• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.877-878
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• 2006

The sintered parts are mainly used for automobile industry, and a part of air conditioners. In automobile industry, the application range of sintered parts is very broad and use for a driving and a lubricating system. And air conditioner uses them for compressor. Grinding of compressor and pump parts is very difficult these days, because these parts use High hardness materials and require high precision grinding. Tool life has to be extended to decrease production cost. We analyzed processing mechanism and developed new grinding wheels for Double Disk Grinding. And, we introduce new truing technology that improved tool-life and precision.

• ETRI Journal
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• 제35권2호
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• pp.340-343
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• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

• 한국해양공학회지
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• 제11권3호
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• pp.163-169
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• 1997

The simulation of target-scattered echo with the moving sonar platform and target in 3-dimensional ocean environment is essential to validate and evaluate the performance of a sonar system. This paper presents the improved target signal simulation on the basis of the highlight(HL) model and its realtime algorithm. In order to simulate the scattering highlight, the highlight is represented as a directional scatterer. The realtime generation algorithm of the target signal is realized by use of DSP chip, TMS320C40, where the 40 channels are equally separated to form a parallel processing task in 4 processors. The presented realtime-version of target signal simulation can be used as a target signal simulator in the development of ACM(Acoustic Counter Measure) and advanced sonar signal processing techniques.

• Journal of Electrical Engineering and Technology
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• 제5권2호
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• pp.276-281
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• 2010

The switched reluctance motor (SRM) is an older member of the electric machines family. Its simple structure, ruggedness and inexpensive manufacturing potential make it extremely attractive for industrial applications. However, these merits are overshadowed by its inherent high torque ripple, acoustic noise and difficulty to control. In this paper, a control strategy of the angle position control for the SRM drive based on fuzzy logic is illustrated. The input control parameter, the output control parameter and fuzzy control with FAM table formulation strategy are described and simulated with control patterns, and the decision form of the fuzzy control is illustrated and simulated, and the scope of implementing in a Fuzzy based ASIC chip is enlightened with literature support.

• 대한전자공학회논문지
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• 제23권3호
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• pp.351-356
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• 1986

This paper proposes a new algorithm for logic minimization to optimize the area of a PLA chip. All minterms are expressed in the form of decimal number, and sets of minterms which are not included in the essestia cube are deleted prior to cube generation, ther by making cube generation easy. Also, for reduction of computation time, the properties of multioutput functions are considered. That is, only the combinations of functions correcsponding to common minterms are minimized. The proposed algorithm is implemented on VAX 11/780 using Pascal and compared with conventional methods.

• 한국전기전자재료학회논문지
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• 제37권5호
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• pp.465-475
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• 2024

Due to changes in the form factor of display panels and touch screen panels in various devices, capacitive touch systems have evolved to address various issues such as low power consumption, noise immunity, and small chip size. Furthermore, some devices have applications that use a stylus. Since the stylus operates similarly to a finger touch, it encounters similar issues. Recent research trends focus on addressing key issues such as noise, which is primarily caused by the self-capacitor formed between the display cathode and the touch screen panel. In this paper, Various research papers discussing methods to eliminate external noise will be reviewed. These advancements enhance noise immunity in touch systems, making it easier to use thinner and more flexible panels. These progress make touch technology more versatile and reliable in various applications.

• 한국동물위생학회지
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• 제44권4호
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• pp.185-194
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• 2021

Polyglutamine extension in the coding sequence of mutant huntingtin causes neuronal degeneration associated with the formation of insoluble polyglutamine aggregates in Huntington's disease (HD). Mutant huntingtin can form aggregates within the nucleus and processes of neurons possibly due to misfolding of the proteins. To better understand the mechanism by which an elongated polyglutamine causes aggregates, we have developed an in vitro binding assay system of polyglutamine tract from truncated huntingtin. We made GST-HD exon1 fusion proteins which have expanded polyglutamine epitopes (e.g., 17, 23, 32, 46, 60, 78, 81, and 94 CAG repeats). In the present emergence of new study adjusted nanotechnology on protein chip such as surface plasmon resonance strategy which used to determine the substance which protein binds in drug discovery platform is worth to understand better neurodegenerative diseases (i.e., Alzheimer disease, Parkinson disease and Huntington disease) and its pathogenesis along with development of therapeutic measures. Hence, we used strengths of surface plasmon resonance (SPR) technology which is enabled to examine binding specificity and explore targeted molecular epitope using its electron charged wave pattern in HD pathogenesis utilize conjugated mutant epitope of HD protein and its interaction whether wild type GST-HD interacts with mutant GST-HD with maximum binding affinity at pH 6.85. We found that the maximum binding affinity of GST-HD17 with GST-HD81 was higher than the binding affinities of GST-HD17 with other mutant GST-HD constructs. Furthermore, our finding illustrated that the mutant form of GST-HD60 showed a stronger binding to GST-HD23 or GST-HD17 than GST-HD60 or GST-HD81. These results indicate that the binding affinity of mutant huntingtin does not correlate with the length of polyglutamine. It suggests that the aggregation of an expanded polyglutamine might have easily occurred in the presence of wild type form of huntingtin.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.603-606
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• 2005

In this paper, the formation and thermal stability of Ni-silicide using Ni-Pd alloys is studied for ultra shallow S/D junction of nano-scale CMOSFETs. There are no different effects when Ni-Pd is used in single structure and TiN capping structure. But, in case of Cobalt interlayer structure, it was found that Pure Ni had lower sheet resistance than Ni-Pd, because of a thick silicide. Also, Ni-Pd has merits that surface of silicide and interface between silicide and silicon have a good morphology characteristics. As a result, Ni-Pd is an optimal candidate for shallow S/D junction when cobalt is used for thermal stability.

• 한국전자파학회논문지
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• 제26권10호
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• pp.907-913
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• 2015

본 논문은 회로 시뮬레이션과 전자기 시뮬레이션을 병행하여 디지털 스위칭 회로가 실장된 PCB 상의 근접 자계 분포를 예측하는 방법을 제시한다. 제안 방법은 스위칭 회로의 신호 및 전원 포트를 정현 전원으로 구동하여 규격화된 근접 자계 분포를 구하고, 이 결과를 실제 스위칭 회로에 의한 전류의 주파수 스펙트럼으로 가중하여 근접 자계를 예측한다. 예측 방법론을 검증하기 위해 링 발진기와 출력 버퍼로 구성된 스위칭 집적 회로를 제작하고, 칩-온-보드(Chip On Board, 칩-온-보드) 형태로 평가하였다. 자계 프로브를 이용하여 PCB상에서 표면 자계 분포를 측정하였으며, 시뮬레이션 결과와 비교하였다. 측정 결과와 시뮬레이션 계산 결과는 5차 하모닉 주파수까지 10 dB 이내로 일치함을 확인하였다.

• 한국진공학회지
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• 제16권6호
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• pp.414-423
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• 2007

FED(Field Emission Display)는 특히 소형, 고품질 평면화면분야에서 종래의 기술들과 뚜렷이 구별되는 이점을 가지고 있다. FED를 실리콘 웨이퍼에 System-on-Chip(SoC)화하는 가능성을 검토하기 위해, 우리는 p-n 접합을 평면 디스플레이의 전자선원(electron beam source)으로 사용할 수 있는지를 실험하였다. Cantilever(외팔보)형 게이트로부터의 전계로 반전층을 형성하여 p-n 접합을 형성하는 새로운 구조를 제조하였다. 약 1 ${\mu}m$ 정도의 높이에 있는 cantilever형 게이트에 220V이상의 전압을 가했을 때 반전층(inversion layer)이 형성되었고, 애벌런치 항복이성공적으로 이루어졌다. 극히 얕은 p-n 접합에서 애벌런치 항복 시 관측되는 전자방출 효과와 그 특성이 비교되었고 실험결과와 향후 연구방향이 논의 되었다.