• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.379-380
• /
• 2007

The characteristics of a co-sputtered indium zinc tin oxide (IZTO) films prepared by dual target dc magnetron sputtering from IZO and ITO targets at a room temperature are investigated. Film properties, such as sheet resistance, optical transmittance, surface work function and surface roughness were examined as a function of ITO dc power at constant IZO dc power of 100 W. It was shown that the increase of the ITO dc power during co-sputtering of ITO and IZO target resulted in an increase of sheet resistance of the IZTO films. This can be attributed to high resistivity of ITO film prepared at room temperature. Surface smoothness and roughness were investigated by Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM). The synchrotron x-ray scattering results obtained from IZTO film with different ITO contents showed that introduction of ITO atoms into amorphous IZO film resulted in a crystallization of IZTO film with (222) preferred orientation due to low alc transition temperature of ITO film. However, the transmittance of the IZTO films with thickness of 150 nm is between 80 and 85 % at wavelength of 550 nm regardless of ITO content. Possible mechanism to explain the ITO and IZO co-sputtering effect on properties of IZTO is suggested.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제50권1호
• /
• pp.11-16
• /
• 2001

CuNi alloy films are deposited by co-sputtering of dual targets (Cu and Ni, respectively). Effects of the co-sputtering conditions, such as powers applied to the targets, deposition pressures, and substrate temperatures, on the structural and electrical properties of deposited films are systematically investigated. The composition ratio of Ni/Cu is almost linearly decreased by increasing the DC power applied to the Cu target from 25.6 W to 69.7 W with the RF power applied to the Ni target unchanged(140 W). it is noted that the chamber pressure during deposition and the film thickness give rise to a change of the Ni/Cu ratio within the films deposited. The former may be due to a higher sputtering yield of Cu atom and the latter due to the re-sputtering phenomenon of Cu atoms on the surface of deposited film. The film deposited at higher pressures or at lower substrate temperatures have a smaller crystallite size, a higher electrical resistivity, and much more voids. This may be attributed to a lower surface mobility of sputtered atoms over the substrate.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2001년도 추계 학술발표강연 및 논문개요집
• /
• pp.153-153
• /
• 2001

• 한국자기학회지
• /
• 제5권5호
• /
• pp.461-464
• /
• 1995

We have investigated the effects of sputtering Ar gas pressure on magnetic anisotropy of Co/Pt multilayers, where sputtering Ar gas pressure was varied from 2 to 20 mTorr. The surface and volume anisotropies were found to be strongly dependent on sputtering Ar gas pressure. In particular, the surface anisotropy exhibited more than fourfold enhancement as Ar pressure was decreased from 20 to 5 mTorr. We have found that the surface anisotropy was closely correlated with the low-angle x-ray diffraction intensity. We believe that these results are mainly ascribed to the variation of microstructure in the Co/Pt multilayer thin films with sputtering Ar gas pressure.

• Journal of information and communication convergence engineering
• /
• 제4권4호
• /
• pp.158-161
• /
• 2006

[ $Bi_2Sr_2Ca_nCu_{n+1}O_y(n{\geq}0)$ ] thin film is fabricatedvia two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제13권3호
• /
• pp.252-258
• /
• 2013

In this paper, a thermally stable nickel silicide technology using the co-sputtering of nickel and titanium atoms capped with TiN layer is proposed for nano-scale metal oxide semiconductor field effect transistor (MOSFET) applications. The effects of the incorporation of titanium ingredient in the co-sputtered Ni layer are characterized as a function of Ti sputtering power. The difference between the one-step rapid thermal process (RTP) and two-step RTP for the silicidation process has also been studied. It is shown that a certain proportion of titanium incorporation with two-step RTP has the best thermal stability for this structure.

• 한국재료학회지
• /
• 제4권7호
• /
• pp.767-774
• /
• 1994

The TbFeCo thin films were prepared by the magnetron sputtering system to investigate the effect of the base pressure, film thickness and pre sputtering on the oxidation of the films by analyzing the change of matneto optical properties and by AES depth profile. The films prepared by the facing targets sputtering system represented almost constant magneto optical properties independent of the base pressure resulting from the short flight distance of the sputtered particles. Also, the thin TbFeCo films represented better perpendicular anisotropy as the films thickness increased with pre sputtering. However, it was still needed a deposition rate higher than a certain critical deposition rate to obtain a perfect perpendicular anisotropy even at a very high film thickness.

• 한국재료학회지
• /
• 제5권4호
• /
• pp.476-482
• /
• 1995

TbFeCo 박막의 Facing Targets Sputtering System 조건, 조성 및 시효 처리에 따른 광자기적 특성과 산화 특성을 조사하였다. XPS와 AES를 통하여 보호막 없이 제조된 TbFeCo 박막의 표면에는 Co에 우선하여 Tb과 Fe가 안정한 산화물의 형태로 존재하며, 표면에서 3.2nm 깊이부터는 산화되지 않은 TbFeCo 박막이 존재함을 확인하였다. TbFeCo 박막을 시효 시킴에 따라 Fe 산화층의 두께는 거의 변화가 없었으며, Tb Oxide 층만이 증가하였다. TbFeCo 박막은 사용된 기판의 종류나 제조조건에 따라 열적 안정성에 큰 차이를 보였다.

• 한국진공학회지
• /
• 제2권2호
• /
• pp.152-160
• /
• 1993

본 연구에서는 DC magnetron sputtering 장비를 이용하여, GdFe, Co, CoCr 박막을 제작함에 있어서 sputtering 조건에 관계되는 Ar 압력, 투입전력, 기판의 종류 등의 요소가 박막의 특성, 특히 보자력과 미세구조에 미치는 영향을 관찰하였다. GdFe의 경우 성막속도가 증가함에 따라 Gd의 atomic%가 줄어드는 것을 알 수 있었으며, Ar압력이 증가함에 따라 성막속도는 감소하였고, 투입전력이 증가함에 따라 성막속도는 거의 선형적으로 증가함을 알 수 있다. 또한 투입전력이 증가함에 따라 박막의 보자력도 증가함을 알 수 있었다. Co 박막에 대해서는 투입전력과 Ar 압력에 관한 성막속도와 미세구조에 관하여 관찰하였다. 이로써 투입전력이 증가하면 성막속도가 증가하며 결정립의 크기가 감소함을 알 수 있었고, Ar 압력이 증가하면 성막속도가 감소함을 알 수 있었다. CoCr의 박막에서는 substrate 종류에 따라 보자력 및 미세구조에 미치는 영향에 대해 연구를 행하였으며, substrate의 종류가 미세구조와 보자력에 상당한 영향을 준다는 것을 알 수 있었다.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
• /
• pp.29-29
• /
• 1994