• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.2
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• pp.273-278
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• 2012

In this contribution, we design and implement an SPI hardware interface for the microprocessor to communicate with the MMC (Multi-Media Card) in an embedded system. Proposed architecture is compatible with the APB in AMBA bus architecture. Embedding OS in an embedded system means a big burden in terms of hardware and software ending up with performance decline. In this paper, we adopt the concept of SPI communication without using OS in the embedded system and implement in a form of FPGA chip. The designed SPI module was automatically synthesized, placed, and routed. Implementation was performed through the Altera FPGA and well operated at 25MHz clock frequency, which satisfied our target speed.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.2
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• pp.292-300
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• 2015

This paper proposes a high-efficiency, dual-mode PWM / linear buck converter with a wide-input range. The proposed converter was designed with a mode selector that can change the operation between PWM / linear mode by sensing a load current. The proposed converter operates in a linear mode during a light load and in PWM mode during a heavy load condition in order to ensure high efficiency. In addition, the mode selector uses a bit counter and a transmission gate designed to protect from a malfunction due to noise or a time-delay. Also, in conditions between $-40^{\circ}C$ and $140^{\circ}C$, the converter has variations in temperature of $0.5mV/^{\circ}C$ in the PWM mode and of $0.24mV/^{\circ}C$ in the linear mode. Also, to prevent malfunction and breakdown of the IC due to static electricity, the reliability of IC was improved by embedding a self-produced 8 kV-class(Chip level) ESD protection circuit of a P-substrate Triggered SCR type with high robustness characteristics.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.11
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• pp.1034-1046
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• 2011

In this paper, a design and fabrication of 40 W power amplifier for the X-band using load-pull measurement of GaN HEMT chip are presented. The adopted active device for power amplifier is GaN HEMT chip of TriQuint company, which is recently released. Pre-matched fixtures are designed in test jig, because the impedance range of load-pull tuner is limited at measuring frequency. Essentially required 2-port S-parameters of the fixtures for extraction optimal input and output impedances is obtained by the presented newly method. The method is verified in comparison of the extracted optimal impedances with data sheet. The impedance matching circuit for power amplifier is designed based on EM co-simulation using the optimal impedances. The fabricated power amplifier with 15${\times}$17.8 $mm^2$ shows the efficiency above 35 %, the power gain of 8.7~8.3 dB and the output power of 46.7~46.3 dBm at 9~9.5 GHz with pulsed-driving width of 10 usec and duty of 10 %.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.50-61
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• 2010

Nowadays, the SoC is watched by all over the world with interest. The design trend of the SoC is hardware and software co-design which includes the design of hardware structure in RTL level and the development of embedded software. Also the technology is toward deep-submicron and the observability of the SoC's internal state is not easy. Because of the above reasons, the SoC debug is very difficult and time-consuming. So we need a reliable debugger to find the bugs in the SoC and embedded software. In this paper, we developed a hardware debugger named OCD. It is based on IEEE 1140.1 JTAG standard. In order to verify the operation of OCD, it is integrated into the 32bit RISC processor - Core-A (Core-A is the unique embedded processor designed by Korea) and is tested by interconnecting with software debugger. When embedding the OCD in Core-A, there is 14.7% gate count overhead. We can modify the DCU which occupies 2% gate count in OCD to adapt with other processors as a debugger.

• The Journal of the Acoustical Society of Korea
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• v.30 no.3
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• pp.115-122
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• 2011

In this paper, we present a method to estimate an accurate real-time sound source direction based on time delay of arrival by using generalized cross correlation with four cross-type microphones. In general, existing systems have two disadvantages such as system embedding limitation due to the necessity of data acquisition for signal processing from microphone input, and real-time processing difficulty because of the increased number of channels for sound direction estimation using DSP processors. To cope with these disadvantages, the system considered in this paper proposes hardware design for enhanced real-time processing using microphone array signal processing. An accurate direction estimation and its design time reduction is achieved by means of an efficient hardware design using spatial segmentation methods and verification techniques. Finally we develop a system which can be used for embedded systems using a sound codec and an FPGA chip. According to experimental results, the system gives much faster real-time processing time compared with either PC-based systems or the case with DSP processors.

• Journal of Power Electronics
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• v.15 no.6
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• pp.1673-1681
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• 2015

A low dropout (LDO) regulator with a wide-bandwidth is proposed in this paper. The regulator features a Human Body Model (HBM) 8kV-class high robustness ElectroStatic Discharge (ESD) protection circuit, and two error amplifiers (one with low gain and wide bandwidth, and the other with high gain and narrow bandwidth). The dual error amplifiers are located within the feedback loop of the LDO regulator, and they selectively amplify the signal according to its ripples. The proposed LDO regulator is more efficient in its regulation process because of its selective amplification according to frequency and bandwidth. Furthermore, the proposed regulator has the same gain as a conventional LDO at 62 dB with a 130 kHz-wide bandwidth, which is approximately 3.5 times that of a conventional LDO. The proposed device presents a fast response with improved load and line regulation characteristics. In addition, to prevent an increase in the area of the circuit, a body-driven fabrication technique was used for the error amplifier and the pass transistor. The proposed LDO regulator has an input voltage range of 2.5 V to 4.5 V, and it provides a load current of 100 mA in an output voltage range of 1.2 V to 4.1 V. In addition, to prevent damage in the Integrated Circuit (IC) as a result of static electricity, the reliability of IC was improved by embedding a self-produced 8 kV-class (Chip level) ESD protection circuit of a P-substrate-Triggered Silicon Controlled Rectifier (PTSCR) type with high robustness characteristics.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.13-18
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• 2000

Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2006.06b
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• pp.305-309
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• 2006

This paper presents and illustrates the application of a growth and yield model that supports both forest and mill side volume and value estimates. Traditional forest stand growth and yield models represent the forest landowner view of yield and economics. Predicted yields are estimates of what one would expect from a procurement cruise, and current stumpage prices are applied to investigate optimum management strategies. Optimum management regimes and rotation ages obtained from the forest side view are unlikely to be economically optimal when viewed from the mill side. The actual distribution of recoverable manufactured product and its value are highly dependent on mill technologies and configurations. Overcoming this limitation of growth and yield computer models necessitates the ability to predict and price the expected manufactured distribution of lumber, lineal meters of veneer, and tonnes of air dried pulp fiber yield. With these embedded models, users of the yield simulator can evaluate the economics of possible/feasible management regimes from both the forest and mill business sides. The simulator is a forest side model that has been modified to produce estimates of manufactured product yields by embedding models for 1) pulpwood chip size class distribution and pulp yield for any kappa number (Schultz and Matney, 2002), 2) a lumber yield and pricing model based on the Best Opening Face model developed by the USDA Forest Service Forest Products Laboratory (Lewis, 1985a and Lewis, 1985b), and 3) a lineal meter veneer model derived from peeler block tests. While the model is strictly applicable to planted loblolly pine (Pinus taeda L.) on cutover site-prepared land in the United States (US) Gulf South, the model and computer program are adaptable to any region and forest type.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.45 no.10
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• pp.65-70
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• 2008

We design and fabricate the 94 GHz Coplanar waveguide(CPW)-to-rectangular waveguide transition that is transmits signal smoothly between the CPW, which is a popular transmission line of the planar circuits, and rectangular waveguide for the 94 GHz transceiver system. The proposed transition composed of the unilateral fin-line taper and open type CPW-to-slot-line transition is based on the hard and inflexible sapphire for the flip-chip bonding of the planar MMICs using conventional MMIC technology. We optimize a single section transition to achieve low loss by using an EM field solver of Ansoft's HFSS and fabricate the back- to-back transition that is measured by Anritsu ME7808A Vector Network Analyzer in a frequency range of $85{\sim}105$ GHz. From the measurement and do-embedding CPW with 3 mm length, an insertion and return loss of a single-section transition are 1.7 dB and more an 25 than at 94 GHz, respectively.