• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.410-411
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• 2006

High throughput analysis using a DNA chip microarray is powerful tool in the post genome era. Less labor-intensive and lower cost-performance is required. Thus, this paper aims to develop the multi-channel type label-free DNA chip and detect SNP (Single nucleotide polymorphisms). At first, we fabricated a high integrated type DNA chip array by lithography technology. Various probe DNAs were immobilized on the microelectrode array. We succeeded to discriminate of DNA hybridization between target DNA and mismatched DNA on microarray after immobilization of a various probe DNA and hybridization of label-free target DNA on. the electrodes simultaneously. This method is based on redox of an electrochemical ligand.

• 대한의용생체공학회:의공학회지
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• 제37권5호
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• pp.186-194
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• 2016

In this study, a co-axial flow induced microfluidic chip to fabricate pure collagen type I microfiber via the control of collagen type I and Na-alginate gelation process. The pure collagen type I microfiber was generated by selective degradation of Ca-alginate from 'Core-Shell' structured hydrogel microfiber. To make 'Core-Shell' structure, collagen type I solution was introduced into core channel and 1.5% Na-alginate solution was injected into side channel in microfluidic chip. To evaluatethe 'Core-Shell' structure, the red and green fluorescence substances were mixed into collagen type I and Na-alginate solution, respectively. The fluorescence substances were uniformly loaded into each fiber, and the different fluorescence images were dependent on their location. By immoblizing EpH4-Ras and C6 cells within collagen type I and Na-alginate solution, we sucessfully demonstrated the co-culture of EpH4-Ras and C6 cells with 'Core-Shell' like hydrogel microfiber for 5 days. Only to produce pure collagen type I hydrogel fiber, tri-sodium citrate solution was used to dissolve the shell-like Ca-alginate hydrogel fiber from 'Core-Shell' structured hydrogel microfiber, which is an excellent advantage when the fiber is employed in three-dimensional scaffold. This novel method could apply various application in tissue engineering and biomedical engineering.

• 한국기계가공학회지
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• 제10권1호
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• pp.80-86
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• 2011

This study compared and analyzed manual tapping and automatic tapping regarding tapping process characteristics of titanium hard-to-cut-material. Tapping process characteristics of titanium hard-to-cut-material are evaluated as the quality of a screw, wear of a tap, economic analysis, and cycle time etc. The type of screw threads after manual tapping is formed as an irregular type of screw threads, and perfect screw threads are created after automatic tapping. In addition, the chip type after manual tapping process is formed as the discontinuous chip due to work hardening, and the powder type of chip after automatic tapping process is created. In terms of cycle time, an automatic tapping process is shortened by 70% compared to manual tapping process. Insert tip wear of an automatic tapping shown in the process of 5-hole tapping is not found, but hand tap wear for finish cutting is most severe.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.545-546
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.749-750
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• 2011

• 전력전자학회논문지
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• 제16권2호
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• pp.97-104
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• 2011

본 논문은 건물 내에서 발생되는 각종 화재 및 재해를 자동으로 신속히 감지한 후 현지에 설치된 방재설비들을 자동으로 동작시켜 화재 및 재해를 초기진압하고, 이들 재해상황들을 유무선 통신망을 통하여 실시간으로 원격지 상황실의 중앙관리시스템에서 모니터링되는 고속 고정밀의 IT 기반의 방재용 자동화시스템을 개발한다. 본 논문에서 제안하는 방재용 자동화시스템은 소형.경량 및 고감도 고정밀의 원칩형 PLC (one-chip type PLC)가 적용되어, 각종 재해 센서로부터 감지된 신호를 분석하고 재해발생시 조기진압을 위한 현장의 방재용 구동장치들을 작동시킨다. 또한 검출된 데이터들은 RS232c 및 블루투스에 의한 유무선 통신망을 통해 원격지 상황실에 데이터 전송 및 긴급 경보신호를 송출시키고, 모니터링 프로그램을 구동시킨다. 제안한 IT 기반의 방재용 자동화시스템은 화재와 각종 재해에 대한 예방과 신속한 조치로 인명과 재산의 손실을 최소화 하고자 한다.

• 반도체디스플레이기술학회지
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• 제4권2호
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• pp.33-37
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified fer other bonding methods such as ACF.

• 반도체디스플레이기술학회지
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• 제8권2호
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• 토지주택연구
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• 제3권3호
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• pp.299-305
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• 2012

음식물쓰레기 발효 소멸용 목질바이오칩의 종류별로 세공구조에 따른 음식물쓰레기 무게 감량율 및 미생물 활동성을 비교분석 하였다. 목질바이오칩을 이용한 음식물쓰레기 발효 소멸실험을 온도 $30{\sim}50^{\circ}C$, 습도 30~70% 조건의 발효 소멸 반응조에 15일간 매일 700~1,500g의 음식물쓰레기를 투입하며 실시하였다. 이 때 1,500g의 목질바이오칩을 발효 소멸 반응조에 초기에 투입하였다. 실험에 사용한 목질바이오칩의 세공구조는 미생물 혼합형(A 바이오칩), $2{\mu}m$ 마크로 세공형(B biochip), $0.1{\mu}m$ 미세공형(C 바이오칩), 점성구조형(D 바이오칩)으로 4가지 유형이었다. 실험결과, A, B, C, D 바이오칩별 발효 소멸에 의한 음식물쓰레기 무게감량율은 각각 85%, 63%, 92%, 73%이었고, C 바이오칩의 경우가 음식물쓰레기 감량율 92%로 최고값을 나타내었다. 또한, C 바이오칩은 ATP/COD $3.00{\times}10^{-10}$, ATP/TN $2.31{\times}10^{-11}$로 상대적으로 타 종류의 바이오칩보다 높은 결과를 나타내었다. 이는 발효 소멸반응에서 발생되는 미생물의 서식지를 충분히 제공하여 ATP/COD 및 ATP/TN이 높아졌고 미생물의 활동성이 강화되어 발효 소멸반응이 원활하게 진행된 결과에 기인하는 것으로 분석되었다.