod. UO$_2$and Zircaloy-2 are used in these experiments. The measuring apparatus is composed of a presser which controls the contact pressure, a thermometer with 5.5 sheathed thermocouples, a vacuum pump, pellet and cladding rods, and two heating devices, etc. The thermal contact conductances were measured with varying the contact pressure and surface roughnesses of UO$_2$and Zircaloy-2 bars. The results show that an increase in the contact pressure and a decrease of surface roughness resulted in increase of the thermal contact conductance. Finally, a fitting correlation has been established and compared with widely-used correlations.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1996.04a
• /
• pp.629-634
• /
• 1996

Heat generation in machine operating condition makes thermal deformation and thermalstress in the structure, which results in the change the contact characteristics of machine joint such s change of shrinkage fit, contact heat conductance and contact pressure. As the change of contact pressure is related to variation of static, dynamic and thermalcharacteristics, the prediction of transient contact perssure is strongly required. This paper presents some analytical results which will be effective to predict static and dynamic characteristics of the compound cylindrical structure.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.32 no.2
• /
• pp.149-157
• /
• 2008

During CVD process of semiconductor wafer fabrication, maintaining the uniformity of temperature distribution at wafer top surface is one of the key factors affecting the quality of final products. Effect of contact conductance between wafer and hot plate on predicted temperature of wafer was investigated. The validity of opaque wafer assumption was also examined by comparing the predicted results with Discrete Ordinate solutions accounting for semitransparent radiative characteristics of silicon. As the contact conductance increases predicted wafer temperature increases and the differences between maximum and minimum temperatures within wafer and between wafer and hot plate top surface temperatures decrease. The opaque assumption always overpredicted the wafer temperature compared to semitransparent calculation. The influences of surrounding reactor inner wall temperature and hot plate configuration are then discussed.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.654-654
• /
• 2013

One of the most important yet unresolved problems in molecular electronics is the controversy over the number and nature of multiple conductance peaks in single-molecule junctions. Currently, there are three competing explanations of this observation: (1) manifestation of different molecule-electrode contact geometries, (2) formation of gauche defects within the molecular core, (3) involvement of different electrode surface orientations [1]. However, the exact origin of multiple conductance peaks is not yet fully understood, which indicates our incomplete understanding of the scientifically as well as techno-logically important organic-metal contacts. To theoretically resolve this problem, we previously applied a multiscale computational approach that combines force fields molecular dynamics (FF MD), density functional theory (DFT), and matrix Green's function (MGF) calculations [2] to a thermally fluctuating haxanedithiol (C6DT) molecule stretched between flat Au(111) electrodes, but could observe only a single conductance peak [3]. In this presentation, using DFT geometry optimizations and MGF calculations, we consider molecular junctions with more realistic molecule-metal contact conformations and Au(111) electrode surface directions. We also conduct DFT-based molecular dynamics for the highly stretched junction models to confirm our conclusion. We conclude that the S-Au coordination number should be the more dominant factor than the electrode surface orientation.

• Journal of Korean Society for Atmospheric Environment
• /
• v.12 no.3
• /
• pp.263-268
• /
• 1996

This study was conducted for the assessment of the effects of acid rain and soil fertilizers on photosynthetic rate, was content, and contact angle on 5-year seedlings of Japanese red pine (Pinus densiflora Sieb. et Zucc.) leaves. The seedlings were exposed to pH 3.0 (simulated acid rain), pH 6.5 (groung water) and rain (pH around 4.6). The seedlings were also treated with $Ca(OH)_2, Mg(OH)_2, and Ca(OH)_2 + Mg(OH)_2 + C.F.(compound fertilizer)$. Photosynthetic rate, stomatal conductance, was content, contact angle value, and mineral nutrient content of the leaves were measured and the results were as follows: 1. Photosynthetic rate and stomatal conductance of the leaves increased with the increase of pH. Photosynthetic rate and stomatal conductance increased with application of soil fertilizer in the pH 3.0 treatment, but showed no changes in the rain and the pH 6.5. 2. Contact angle value and was content of the leaves did not change with the pH treatment, but increased with the fertilizer treatments. 3. Mineral nutrient contents of the leaves were lowest in the rain treatment and highest in the pH 6.5 treatment. The increase of mineral nutrient contents was observed with the soil fertilizer treatments.

• Progress in Superconductivity
• /
• v.3 no.2
• /
• pp.146-150
• /
• 2002

We performed the point contact spectroscopy on newly discovered superconductor $MgB_2$ thin films with Au tip. In the point contact spectroscopy of the metallic Sharvin limit, the differential conductance below the gap is twice as that above the gap by virtue of Andreev Reflection. After some surface cleaning processes of sample preparation such as ion-milling and wet etching, the obtained dI/dV versus voltage curves are relatively well fitted to the Blonder-Tinkham-Klapwijk (BTK) formalism. Gaps determined by this technique were distributed in the range of 3meV~ 8meV with the BCS value of 5.9meV in the weak coupling limit. We attribute these discrepancies to the symmetry of the gap parameter and the degradation of the surface of the sample. We also present the temperature dependence of the conductance vs voltage curve and thereby the temperature dependence of the gap.

• Applied Science and Convergence Technology
• /
• v.23 no.4
• /
• pp.192-199
• /
• 2014

The electronic property of graphene was investigated by hydrazine treatment. Hydrazine ($N_2H_4$) highly increases electron concentrations and up-shifts Fermi level of graphene based on significant shift of Dirac point to the negative gate voltage. We have observed contact resistance and channel length dependent mobility of graphene in the back-gated device after hydrazine monohydrate treatment and continuously monitored electrical characteristics under Nitrogen or air exposure. The contact resistance increases with hydrazine-treated and subsequent Nitrogen-exposed devices and reduces down in successive Air-exposed device to the similar level of pristine one. The channel conductance curve as a function of gate voltage in hole conduction regime keeps analogous value and shape even after Nitrogen/Air exposure specially whereas, in electron conduction regime change rate of conductance along with the level of conductance with gate voltage are decreased. Hydrazine could be utilized as the highly effective donor without degradation of mobility but the stability issue to be solved for future application.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.45 no.12
• /
• pp.1021-1030
• /
• 2017

This paper describes the algorithm of computing thermal contact conductance between unmatched grid interfaces for finite element thermal analysis. Because grid interfaces should be coincident with adjacent meshes for finite element method, large amount of man hours and huge computations are required to match interfaces between many numbers of complex subdomains. A novel method that distributes feasibly the conductances to interface nodes is proposed. The aims of the method are described, and details of the nodal conductance distribution algorithm with less dependency on meshes are represented. The algorithm can be applied both the flat and curved interfaces in 3 dimensional space, and proposed method can combined with many finite element application including thermal analysis.