• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.60-63
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• 1993

We have prepared n-CdS/p-InP hetero- junction solar cells by thermal evaporation. The efficiency under the optium conditions without the grid line contact was 7.3%, and the solar cell having glid line contact with SiO AR coating was the open circuit voltage of 0.71V, the short circuit voltage current density of 15mA/cm$^2$, the fill factor of 0.73, and the efficiency of 11.5%. As result of photoresponse in 400-1000nm wavelength the cutoff of n-CdS/p-InP solar at 500nm results from absorption by the CdS \"window\" and the cutoff at 930 nm result from absorption by the InP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.377-380
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• 2001

The BST thin films to composite (Ba$\sub$x/Sr$\sub$l-x/)TiO$_3$ using sol-gel method were fabricated on Pt/Ti/SiO$_2$/Si substrate. The thin film capacitor to be ferroelectric materials was investigated by structural and electrical properties. BST solution was composited by moi ratio, and then spin-coated (from 3 times to 5 times coating on Pt/SiO$_2$/Si substrate. Thickness of BST ceramics thin films are about 2600∼2800[${\AA}$] in 3 times deposition. The property of leakage current was stable when the applied voltage was 3[V]. Leakage current of 3 times coated BST thin film was 10$\^$-9/∼10$\^$-11/[A] at 0∼3[V].

• Transactions on Electrical and Electronic Materials
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• v.4 no.3
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• pp.29-33
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• 2003

Tri-crystalline silicon wafers have three different orientations and three-grain boundaries. In this paper, tri-crystalline silicon (tri-Si) wafers have been used for the fabrication of buried contact solar cells. The optical and micro-structural properties of these cells after texturing in KOH solution have been investigated and compared with those of cast mult- crystalline silicon (multi-Si) wafers. We employed a cost effective fabrication process and achieved buried contact solar cell (BCSC) energy conversion efficiencies up to $15\%$ whereas the cast multi-Si wafer has efficiency around $14\%$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.988-991
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• 2002

ITO (Indium Tin Oxide) powder was synthesized by precipitation method. ITO colloidal solutions for coating on glass were fabricated by ball milling method. ITO colloidal solution with variation of concentration from 2% to 15% were fabricated ITO thin film measured sheet resistance and transmittance. In the result, 15% sol showed the lowest value of sheet resistance, 2% sol showed the highest value of transmittance. In addition, effect of annealing temperature and $SiO_2$ film were investigated.

• Journal of Surface Science and Engineering
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• v.34 no.3
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• pp.258-263
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• 2001

Siloxane thin films were fabricated on a silicon wafer by spin-coating using a siloxane solution made by the sol-gel process. Fluorine was doped using$ CF_4$ plasma treatment. The film was then annealed in-situ state in the nitrogen atmosphere. In order to examine the influence of annealing and fluorine doping on the siloxane thin film, thermogravimetric-differential thermal analysis (TG-DTA), Fourier transform-infrared spectroscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS) were used and the dielectric constant was determined by the high-frequency capacitance-voltage method. Stable siloxane films could be obtained by in-situ annealing in a nitrogen atmosphere after $CF_4$ plasma treatment, and the dielectric value of the film was $\varepsilon$ 2.5.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.49-49
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• 2002

독립된 티타늄(Ti)과 실리콘(Si) 타켓을 사용하여 DC reactive magnetron co-sputtering 공 정으로 Ti-Si-N 코탱막을 SKD 11 합금강위에 합성하였다. 고분해능 TEM 및 XPS 분석들로부터 Ti-Si-N 코탱막은 나노미터 크기의 TiN결정체들이 비정질 Si3N4 기지에 분산된 나노복합체의 마세구조를 냐타내었다. 코탱막의 경도는 11 at.%의 Si 함량에서 39 GPa의 최 고 경도값을 나타내었고 이 경우 미셰조직은 5nm 크기의 미세한 TiN 결정이 비정절상의 기지에 균일하게 분포된 특성을 보였다 .. Ti-Si-N 박막내에 Si 함량이 증가할수록 TiN 결정 상들은 다배향성을 나타내었고 크기가 감소하였으며 비정질상에 의해 완전히 둘려싸언 형상 으로 변화하였다. 높은 Si 함량에서는 질소 소스의 부족현상에 의하여 코팅막내에서 free Si 가 나타났다. 상대습도가 증가함에 따라 Ti-Si-N 코탱막의 마찰계수와 마모량이 현저하게 감소하였다. 강재에 대한 Ti-Si-N 코팅막의 마모거동에 있어서 Si02 냐 Si(OH)2 같은 얇은 윤활막의 형성이 중요한 역할을 하는 것으로 판단되어졌다.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.235-235
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• 2006

Triphenylamine derivatives play important roles as hole transporting materials in organic light emitting devices. However, low molecular weight triphenylamine derivatives show low glass transition temperature and aggregation behavior, and the vapor deposition step of low molecular weight materials is incompatible with large area display fabrication. Conventional polymer PEDOT-PSS HTL has serious drawbacks such as the ITO anode corrosion, poor surface energy match with aromatic EMLs. To solve these problems, we introduced crosslinkable units to triphenylamine-based polymers to make insoluble HTL by thermal curing following spin-coating. Electrochemical and optical properties of the new hole transporting materials were investigated. In addition, the device characteristics obtained with new hole transporting polymers were investigated in details.

• Corrosion Science and Technology
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• v.3 no.3
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• pp.107-111
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• 2004

Corrosion resistance of coating system consisting of zinc-rich primer (ZRP) and topcoat based on polyurethane resin with the presence of 3-aminopropyl-triethoxysilan (APS) and 2-(benzothialylthio) succinic acid (BSA) was studied by electrochemical impedance and wet adhesion. The interface metal/primer/topcoat was analyzed by scanning electronic microscopy. It was found that the presence of APS and BSA improved adhesion and barrier property of the topcoats.

• Bulletin of the Korean Chemical Society
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• v.35 no.3
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• pp.871-874
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• 2014

Monodispersed carbon nanospheres (CNSs) were fabricated by a novel method and their structural properties were investigated. CNSs were prepared by the pyrolysis of nanospherical polystyrenes (PS). With the coating of $SiO_2$ shell, PS particles were effectively separated during pyrolysis process which resulted to CNSs with an average diameter of 40 nm. Moreover, CNSs could be crosslinked with each other through the bondings between the functional groups on their surfaces. Morphology of the fabricated carbon spheres and their crosslinked form were characterized by X-ray diffraction (XRD), field-emission scanning electron microscopy (FESEM), transmission electron microscopy (TEM), and fourier transform infrared spectroscopy (FT-IR).

• Korean Journal of Materials Research
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• v.12 no.8
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• pp.676-681
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• 2002

Microstructure, mechanical properties, and oxidation resistance of TiAIN thin films deposited on quenched and tempered STD61 tool steel by arc ion plating were studied using XRD, XPS and micro-balance. The TiAIN film was grown with the (200) orientation. The grain size of TiAIN thin film decreased with increasing Al contents, while chemical binding energy increased with Al contents. When hard coating films were oxidized at $850^{\circ}C$ in air, oxidation resistance of both TiN and TiCN films became relatively lower since the surface of films formed non-protective film such as $TiO_2$. However, oxidation resistance of TiAIN film was excellent because its surface formed protective layer such as $_A12$$O_3$ and $_Al2$$Ti_{7}$$O_{15}$, which suppressed oxygen intrusion.