• Title/Summary/Keyword: circuit design

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Design of 77 GHz Automotive Radar System (77 GHz 차량용 레이더 시스템 설계)

  • Nam, Hyeong-Ki;Kang, Hyun-Sang;Song, Ui-Jong;Cui, Chenglin;Kim, Seong-Kyun;Nam, Sang-Wook;Kim, Byung-Sung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.9
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    • pp.936-943
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    • 2013
  • This work presents the design and measured results of the single channel automotive radar system for 76.5~77 GHz long range FMCW radar applications. The transmitter uses a commercial GaAs monolithic microwave integrated circuit(MMIC) and the receiver uses the down converter designed using 65 nm CMOS process. The output power of the transmitter is 10 dBm. The down converter chip can operate at low LO power as -8 dBm which is easily supplied from the transmitter output using a coupled line coupler. All MMICs are mounted on an aluminum jig which embeds the WR-10 waveguide. A microstrip to waveguide transition is designed to feed the embedded waveguide and finally high gain horn antennas. The overall size of the fabricated radar system is $80mm{\times}61mm{\times}21mm$. The radar system achieved an output power of 10 dBm, phase noise of -94 dBc/Hz at 1 MHz offset and a conversion gain of 12 dB.

A Study on Fabrication and Performance Evaluation of Wideband 2-Mode HPA for the Satellite Mobile Communications System (이동위성 통신용 광대역 2단 전력제어 HPA의 구현 및 성능평가에 관한 연구)

  • 전중성;김동일;배정철
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.3 no.3
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    • pp.517-531
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    • 1999
  • This paper presents the development of the 2-mode variable gain high power amplifier for a transmitter of INMARSAT-M operating at L-band(1626.5-1646.5 MHz). This SSPA(Solid State Power Amplifier) is amplified 42 dBm in high power mode and 36 dBm in low power mode for INMARSAT-M. The allowable error sets +1 dBm of an upper limit and -2 dBm of a lower limit, respectively. To simplify the fabrication process, the whole system is designed by two parts composed of a driving amplifier and a high power amplifier, The HP's MGA-64135 and Motorola's MRF-6401 are used for driving amplifier, and the ERICSSON's PTE-10114 and PTF-10021 are used the high power amplifier. The SSPA was fabricated by the circuits of RF, temperature compensation and 2-mode gain control circuit in aluminum housing. The gain control method was proposed by controlling the voltage for the 2-mode. In addition, It has been experimentally verified that the gain is controlled for single tone signal as well as two tone signals. The realized SSPA has 42 dB and 36 dB for small signal gain within 20 MHz bandwidth, and the VSWR of input and output port is less than 1.5:1 The minimum value of the 1 dB compression point gets 5 dBm for 2-mode variable gain high power amplifier. A typical two tone intermodulation point has 32.5 dBc maximum which is single carrier backed off 3 dB from 1 dB compression point. The maximum output power of 43 dBm was achieved at the 1636.5 MHz. These results reveal a high power of 20 Watt, which was the design target.the design target.

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A Study on the Pixel-Paralled Image Processing System for Image Smoothing (영상 평활화를 위한 화소-병렬 영상처리 시스템에 관한 연구)

  • Kim, Hyun-Gi;Yi, Cheon-Hee
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.11
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    • pp.24-32
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    • 2002
  • In this paper we implemented various image processing filtering using the format converter. This design method is based on realized the large processor-per-pixel array by integrated circuit technology. These two types of integrated structure are can be classify associative parallel processor and parallel process DRAM(or SRAM) cell. Layout pitch of one-bit-wide logic is identical memory cell pitch to array high density PEs in integrate structure. This format converter design has control path implementation efficiently, and can be utilize the high technology without complicated controller hardware. Sequence of array instruction are generated by host computer before process start, and instructions are saved on unit controller. Host computer is executed the pixel-parallel operation starting at saved instructions after processing start. As a result, we obtained three result that 1)simple smoothing suppresses higher spatial frequencies, reducing noise but also blurring edges, 2) a smoothing and segmentation process reduces noise while preserving sharp edges, and 3) median filtering, like smoothing and segmentation, may be applied to reduce image noise. Median filtering eliminates spikes while maintaining sharp edges and preserving monotonic variations in pixel values.

Design and Implementation of High Efficiency Transceiver Module for Active Phased Arrays System of IMT-Advanced (IMT-Advanced 능동위상배열 시스템용 고효율 송수신 모듈 설계 및 구현)

  • Lee, Suk-Hui;Jang, Hong-Ju
    • Journal of the Institute of Electronics and Information Engineers
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    • v.51 no.7
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    • pp.26-36
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    • 2014
  • The needs of active phased arrays antenna system is getting more increased for IMT-Advanced system efficiency. The active phased array structure consists of lots of small transceivers and radiation elements to increase system efficiency. The minimized module of high efficiency transceiver is key for system implementation. The power amplifier of transmitter decides efficiency of base-station. In this paper, we design and implement minimized module of high efficiency transceiver for IMT-Advanced active phased array system. The temperature compensation circuit of transceiver reduces gain error and the analog pre-distorter of linearizer reduces implemented size. For minimal size and high efficiency, the implented power amplifier consist of GaN MMIC Doherty structure. The size of implemented module is $40mm{\times}90mm{\times}50mm$ and output power is 47.65 dBm at LTE band 7. The efficiency of power amplifier is 40.7% efficiency and ACLR compensation of linearizer is above 12dB at operating power level, 37dBm. The noise figure of transceiver is under 1.28 dB and amplitude error and phase error on 6 bit control is 0.38 dB and 2.77 degree respectively.

Step-down Piezoelectric Transformer Using PZT PMNS Ceramics

  • Lim Kee-Joe;Park Seong-Hee;Kwon Oh-Deok;Kang Seong-Hwa
    • KIEE International Transactions on Electrophysics and Applications
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    • v.5C no.3
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    • pp.102-110
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    • 2005
  • Piezoelectric transformers(PT) are expected to be small, thin and highly efficient, and which are attractive as a transformer with high power density for step down voltage. For these reasons, we have attempted to develop a step-down PT for the miniaturized adaptor. We propose a PT, operating in thickness extensional vibration mode for step-down voltage. This PT consists of a multi-layered construction in the thickness direction. In order to develop the step-down PT of 10 W class and turn ratio of 0.1 with high efficiency and miniaturization, the piezoelectric ceramics and PT designs are estimated with a variety of characteristics. The basic composition of piezoelectric ceramics consists of ternary yPb(Zr$_{x}$Ti$_{1-x}$)O$_{3}$-(1-y)Pb(Mn$_{1/3}$Nb1$_{1/3}$Sb$_{1/3}$)O$_{3}$. In the piezoelectric characteristics evaluations, at y=0.95 and x=0.505, the electromechanical coupling factor(K$_{p}$) is 58$\%$, piezoelectric strain constant(d$_{33}$) is 270 pC/N, mechanical quality factor(Qr$_{m}$) is 1520, permittivity($\varepsilon$/ 0) is 1500, and Curie temperature is 350 $^{\circ}C$. At y = 0.90 and x = 0.500, kp is 56$\%$, d33 is 250 pC/N, Q$_{m}$ is 1820, $\varepsilon$$_{33}$$^{T}$/$\varepsilon$$_{0}$ is 1120, and Curie temperature is 290 $^{\circ}C$. It shows the excellent properties at morphotropic phase boundary regions. PZT-PMNS ceramic may be available for high power piezoelectric devices such as PTs. The design of step-down PTs for adaptor proposes a multi-layer structure to overcome some structural defects of conventional PTs. In order to design PTs and analyze their performances, the finite element analysis and equivalent circuit analysis method are applied. The maximum peak of gain G as a first mode for thickness extensional vibration occurs near 0.85 MHz at load resistance of 10 .The peak of second mode at 1.7 MHz is 0.12 and the efficiency is 92$\%$.

Modeling and Simulation of the Cardiovascular System Using Baroreflex Control Model of the Heart Activity (심활성도 압반사 제어 모델을 이용한 심혈관시스템 모델링 및 시뮬레이션)

  • Choi Byeong Cheol;Jeong Do Un;Shon Jung Man;Yae Su Yung;Kim Ho Jong;Lee Hyun Cheol;Kim Yun Jin;Jung Dong keun;Yi Sang Hun;Jeon Gye Rok
    • Journal of Biomedical Engineering Research
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    • v.25 no.6
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    • pp.565-573
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    • 2004
  • In this paper, we proposed a heart activity control model for simulation of the aortic sinus baroreceptor, which was the most representative baroreceptor sensing the variance of pressure in the cardiovascular system. And then, the heart activity control model composed electric circuit model of the cardiovascular system with baroreflex control and time delay sub-model to observe the effect of time delay in heart period and stroke volume under the regulation of baroreflex in the aortic sinus. The mechanism of time delay in the heart activity baroreflex control model is as follows. A control function is conduct sensing pressure information in the aortic sinus baroreceptor to transmit the efferent nerve through central nervous system. As simulation results of the proposed model, we observed three patterns of the cardiovascular system variability by the time delay. First of all, if the time delay over 2.5 second, aortic pressure and stroke volume and heart rate was observed non-periodically and irregularly. However, if the time delay from 0.1 second to 0.25 second, the regular oscillation was observed. And then, if time delay under 0.1 second, then heart rate and aortic pressure-heart rate trajectory were maintained in stable state.

Design of a 48MHz~1675MHz Frequency Synthesizer for DTV Tuners (DTV 튜너를 위한 48MHz~1675MHz 주파수합성기 설계)

  • Ko, Seung-O;Seo, Hee-Teak;Kwon, Duck-Ki;Yu, Chong-Gun
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.15 no.5
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    • pp.1125-1134
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    • 2011
  • In this paper a wideband frequency synthesizer is designed for DTV tuners using a $0.18{\mu}m$ CMOS process. It satisfies the DTV frequency band(48~1675MHz). A scheme is proposed to cover the full band using only one VCO and reliable broadband characteristics are achieved by reducing the variations of VCO gains and frequency steps. The simulation results show that the designed VCO has frequency range of 1.85~4.22GHz, phase noise at 4.22GHz of -89.7dBc/Hz@100kHz, gains of 62.4~95.8MHz/V(${\pm}21.0%$) and frequency steps of 22.9~47.9MHz(${\pm}35.3%$). The designed VCO has a phase noise of -89.75dBc/Hz at 100kHz offset. The designed synthesizer has a lock time less than $0.15{\mu}s$. The measured VCO tuning range is 2.05~3.4GHz. The frequency range is shifted down but still satisfy the target range owing to the design for enough margin. The designed circuit consumes 23~27mA from a 1.8V supply, and the chip size including PADs is $2.0mm{\times}1.5mm$.

Design of pHEMT channel structure for single-pole-double-throw MMIC switches (SPDT 단일고주파집적회로 스위치용 pHEMT 채널구조 설계)

  • Mun Jae Kyoung;Lim Jong Won;Jang Woo Jin;Ji, Hong Gu;Ahn Ho Kyun;Kim Hae Cheon;Park Chong Ook
    • Journal of the Korean Vacuum Society
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    • v.14 no.4
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    • pp.207-214
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    • 2005
  • This paper presents a channel structure for promising high performance pseudomorphic high electron mobility transistor(pHEMT) switching device for design and fabricating of microwave control circuits, such as switches, phase shifters, attenuators, limiters, for application in personal mobile communication systems. Using the designed epitaxial channel layer structure and ETRI's $0.5\mu$m pHEMT switch process, single pole double throw (SPDT) Tx/Rx monolithic microwave integrated circuit (MMIC) switch was fabricated for 2.4 GHz and 5 GHz band wireless local area network (WLAN) systems. The SPDT switch exhibits a low insertion loss of 0.849 dB, high isolation of 32.638 dB, return loss of 11.006 dB, power transfer capability of 25dBm, and 3rd order intercept point of 42dBm at frequency of 5.8GHz and control voltage of 0/-3V These performances are enough for an application to 5 GHz band WLAN systems.

A design on low-power and small-area EEPROM for UHF RFID tag chips (UHF RFID 태그 칩용 저전력, 저면적 비동기식 EEPROM 설계)

  • Baek, Seung-Myun;Lee, Jae-Hyung;Song, Sung-Young;Kim, Jong-Hee;Park, Mu-Hun;Ha, Pan-Bong;Kim, Young-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.12
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    • pp.2366-2373
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    • 2007
  • In this paper, a low-power and small-area asynchronous 1 kilobit EEPROM for passive UHF RFID tag chips is designed with $0.18{\mu}m$ EEPROM cells. As small area solutions, command and address buffers are removed since we design asynchronous I/O interface and data output buffer is also removed by using separate I/O. To supply stably high voltages VPP and VPPL used in the cell array from low voltage VDD, Dickson charge pump is designed with schottky diodes instead of a PN junction diodes. On that account, we can decrease the number of stages of the charge pump, which can decrease layout area of charge pump. As a low-power solution, we can reduce write current by using the proposed VPPL power switching circuit which selects each needed voltage at either program or write mode. A test chip of asynchronous 1 kilobit EEPROM is fabricated, and its layout area is $554.8{\times}306.9{\mu}m2$., 11% smaller than its synchronous counterpart.

Simulation Study of a Large Area CMOS Image Sensor for X-ray DR Detector with Separate ROICs (센서-회로 분리형 엑스선 DR 검출기를 위한 대면적 CMOS 영상센서 모사 연구)

  • Kim, Myung Soo;Kim, Hyoungtak;Kang, Dong-uk;Yoo, Hyun Jun;Cho, Minsik;Lee, Dae Hee;Bae, Jun Hyung;Kim, Jongyul;Kim, Hyunduk;Cho, Gyuseong
    • Journal of Radiation Industry
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    • v.6 no.1
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    • pp.31-40
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    • 2012
  • There are two methods to fabricate the readout electronic to a large-area CMOS image sensor (LACIS). One is to design and manufacture the sensor part and signal processing electronics in a single chip and the other is to integrate both parts with bump bonding or wire bonding after manufacturing both parts separately. The latter method has an advantage of the high yield because the optimized and specialized fabrication process can be chosen in designing and manufacturing each part. In this paper, LACIS chip, that is optimized design for the latter method of fabrication, is presented. The LACIS chip consists of a 3-TR pixel photodiode array, row driver (or called as a gate driver) circuit, and bonding pads to the external readout ICs. Among 4 types of the photodiode structure available in a standard CMOS process, $N_{photo}/P_{epi}$ type photodiode showed the highest quantum efficiency in the simulation study, though it requires one additional mask to control the doping concentration of $N_{photo}$ layer. The optimized channel widths and lengths of 3 pixel transistors are also determined by simulation. The select transistor is not significantly affected by channel length and width. But source follower transistor is strongly influenced by length and width. In row driver, to reduce signal time delay by high capacitance at output node, three stage inverter drivers are used. And channel width of the inverter driver increases gradually in each step. The sensor has very long metal wire that is about 170 mm. The repeater consisted of inverters is applied proper amount of pixel rows. It can help to reduce the long metal-line delay.