• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.2
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• pp.355-358
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• 2010

As CMOS technology continues to scale down, signal processing is favorably done in the digital domain, which requires Analog-to-Digital (A/D) Converter to be integrated on-chip. This paper presents a design methodology of 12-bit 1-MS/s Rail-to-Rail fully differential SAR ADC using Deep N-well Switch based on binary search algorithm. Proposed A/D Converter has the following architecture and techniques. Firstly, chip size and power consumption is reduced due to split capacitor array architecture and charge recycling method. Secondly, fully differential architecture is used to reduce noise between the digital part and converters. Finally, to reduce the mismatch effect and noise error, the circuit is designed to be available for Rail-to-Rail input range using simple Deep N-well switch. The A/D Converter fabricated in a TSMC 0.18um 1P6M CMOS technology and has a Signal-to-Noise-and-Distortion-Ratio(SNDR) of 69 dB and Free-Dynamic-Range (SFDR) of 73 dB. The occupied active area is $0.6mm^2$.

• ETRI Journal
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• v.37 no.3
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• pp.523-532
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• 2015

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

• The Journal of Natural Sciences
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• v.7
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• pp.27-35
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• 1995

This paper introduces a VLSI (Very Large Scale Integrated Circuit) implementation of the 2-D Discrete Cosine Transform (DCT) with an application to image and video coding. This implementation, which is based upon a state space model, uses both algorithm and data partitioning to achieve high efficiency. With this implementation, the amount of data transfers between the processing elements (PEs) are reduced and all the data transfers are limitted to be local. This system accepts the input as a progressively scanned data stream which reduces the hardware required for the input data control module. With proper ordering of computations, a matrix transposition between two matrix by matrix multiplications, which is required in many 2-D DCT systems based upon a row-column decomposition, can be also removed. The new implementation scheme makes it feasible to implement a single 2-D DCT VLSI chip which can be easily expanded for a larger 2-D DCT by cascading these chips.

• IEIE Transactions on Smart Processing and Computing
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• v.4 no.4
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• pp.291-296
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• 2015

This paper describes the design of a high-speed comparator for high-speed automatic test equipment (ATE). The normal comparator block, which compares the detected signal from the device under test (DUT) to the reference signal from an internal digital-to-analog converter (DAC), is composed of a rail-to-rail first pre-amplifier, a hysteresis amplifier, and a third pre-amplifier and latch for high-speed operation. The proposed continuous comparator handles high-frequency signals up to 800MHz and a wide range of input signals (0~5V). Also, to compare the differences of both common signals and differential signals between two DUTs, the proposed differential mode comparator exploits one differential difference amplifier (DDA) as a pre-amplifier in the comparator, while a conventional differential comparator uses three op-amps as a pre-amplifier. The chip was implemented with $0.18{\mu}m$ Bipolar CMOS DEMOS (BCDMOS) technology, can compare signal differences of 5mV, and operates in a frequency range up to 800MHz. The chip area is $0.514mm^2$.

• Journal of the Korean Institute of Intelligent Systems
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• v.17 no.4
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• pp.569-574
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• 2007

최근 많은 광대역 유무선 통신 응용분야에서 OFDM(Orthogonal Frequency Division Multiplexing) 방식을 표준기술로 채택하고 있다. OFDM 방식의 고속 무선 데이터 통신을 위한 FFT 프로세서는 일반적으로 DSP(Digital Signal Processing)로 구현되었으나, 큰 전력 소비를 필요로 한다. 따라서, OFDM 통신방식의 단점인 전력문제를 보완하기 위해서 전류모드 FFT LSI가 제안되었고, 저소비전력 전류모드 FFT LSI를 동작시키기 위해서는 전류모드를 전압모드로 바꾸는 VIC(Voltage to Current Converter) 그리고 다시 전류모드를 전압모드로 바꾸어 주는 IVC(Current to Voltage Converter)가 필요하다. 그러나, OP-AMP로 구현되는 종래의 IVC는 회로규모가 크고, 전력소비가 크며, LSI 내에 크고 정확한 높은 저항을 필요로 한다. 또한 전류모드신호처리에서 많이 이용되는 Current Mirror 회로 등의 출력단자로부터 전류신호를 입력받은 경우, 입력단자간의 전위차가 발생하며, DC offset 전류가 발생하는 등의 문제점을 갖는다. 따라서 본 연구에서는 저전력 동작이 가능하고, 향후, single chip 응용이 가능한 IVC를 $0.35{\mu}m$ 공정에서 설계함으로서, $0.35{\mu}m$ 공정에서의 전류모드 FFT LSI의 전압모드 출력이 가능해졌다 설계된 IVC는 FFT LSI의 출력이 디지털신호로 환산한 ${\pm}1$인 점을 감안하여, 전류모드 FFT LSI의 출력이 $13.65{\mu}A$ 이상일 때에 3.0V의 전압을 출력하고, FFT LSI의 출력이 $0.15{\mu}A$ 이하일 때에 0.5V 이하의 전압을 출력하도록 하였으며, IVC의 총 소비전력은 약 1.65mV이하로 평가되었다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.1
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• pp.995-998
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• 2005

This paper proposes a new SoC (System-on-Chip)-based automatic compensation circuit (ACC) for 5GHz low noise amplifier (LNA). This circuit is extremely useful for today's RF IC (Radio Frequency Integrated Circuit) devices in a complete RF transceiver environment. The circuit contains RF BIST (Built-ln Self-Test) circuit, Capacitor Mirror Banks (CMB) and digital processing unit (DPU). The ACC automatically adjusts performance of 5GHz LNA by the processor in the SoC transceiver when the LNA goes out of the normal range of operation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.4
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• pp.281-287
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• 1998

$BiNbO_4$ ceramics doped with 0.07wt% $V_2O_5$ and 0.03wt% CuO (BNC3V7) were sucessfully sintered at $900^{\circ}C$ through the firing process with Ag electrode. The BNC3V7 shows typically Dielectric constant of 44.3, Thermal Coefficient of resonance Frequency(TCF) of 2 ppm/$^{\circ} and $Qxf_o$ value of 22,000 GHz. The laminated chip Low Pass Filter (LPF) is very sensitive to chip processing parameters, was confirmed by the computer simulation as a function of Q(Quality factors), filter size, capacitor layer thickness, inductor pattern widths. The multilayer type LPF was fabricated by screen-printing with Ag electrode after tape casting and then compared with the simulated characteristics. The results show that characterization of band pass width was similar to that of designed ones.

• The KIPS Transactions:PartA
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• v.13A no.3 s.100
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• pp.185-190
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• 2006

JPEG 2000 is used as an alternative to solve the blocking artifact problem with the existing still image compression JPEG algorithm. However, it has shortcomings such as longer floating point computation time and more complexity in the procedure of enhancing the image compression rate and decompression rate. To compensate for these we implemented with hardware the JPEG 2000 algorithm's filter part which requires a lot of floating point computation. This DWT Filter[1] chip is designed on the basis of Daubechies 9/7 filter[6] and is composed of 3-stage pipeline system to optimize the performance and chip size. Our implemented Filter was 7 times faster than software based Filter in the floating point computation.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.64 no.12
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• pp.1730-1736
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• 2015

This paper presents a 16-channel transimpedance amplifier (TIA) array implemented in a standard $0.18-{\mu}m$ CMOS technology for the applications of panoramic scan LADAR (PSL) systems. Since this array is the front-end circuits of the PSL systems to recover three dimensional image for unmanned vehicles, low-noise and high-gain characteristics are necessary. Thus, we propose a voltage-mode inverter TIA (I-TIA) array in this paper, of which measured results demonstrate that each channel of the array achieves $82-dB{\Omega}$ transimpedance gain, 565-MHz bandwidth for 0.5-pF photodiode capacitance, 6.7-pA/sqrt(Hz) noise current spectral density, and 33.8-mW power dissipation from a single 1.8-V supply. The measured eye-diagrams of the array confirm wide and clear eye-openings up to 1.3-Gb/s operations. Also, the optical pulse measurements estimate that the proposed 16-channel TIA array chip can detect signals within 20 meters away from the laser source. The whole chip occupies the area of $5.0{\times}1.1mm^2$ including I/O pads. For comparison, a current-mode 16-channel TIA array is also realized in the same $0.18-{\mu}m$ CMOS technology, which exploits regulated-cascode (RGC) input configuration. Measurements reveal that the I-TIA array achieves superior performance in optical pulse measurements.

• The KIPS Transactions:PartC
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• v.9C no.2
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• pp.173-180
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• 2002

Smartcard is highlighted as infrastructure that has an excellent security for executing functions such as user authentication, access control, information storage and control, and its market is expanding rapidly. But possibilities of forgery and alteration by hacking are increasing as well. This Paper makes cut off of Smartcard forgery and alteration that use angular multiplexing and private key multiplexing hologram on holographic security Encryption, and proposes system capable verfication of forgery and alteration impossible on existing smartrard by adopting smartcard chip and holographic memory chip.