• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.727-731
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• 2005

Design and manufacturing process of a full color LED microdislay fabricated by standard CMOS technology and containing an array of aluminum / nanostructured porous silicon reverse biased light emitting Schottky diodes will be discussed. Being of a solid state construction, this microdisplays are cost-effective, thin and light in weight due to very simple device architecture. Its benefits include also super high resolution, wide viewing angles, fast response time and wide operating temperature range. The advantages of full integration of an LED-array and driving circuitry onto a Si-chip will be also discussed.

• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.31-35
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• 2004

A blue light emitting diode with 8 periods InGaN/GaN multi-quantum well structure grown by metal-organic chemical vapor deposition was fabricated with the inclusion of the metal-interconnection process in order to integrate the chips for light lamp. The quantum well structure provides the blue light photoluminescence peaked at 479.2 nm at room temperature. As decreasing the temperature to 20 K, the main peak was shifted to 469.7 nm and a minor peak at 441.9 nm appeared indicating the quantum dot formation in quantum wells. The current-voltage measurement for the fabricated LED chips shows that the metal-interconnection provides good current path with ohmic resistance of 41 $\Omega$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.390-391
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• 2007

LED Packaging 과정 중 Die bond 재료로 Silver epoxy를 사용하여 Packaging 한 후 T3Ster 장비로 열 저항 값(Rth)을 측정하였다. Silver epoxy 의 접착 두께를 조절하여 열 저항 값을 측정하였고, 열전도도 값이 다른 Silver epoxy를 사용하여 열 저항 값을 측정하였다. Silver epoxy 접착 두께가 충분하여 Chip 전면에 고루 분포되었을 경우 그렇지 않은 경우보다 평균 4.8K/W 낮은 13.23K/W의 열 저항 값을 나타내었고, 열전도도가 높은 Silver epoxy 일수록 열전도도가 낮은 재료보다 평균 4.1K/W 낮은 12K/W의 열 저항 값을 나타내었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.286.1-286.1
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• 2013

Nowadays, the glare towards the light-emitting diode (LED) lighting source has much attention due to its eco-friendly nature, reduced energy consumption, and low CO2 emission. LEDs can show versatile colors by changing the composition ratio of semiconductors. Phosphors re-emit light by absorbing light from LED, which is the key factor for emission. The endeavor to make replica of natural white light is increasing day by day. Industrially, blue LED chip crowned with a yellow phosphor coated lens gives low quality white light. Newly, many researchers are introducing modern approaches, adding red phosphor to the yellow phosphor to increase the quality of white light. Here, we synthesized structurally and chemically stable europium doped oxyapatite Ca8Gd2(PO4)6O2 nano-crystalline structures by a hydrothermal method. The ultrafine structures were formed due to the effect of ethylenediaminetetraacetic acid, which is confirmed by the transmission electron microscope images. The structural properties were analyzed using the X-ray diffraction patterns.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.3
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• pp.609-613
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• 2010

In this paper, we optimized and simulated the heatsink of 75W LED module for street lighting and evaluated the optical properties with the manufactured heatsink. the structure of LED package make simple as chip and heatslug and thermal flow is analyzed by using the FEM(Finite Element Method) with CFdesign V10. Also, we measured the temperature of heatsink and evaluated the optical properties with infrared thermal image camera and integrated sphere system for luminous flux in $1\;[m^3]$ box. As results, Heatsink optimized in 3 mm pin thickness, 6 mm base thickness and 16 number of pin count by using Heatsink-designer and got the results which is the temperature of $47.37\;[^{\circ}C]$ and thermal resistance of $0.48407\;[W/^{\circ}C]$. In thermal flow simulation, the temperature of heatsink decreased from $51.54\;[^{\circ}C]$ to $51.51\;[^{\circ}C]$ and the temperature of heatsink by the time in real measurement decreased from $47.03\;[^{\circ}C]$ to $46.87\;[^{\circ}C]$. Moreover, we improve 0.68 % in the decreased ratio of the luminous flux.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.6
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• pp.2707-2712
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• 2011

In this paper, a power factor correction (PFC) control circuit using single stage boundary conduction mode(BCM) for the 400V. 120W LED drive application has been designed. The proposed control circuit is aimed for improvement of the power factor correction and reduction of the total harmonic distortion. In this circuit, a new CMOS multiplier structure is used instead of a conventional BJT(bipolar junction transistor) based multiplier where has a relatively large area. The CMOS multiplier can bring 30 % reduced chip area, competitive die cost in comparison with the conventional BJT multiplier.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.6
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• pp.433-436
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• 2018

A total internal reflection (TIR) linear lens of size $190(W){\times}5(D){\times}2.1(H)mm^3$ has a directivity of $25^{\circ}$ and was made of a polydimethysiloxane (PDMS) silicone resin with a refractive index of 1.4 and a transmittance of 93% at 365 nm UV wavelength. A light source with a size of $190{\times}25.5mm^2$ was fabricated by installing a TIR linear lens on a chip on board (COB) type LED module mounted with a $1.1{\times}1.1mm^2$ size UV LED. The optical characteristics of the light source showed a maximum irradiation density of $3,840mW/cm^2$ at a working distance of 5 mm and a high uniformity of 91.6% over a $150{\times}25mm^2$ irradiation area. The thermal characteristics of the light source were measured at a supply current of 500 mA. The saturation temperature was reached after 30 min of operation, and measured to be $95^{\circ}C$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.702-708
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• 2020

Recently, as LED display systems have become larger, research on effective power control methods for the systems has been in progress. This paper proposes a power control method to minimize power loss due to the difference in LED characteristics for each channel of a backlight unit (BLU) system. The proposed LED driver IC has a power optimization function and detects the minimum headroom voltage for constant current operation of all channels and linearly controls the DC-DC converter output. Thus, it minimizes power consumption due to unnecessary additional voltage. In addition, it does not require a voltage sensing comparator or a voltage generation circuit for each channel. This has a great advantage in reducing the chip size and for stabilization when implementing an integrated circuit. In order to verify the proposed function, an IC was designed using Cadence and Synopsys' design tools, and it was fabricated with a Magnachip 0.35um 5V/40V CMOS process. The experiments confirmed that the proposed power control method controls the minimum required voltage of the BLU system.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.5
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• pp.213-217
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• 2015

Seoul has 25 areas of City Hall, the ward office has been operating theater at least 1 in maximum 4-5 locations to various sized places. The purpose of theater has been used for a variety of purposes to typical performances of Drama and Musicals, School play, Lecture. This points to a Variety of ideas for use, when replacing an exsting halogen luminaires, appropriate LED luminaires, Learn more if there is any advantage in terms of the energy saving part. it will be applied to the value for the energy saving to ward office hall of the actual targets. In case replacement in existing halogen luminaires to LED luminaires, to energy savings of about 80% appear around. Get the advantages of the various functional properties a device chip of the LED itself, Forward will be referred to as easy to replace the halogen luminaires and LED luminaires.

• Advanced Industrial SCIence
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• v.3 no.3
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• pp.14-19
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• 2024

Currently, micro LEDs (Light Emitting Diode) are attracting attention in the lighting field along with next-generation displays and have advantages such as high luminance, operating speed, energy efficiency, and long-term driving. It is predicted to bring new innovations in smartphones, televisions, and wearable electronic devices. These micro displays are self-luminous displays that emit light by themselves by being implemented as pixels composed of micrometer-sized LED devices. The main manufacturing processes can be divided into crystal growth, patterning and etching, chip separation and transfer, bonding and wiring, panel assembly and encapsulation, inspection, and quality management. Recently, this technology has developed at a rapid pace, and companies are expanding their investments in these fields. According to recent market research results, the micro LED display market is expected to continue to grow, and the main development direction of development can be summarized as manufacturing process improvement, material innovation, and driving technology development. It is believed that commercialization will accelerate through these studies and lead to innovation in the display industry with high performance and various application possibilities.