• Journal of Korea Foundry Society
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• v.19 no.5
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• pp.410-418
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• 1999

To overcome the undesirable deformation, peeling off and geometrical restrictions which were mainly caused by differences in thermal expansion coefficients during the cladding of aluminum strip and stainless strip, new processing method based on vacuum die casting is designed and implemented in fabricating Fe-17wt%Cr steel (stainless steel). To increase cast-bonding ability, the surface of Fe-17wt%Cr steel is electrochemical etched to have optimum pit size (above 0.2 mm) and pit density (above 30%). The implementation of vacuum die casting by using surface treated stainless steel (Fe-17wt%Cr Steel) produces good trial products having acceptable cast-bonding ability. The enabling conditions for cast-bonding are pouring temperature $690^{\circ}C$, filling speed 30 m/sec and casting pressure $800\;kg/cm^2$. The microscopic observation of cast-bonded Al/Fe-17wt%Cr steel does not show any evidence of intermetallic compounds. The bonding strength of trial products is $150-400\;kg/cm^2$ and this is stronger than conventionally cladded metal having $30-70\;kg/cm^2$.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.5-8
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• 2005

In this paper, the electromechanical displacements of curved piezoelectric actuators composed of PZT ceramic and laminated composite materials are calculated based on high performance computing technology and the optimal configuration of composite curved actuator is examined. To accurately predict the local pre-stress in the device due to the mismatch in coefficients of thermal expansion, carbon-epoxy and glass-epoxy as well as PZT ceramic are numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers increases the number of degrees of freedom, large-scale structural analyses are performed through the PEGASUS supercomputer, which is installed in our laboratory. In the first stage, the curved shape of the actuator and the internal stress in each layer are obtained by the cured curvature analysis. Subsequently, the displacement due to the piezoelectric force (which is resulted from applied voltage) is also calculated. The performance of composite curved actuator is investigated by comparing the displacements obtained by the variation of thickness and elastic modulus of laminated composite layers. In order to consider the finite deformation in the first analysis stage and include the pre-stress due to curing process in the second stage, nonlinear finite element analyses are carried out.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04b
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• pp.65-68
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• 2002

The effect of low-temperature ZnO buffer layer has been investigated for the optical properties of ZnO thin films. ZnO buffers and thin films have been deposited using the pulsed laser deposition technique. ZnO buffer layers were grown at $200^{\circ}C$ with various thickness of 0 to 60 nm, followed by raising the substrate temperature to $400^{\circ}C$ to grow $2{\mu}m$ ZnO thin films. The buffer layers could relax stresses induced by the lattice mismatch and different thermal expansion coefficients between ZnO thin films and sapphire substrate. In order to identify the optical properties of ZnO thin films, PL measurement was used. From the results of PL measurement, all the fabricated ZnO thin films with buffer layers have shown intensive UV emission with a narrow linewidth. ZnO thin films with buffer layer of 20 nm have shown the strongest UV emission. It was found that the use of ZnO buffer layer plays an important role to improve the intensive UV emission of the ZnO thin films.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.186-191
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• 2001

Tensile residual stress happen by difference of coefficients of thermal expansion between fiber and matrix is one of the serious problems in metal matrix composite(MMC). In this study, TiNi alloy fiber was used to solve the problem of the tensile residual stress as the reinforced material. TiNi alloy fiber improves the tensile strength of composite by occurring compressive residual stress in matrix using shape memory effect of it. Pre-strain was added to generate compressive residual stress inside TiNi/A16061 shape memory alloy(SMA) composite. It was also evaluated the effect of compressive residual stress corresponding to pre-strains variation and volume fraction of TiNi alloy. AE technique was used to clarify the microscopic damage behavior at high temperature and the effect of pre-strain difference of TiNi/A16061 SMA composite. In addition, two dimensional AE source location technique was applied to inspect the crack initiation and propagation in composite.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.275-282
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• 2002

Tensile residual stress happen by difference of coefficients of thermal expansion between fiber and matrix is one of the serious problems in metal matrix composite(MMC). In this study, TiNi fiber was used to solve the tensile residual stress as the reinforced material. TiNi fiber improves the tensile strength of composite by occurring compressive residual stress in matrix using shape memory effect of it. Pre-strain was added to generate compressive residual stress inside TiNi/A16061 composite. It was also evaluated the effect of compressive residual stress corresponding to pre-strains variation. AE technique was used to clarify the microscopic damage behavior at high temperature and the effect of pre-strain difference of TiNi/A16061 shape memory alloy composite.

• Journal of Powder Materials
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• v.20 no.6
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• pp.425-431
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• 2013

Microstructural and mechanical properties of Ni-YSZ fabricated using SPS processing have been investigated at various sintering temperatures. Our study shows samples to be applied as a SOFC anode have the proper porosity of 40% and high hardness when processed at $1100^{\circ}C$. These results are comparable to the values obtained at $100-200^{\circ}C$ higher sintering temperature reported by others. This result is important because when the fabrication processes are performed above $1100^{\circ}C$, the mechanical property starts to decrease drastically. This is caused by the fast grain coarsening at the higher temperature, which initiates a mismatch between thermal expansion coefficients of Ni and YSZ and induces cracks as well.

• Journal of Sensor Science and Technology
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• v.18 no.5
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• pp.343-348
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• 2009

$NiO{\cdot}(Co_{0.25}Mn_{0.75})_2O_3$(Mn-Ni-Co) and $Ba_{0.5}Sr_{0.5}TiO_3$(BST) thick films were screen printed on Pt patterned alumina substrate to investigate the effects of sintering temperature on humidity and temperature sensing properties of ceramic sensors. A raise in sintering temperature increased resistance and B constant of the Mn-Ni-Co temperature sensor. This may have derived from the synergic effects of the reduction in charge carriers caused by the substitution of Co for Mn as well as the formation of microcracks from the difference in thermal expansion coefficients. Dependence of resistance on humidity of the Mn-Ni-Co temperature sensor, however, was not found. BST films sintered at temperatures in the range of $1100^{\circ}C$ to $1150^{\circ}C$ showed excellent humidity sensing properties. The BST humidity sensor was faster in its response than the Mn-Ni-Co temperature sensor. The humidity sensor, however, proved to be unstable under various temperatures, suggesting a need for a temperature stabilizing device. In contrast, the Mn-Ni-Co temperature sensor was stable under humid conditions.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.11
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• pp.82-87
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• 1999

To temperature-compensate the Bragg wavelength of fiber grating filters two materials with different thermal expansion coefficients were depolyed for packaging. After temperature-compensation packaging the maximum difference of the Bragg wavelength in the temperature range of $-10^{\circ}C$ to $70^{\circ}C$ was 0.03nm, which is only about one thirtiety of the Bragg wavelength shift of the temperature-uncompensated fiber grating filter.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.72-77
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• 2001

Tensile residual stress happen by difference of coefficients of thermal expansion between fiber and matrix is one of the serious problems in metal matrix composite(MMC). In this study, TiNi fiber was used to solve the tensile residual stress as the reinforced material. TiNi fiber improves the tensile strength of composite by occurring compressive residual stress in matrix using shape memory effect of it. Pre-strain was added to generate compressive residual stress inside TiNi/A16061 composite. It was also evaluated the effect of compressive residual stress corresponding to pre-strains variation. AE technique was used to clarify the microscopic damage behavior at high temperature and the effect of pre-strain difference of TiNi/A16061 shape memory alloy composite.