• 한국생산제조학회지
• /
• 제5권2호
• /
• pp.20-28
• /
• 1996

Compound surface modeling is widely used for die cavities and punches. A compound surface is defined in 3-D space by specifying the topological relationship of several anlytic surface elements and a sculptured surface. A constructive solid gemonetry scheme is employed to model the analytic compound surface. the desired compound surface can be accomplished by specifying topological reationship in terms of boolean relations between pimitives and the sculptured surfaces. Additionally, a method is presented for checking and avoiding the tool interference occuued in machining the compound surface. Using this method. the interference of concave, convex, and side region can be checked easily and avoided rpapidly.

• 한국재료학회지
• /
• 제22권4호
• /
• pp.169-173
• /
• 2012

Recently, various attempts to produce a heat sink made of Al 6xxx alloys have been carried out using die-casting. In order to apply die-casting, the Al alloys should be verified for die-soldering ability with die steel. It is generally well known that both Fe and Mn contents have effects on decreasing die soldering, especially with aluminum alloys containing substantial amounts of Si. However, die soldering has not been widely studied for the low Si aluminum (1.0~2.0wt%) alloys. Therefore, in this study, an investigation was performed to consider how the soldering phenomena were affected by Fe and Mn contents in low Si aluminum alloys. Each aluminum alloy was melted and held at $680^{\circ}C$. Then, STD61 substrate was dipped for 2 hr in the melt. The specimens, which were air cooled, were observed using a scanning electron microscope and were line analyzed by an electron probe micro analyzer. The SEM results of the dipping soldering test showed an Al-Fe inter-metallic layer in the microstructure. With increasing Fe content up to 0.35%, the Al-Fe inter-metallic layer became thicker. In Al-1.0%Si alloy, the additional content of Mn also increased the thickness of the inter-metallic layer compared to that in the alloy without Mn. In addition, EPMA analysis showed that Al-Fe inter-metallic compounds such as $Al_2Fe$, $Al_3Fe$, and $Al_5Fe_2$ formed in the die soldering layers.

• 한국자동차공학회논문집
• /
• 제2권5호
• /
• pp.74-84
• /
• 1994

This paper discusses a method to generate the tool path for NC machining of automobile panel dies. The source data representing a panel die may be generated from digitizing machines, other CAD/CAM systems via IGES files, of compound surface models. From the source data, three types of interferencefree tool paths are generated automatically ; a parallel (Cartesian), an isometric, and a pencil cutting tool path. For the interference-free tool path, a polyhedral model composed of several triangles, and an 'offset triangle' approach are exploited. Finally, some practical examples are illustrated.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
• /
• pp.54-56
• /
• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• Journal of Microbiology
• /
• 제37권3호
• /
• pp.159-167
• /
• 1999

The effects of bicarbonate concentration, atmospheric carbon dioxide level, and reduced atmospheric oxygen on biomass and geosmin production and geosmin/biomass (G/B) values for Streptomyces halstedii, a producer of the off-flavor compound geosmin, were determined. In addition, a study was performed to determined possible synergistic relationships between a cyanobacterium, Oscillatoria tenuis UTEX #1566, and S. halstedii in the enhancement of actinomycete growth and/or geosmin production. These studies took into consideration those conditions that can occur during cyanobacterial bloom die-offs. Increasing bicarbonate concentration caused slight decreases in geosmin production and G/B for S. halstedii. Increasing atmospheric oxygen promoted geosmin production and G/B while lower oxygen levels resulted in a decrease in geosmin production and G/B by S. halstedii. Biomass production by S. halstedii was adversely affected by reduced oxygen levels while changes in bicarbonate concentration and atmospheric carbon dioxdie levels had little effect on biomass production. Sonicated cells of O. tenuis UTEX #1566 promoted biomass production by S. halstedii, and O. tenuis culture (cells and extracellular metabolites) and culture supernatnat (extracellular metabolites) each promoted geosmin and G/B yields for S. halstedii. In certain aquatic systems, environmental conditions resulting from cyanobacterial blooms and subsequent bloom die-offs could favor actinomycete growth and off-flavor compound by certain actinomycetes.

• Journal of Welding and Joining
• /
• 제16권4호
• /
• pp.92-97
• /
• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• 마이크로전자및패키징학회지
• /
• 제9권4호
• /
• pp.31-34
• /
• 2002

For the mold die sticking mechanism, the major explanation is that the silica as a filler in EMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesion strength. As the sticking behavior, however, showed strong dependency on the EMC models based on the experimental results from different semiconductor manufacturers, chemisorption or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2, N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

• Journal of Welding and Joining
• /
• 제18권2호
• /
• pp.222-222
• /
• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
• /
• 제18권2호
• /
• pp.95-99
• /
• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1993년도 추계학술대회 논문집
• /
• pp.101-105
• /
• 1993

When machining a die cavity, many machining conditions must be considered. Especially when using a NC machine, The tool interference is a improtant problem. In this paper, we consider the tool interference of free-formed surfaces and analytic compound surfaces which having free_formed base and many primitives and present a method checking the tool interference regions and avoiding them