• Title/Summary/Keyword: co-fired

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LTCC-M모듈의 신뢰성설계 사례

  • Park, Jung-Won;Park, Hoon
    • Proceedings of the Korean Reliability Society Conference
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    • 2000.04a
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    • pp.145-152
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    • 2000
  • 일반적으로 제품을 개발하는 과정은 구상단계(Concept/Planning Phase), 설계 및 개발단계 (Design/Development Phase), 생산단계(Production/Manufacturing Phase)로 나누어 볼 수 있는데, 제품의 신뢰성은 거의 70∼80%가 구상단계와 설계 및 개발단계에서 결정된다. 그러므로 높은 신뢰성을 갖는 제품을 개발하기 위해서는 구상단계와 설계 및 개발단계에서부터 신뢰성을 고려하여야 한다. 본 논문에서는 D전자(주)에서 산업기술시험원과 함께 구상단계와 설계 및 개발단계에서부터 신뢰성을 고려하여 개발한 LTCC-M(Low Temperature Co-fired Ceramic on Metal) 모듈의 신뢰성설계 사례를 기술하였다. 개발과정에 있어서 신뢰성설계 절차를 제시하고, 각 단계에 있어서 수행한 분석 및 평가 내용을 구체적으로 기술하였다.

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Circuit Modeling of Interdigitated Capacitors Fabricated by High-K LTCC Sheets

  • Kim, Kil-Han;Ahn, Min-Su;Kang, Jung-Han;Yun, Il-Gu
    • ETRI Journal
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    • v.28 no.2
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    • pp.182-190
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    • 2006
  • The circuit modeling of interdigitated capacitors fabricated by high-k low-temperature co-fired ceramic (LTCC) sheets was investigated. The s-parameters of each test structure were measured from 50 MHz to 10 GHz, and the modeling was performed using these measured sparameters up to the first resonant frequency. Each test structure was divided into appropriate building blocks. The equivalent circuit of each building block was composed based on the partial element equivalent circuit (PEEC) method. Modeling was executed to optimize the parameters in the equivalent circuit of each building block. The validity of the extracted parameters was verified by the predictive modeling for the test structures with different geometry. After that, Monte Carlo analysis and sensitivity analysis were performed based on the extracted parameters. The modeling methodology can allow a device designer to improve the yield and to save time and cost for the design and manufacturing of devices.

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Study on properties of CaO-MgO-$SiO_2$ system glass-ceramic for LTCC (CaO-MgO-$SiO_2$ 계 LTCC glass에 대한 특성 연구)

  • Chang, Myung-Whun;Ma, Won-Chul
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.322-322
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    • 2008
  • Low-temperature co-fired ceramics (LTCC) have turned out to be very promising technology in accordance with the rapid developments in semiconductor technology. The demands for compact electrical assemblies, smaller power loss as well as high signal density can be fulfilled by LTCC. And for the multi-layered ceramic devices with embedded passive components such as high dielectric constant decoupling capacitor, LTCC materials require the several conditions to avoid delamination and internal cracks. For the present study, diopside-based glass is chosen as the LTCC substrate material in view of its high coefficient of thermal expansion (CTE). From the experimental resultsn the influence of each element on the CTE change can be revealed.

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Implementation of Active Monopole Antenna with Embedded Bandpass Filters for Antenna (대역통과 필터가 내장된 능동 모노폴 안테나 구현)

  • Jang, Jin-Woo;Lee, Won-Taek;Kim, Joon-Il;Jee, Yong
    • Proceedings of the IEEK Conference
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    • 2007.07a
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    • pp.81-82
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    • 2007
  • This paper presents a WLAN band active monopole antenna which is made of a CPW-fed monopole antenna and a low noise amplifier implemented on single-layer low-temperature co-fired ceramic (LTCC) substrate. Planar active antenna measure return loss and power test. (drain voltage = 4V, gate voltage = -0.6V). The bandwidth, is 540MHz, return loss is -38dB.

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Soldering characteristics of Ag-Pd electrodes in relationship to differing particle size of LTCC substrate (LTCC 기판의 Particle Size 에 따른 Ag-Pd 전극의 Soldering 특성 변화)

  • 조현민;유명재;박종철
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.130-133
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    • 2002
  • Solder leaching resistance of the metal electrode is an important factor with regard to adhesion properties of ceramic substrate. In the Low Temperature Co-fired Ceramics (LTCC), Ag-Pd or Ag-Pt pastes are used instead of pure Ag paste to prevent leaching. Solder leaching behavior of the Ag-Pd paste in relation to LTCC raw material powder size was investigated. First fabrication of LTCC green tape with different particle size was done. LTCC substrates with Ag-Pd electrode were prepared using conventional multilayer ceramic process. Dipping test was performed to test solder leaching behavior of the electrode. Ag-Pd electrode on LTCC substrate with smaller particle size achieved higher solder leaching resistance.

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An Integrated LTCC Inductor and Its Application (LTCC 기술을 이용한 마이크로 인덕터 및 응용)

  • Kim Chan-Young;Kim Hee-Jun
    • The Transactions of the Korean Institute of Electrical Engineers B
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    • v.53 no.11
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    • pp.680-686
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    • 2004
  • An integrated inductor using the low temperature cofiring ceramics(LTCC) technology was fabricated. The inductor has Ag circular spiral coil with 16 turns (2-turn x 8-layer) and has a dimension of 11.52mm diameter and 0.71mm thick. For the fabricated inductor, calculation method of inductance was given and it is confirmed that the calculated value is very close to the measured one. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1.32W output power and 1MHz switching frequency using the inductor fabricated was developed. For the converter the maximum efficiency of about 81% was obtained.

Preparation of High Purity $SrTiO_3$ by Coprecipitation and Strontium Titanyl Oxalates (공심법과 (Sr-Ti)수산염에 의한 고순도의 $SrTiO_3$ 합성에 관한 연구)

  • 이종권;이병하
    • Journal of the Korean Ceramic Society
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    • v.20 no.2
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    • pp.107-114
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    • 1983
  • Formation of Strontium titanate from the products of coprecipitation takes place at 110$0^{\circ}C$ which is 200-30$0^{\circ}C$ lower than that from mechanical mixtures of $SrCO_3$ and $TiO_2$. This is apparently due to the nature of the compounds formed by the reaction of mixtures of aqueous solutions of $SrCl_2$ and $TiCl_4$ with an ammoniacal solution of ammoni-um carbonate and ammonium hydroxide. A procedure is described for preparing strontium titanyl oxalate tetrahydrate in the several mole ratio of $TiCl_4$ to $SrCl_2$. STrontium titanyl oxalates decompose to titanate at elevated temperature. The coprecipitates and the fired specimen were subjected to examined thermal and X-ray analyses and microstruc-ture by SEM.

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A Design of Balun-BPF for 2.45GHz Band of LTCC structure (LTCC Chip 형태의 2.45GHz 대역 Balun-BPF의 설계)

  • Jung, Eul-Young;Choi, Kyoung;Hwang, Hee-Yong
    • 한국정보통신설비학회:학술대회논문집
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    • 2005.08a
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    • pp.133-136
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    • 2005
  • This paper presents a LTCC Balun-BPF, which is a BPF(bandpass filter) with a Balun in a single LTCC chip for the direct interface with a MIC chip having balanced inputs. The physical dimension of the designed Balun-BPE is $2.4{\times}2.0{\times}0.88m^3$ and the used dielectric constant ${\varepsilon}_r$ is 36. A Balun of three-lines structure with striplines and a BPF of comb-line structure was combined into the Balun-BPF. The simulated result shows 4.8dB of insertion loss, $178{\sim}179$ degree of the phase imbalance, 14dB of the return

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An LTCC Inductor Embedding NiZn Ferrite and Its Application (NiZn 페라이트를 내장한 LTCC 인덕터 및 응용)

  • Won, Yu-June;Kim, Hee-Jun
    • The Transactions of the Korean Institute of Electrical Engineers B
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    • v.55 no.10
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    • pp.534-539
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    • 2006
  • An integrated inductor using the low-temperature co-fired ceramics(LTCC) technology for low-power electronics was fabricated. In the inductor NiZn ferrite sheet$({\mu}_r=230)$, was embedded to increase inductance. The inductor has Ag spiral coil with 14 turns$(7turns{\times}2layers)$, a dimension of 0.6mm in width, 10um in thickness, and 0.15mm pitch. To evaluate the inductance, including the parasitic resistance, the fabricated inductor was calculated and measured. It was confirmed that calculated values were very close to the measured values. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC boost DC/DC converter with 1W output power and up to 0.5MHz switching frequency using the inductor fabricated was developed.

Design of Multi-band Ceramic Chip Antenna for WLAN using LTCC Technology (LTCC 공정기술을 이용한 무선랜용 다중대역 칩 안테나 설계)

  • 박영호;이용기;이윤도;이상원;천창율
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.8
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    • pp.443-446
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    • 2004
  • In this paper, a multi-band ceramic chip antenna for WLAN(Wireless LAN) applications is designed. The design target is to obtain 0 dBi of coverage gain with omni directional radiation pattern. The antenna is fabricated using Low Temperature Co-fired Ceramic(LTCC) technology. The size of the chip antenna is $2.2{\times}9.65{\times}1.02$mm. The measured antenna gain is 1 dBi at 2.44 GHz and 0.5 dBi at 5.5 GHz. The omni directional radiation pattern for the two operating bands is obtained. The measured bandwidth(S11=-10 dB) are 90 MHz at 2.44 GHz and 1280 MHz at 5.5 GHz respectively