• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.63-70
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• 2023

Today, the importance of power semiconductors continues to increase due to serious environmental pollution and the importance of energy. Particularly, SiC-MOSFET, which is one of the wide bandgap (WBG) devices, has excellent high voltage characteristics and is very important. However, since the electrical properties of SiC-MOSFET are heatsensitive, thermal management through a package is necessary. In this paper, we propose an insulated metal substrate (IMS) method rather than a direct bonded copper (DBC) substrate method used in conventional power semiconductors. IMS is easier to process than DBC and has a high coefficient of thermal expansion (CTE), which is excellent in terms of cost and reliability. Although the thermal conductivity of the dielectric film, which is an insulating layer of IMS, is low, the low thermal conductivity can be sufficiently overcome by allowing a process to be very thin. Electric-thermal co-simulation was carried out in this study to confirm this, and DBC substrate and IMS were manufactured and experimented for verification.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.6
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• pp.199-209
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• 2000

Particles reinforced MMCs have higher specific modulus, higher specific strength, better properties at elevated temperatures and better wear resistance than monolithic metals. But the coefficient of thermal expansion(CTE) of Al6061 is 5 times larger than that of SiCp. The discrepancy of CTE makes some residual stresses inside of MMCs. This work investigates Si$C_p$/Al6061 composites at high temperatures in the microscopic view by three-dimensional elasto-plastic finite element analyses and compares the analytical results with the experimental ones. The theoretical model is not able to consider the nonuniform shape of particle. So the shape of particle is assumed to be perfect global shape. And also particle distribution is not homogeneous in experimental specimen. It is assumed to be homogeneous in simulation model. The type of particle distribution is face-centered cubic array(FCC array). Furthermore, non-homogeneous distribution is modeled by combination of several volume fractions.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.150-152
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• 2007

It has been known that the underfilling technique is effective in reducing thermal and environmental stress concentration at solder joint in FC asscemblies. In this paper, the effect of thermomechanical properties of underfill such as coefficient of thermal expansion(CTE) and Young's modulus on reliability of FC assembly under thermal cycling was investigated. For parametric study for optimal design of underfill, finite element analyses(FEA) were performed for seven different CTEs and five different Young's modulus. The results show that the concentrated maximum stress decreases as Young's modulus of underfill increases and the CTE of underfill decreases.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.10
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• pp.21-26
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• 2003

In this research, the change of coefficient of thermal expansion (CTE) of graphite/epoxy composite laminate under space environment was measured using fiber optic sensors. Two fiber Bragg grating (FBG) sensors have been adopted for the simultaneous measurement of thermal strain and temperature. Low Earth Orbit (LEO) conditions with high vacuum, ultraviolet and thermal cycling environments were simulated in a thermal vacuum chamber. As a pre-test, a FBG temperature sensor was calibrated and a FBG strain sensor was verified through the comparison with the electric strain gauge (ESG) attached on an aluminun specimen at high and low temperature respectively. The change of the CTE in a composite laminate exposed to space environment was measured for intervals of aging cycles in real time. As a whole, there was no abrupt change of the CTE after 1000 aging cycles. After aging, however, the CTE decreased a Little all over the test temperature range. These changes are caused by outgassing, moisture desorption, matrix cracking etc.

• International Journal of Aeronautical and Space Sciences
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• v.18 no.2
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• pp.206-214
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• 2017

In this study, measurement of thermophysical properties of materials at high temperatures was performed. This experiment employed a heater device to heat the material to a high temperature. The images of the specimen surface due to thermal load at various temperatures were recorded using charge-coupled device (CCD) cameras. Afterwards, the full-field thermal deformation of the specimen was determined using the digital image correlation (DIC) method. The capability and accuracy of the proposed technique are verified by two experiments: (1) thermal deformation and strain measurement of a stainless steel specimen that was heated to $590^{\circ}C$ and (2) thermal expansion and thermal contraction measurements of specimen in the process of heating and cooling. This research focused on two goals: first, obtaining the temperature dependence of the coefficient of thermal expansion, which can be used as data input for finite element simulation; and second, investigating the capability of the DIC method in measuring full-field thermal deformation and strain. The results of the measured coefficient of thermal expansion were close to the values available in the handbook. The measurement results were in good agreement with finite element method simulation results. The results reveal that DIC is an effective and accurate technique for measuring full-field high-temperature thermal strain in engineering fields such as aerospace engineering.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.5
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• pp.657-664
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• 2013

By using shear mixing and ultrasonication, we fabricated specimens of well-dispersed multi-walled carbon nanotube composites. To confirm the proper dispersion of the filler, we used scanning electron microscopy images for quantitative evaluation and a tensile test for qualitative assessment. Furthermore, the coefficients of thermal expansion of several specimens having different filler contents were calculated from the measured thermal strains and temperatures of the specimens. Based on the microscopy images of the well-dispersed fillers and the small deviations in the measurements of the tensile strength and stiffness, we confirmed the proper dispersion of nanotubes in the epoxy. As the filler contents were increased, the values of tensile strength increased from 58.33 to 68.81 MPa, and those of stiffness increased from 2.93 to 3.27 GPa. At the same time, the coefficients of thermal expansion decreased. This implies better thermal stability of the specimen.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.178-181
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• 2004

In this work, the carbon fabric reinforced phenolic composite is applied for heavy-duty journal bearings. The through thickness compressive strength (TTCS), which is one of the most important characteristics for the bearing material, is measured and analyzed with respect to the stacking sequence and composite thickness. Also, the coefficient of thermal expansion (CTE) and thermal conductivity of the composite in the thickness direction were measured with respect to stacking sequence.

• Korean Journal of Materials Research
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• v.19 no.12
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• pp.686-691
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• 2009

The effects of thermal properties on the crystallization behavior of $CaMgSi_2O_6$ glass-ceramics were investigated as a function of sintering temperature from 800$^{\circ}C$ to 900$^{\circ}C$. The crystallization behavior of the specimens depended on the sintering temperature, which could be evaluated from the differential thermal analysis, X-ray diffraction and Fourier transform infrared spectroscopy. With increasing sintering temperature, the thermal conductivity of the sintered specimens increased, while the coefficient of thermal expansion (CTE) of the sintered specimens decreased. These results could be attributed to the increase of crystallization, confirmed from the estimation by density measurements. Also, the thermal diffusivity and specific heat capacity of the sintered specimens were discussed with relation to the sintering temperature. Typically, a thermal conductivity of 3.084 $W/m^{\circ}C$, CTE of 8.049 $ppm/^{\circ}C$, thermal diffusivity of 1.389 $mm^2/s$ and specific heat capacity of 0.752 $J/g^{\circ}C$ were obtained for $CaMgSi_2O_6$ specimens sintered at 900$^{\circ}C$ for 5 h.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.