• Journal of IKEEE
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• v.18 no.3
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• pp.335-340
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• 2014

Recently, LED (Light Emitting Diode) becomes to be useful to apply for the lightening sources in electric systems and the lightening equipment since the power is less consumed with high efficiency, and the size and the weight of LED are small and light, respectively. The LED is controlled with constant current and SMPS (Switching Mode Power Supply). It is necessary for the LED manufacturer to secure the fundamental technology of designing LED chip, and to study the methodology to improve the power factor (PF) and to design the operational circuit for the development of LED to reduce the power loss in the application of LED lightening. The direct AC (Alternating Current) LED driving circuit, HV9910, is widely used in the industry field. In this paper, it is to evaluate the improved methodology for the power factor and efficiency through simulations when PFC (Power Factor Correction) and Noise Filter are added to HV9910.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.1
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• pp.61-66
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• 2010

The purpose of this experiment is to analyze the basic status of brain. Which are consist of rest, attention and concentration, of the brain by measuring the temperature of color by changing RGB color after manufacturing LED-illumination stand. Basic status (rest, attention and concentration) of experimenter were measured temperature of colors having three difference temperature like as $2,300^{\circ}K$, $4,000^{\circ}K$ and $6,000^{\circ}K$. The results was shown that experimenter feels more comfortable and relaxation by decreasing the temperature of color. For example we can see the little increase of concentration index at $4,000^{\circ}K$ condition and we can estimate that right brain can be more activated at the $4,000^{\circ}K$ condition. But we can not find out any different at the $6,000^{\circ}K$ condition. Main cause of no difference from the color temperature was the similarity of color temperature under the general fluorescent lamp. And interface temperature of radiant heat design results LED and PCB was approximately 80 degrees to COMSOL Multiphysics, and changed until approximately 50 degrees until a floor plane of PCB, and verification as arranged chip LED to metal PCB, and it was possible, and a near radiant heat design was confirmed to an approximate value of, as a result, acid manufacture.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.323-327
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.6
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• pp.1178-1182
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• 2011

The best methods for distribution controled of LED lighting fixtures is control to designed LED chip array, lens and reflector. However, lens design need distribution design to reflector for low-wattage LED lighting because of difficulty of production and reduction of light efficiency. In addition, it needs maximize of thermal performance to improve the efficiency and reliability of device. As a result, for the height of reflector 40[mm] and Inclination 25[$^{\circ}$], we can see the best distribution properties, and, in the thermal properties, junction temperature MCPCB 62.9 [$^{\circ}C$], FR4 PCB 89.6 [$^{\circ}C$], FR4 PCB from Via-hole is 63.1 [$^{\circ}C$]. it may improve for thermal properties for makes the Via-hole.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.425-428
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. To mold a solid-state silicone encapsulment, curing by mixing at elevated temperatures followed by cooling is necessary. As the silicone molding process is involved in healing and subsequent cooling, the thermal residual stress, which causes mechanical warpage or optical birefringence in the final silicone encapsulment, may be induced if there are non-uniformities in cured silicone material properties or encapsulment shape design. The prediction of residual stress is necessary to design a high-quality silicone molding process. Therefore, in the present paper, a numerical parametric study was attempted to evaluate the heating and cooling effects on the thermal residual stress induced in the cured silicone.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.56-59
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• 2009

In the nineties the invention of the InGaN blue LED has innovated illumination technology. Currently LCD backlighting and more and more general lighting applications are based on white LEDs comprising of inorganic phosphors and blue emitting InGaN chip. Well established phosphor materials are ortho silicates and garnets like yellow emitting YAG:Ce. In our paper we demonstrate that garnet materials also allow for green light emission for both, general lighting and backlighting LED applications.

• Journal of the Optical Society of Korea
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• v.16 no.3
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• pp.203-209
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• 2012

Visible light communications (VLC) use modern solid-state light-emitting diodes (LEDs) to broadcast information. Emerging white-light LEDs allow the combination of lighting and optical wireless communication in one optical source. In this paper, a new LED lighting design using one-chip-type white LEDs is proposed for efficient illumination and optical wireless communications under the existence of several obstacles. Lighting and communication performance are analyzed to show the effectiveness of the proposed LED lighting. Specifically, the signal-to-noise ratio considering intersymbol interference and the bit-error rate of variable pulse position modulation (VPPM) with dimming control are considered.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.455-457
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• 2011

PIN type의 LED(${\lambda}=630nm$)와 photo TR을 이용하여 PPG 센서를 제작하였다. 이 때, LED의 광출력은 window 통과 후, 약 $240{\mu}W$이다. 그리고 인체에서 흡수 및 반사가 이루어진 후의 광파워는 더욱 작기 때문에 이를 보완하기 위해 photo TR을 LED 양측으로 배치하여 주변으로 반사하는 광을 측정하였다. 측정 된 신호는 filter와 OP amp.를 이용하여 1차 처리과정을 거치고, 알고리즘을 이용하여 2차 처리 하였다. 또한 알고리즘은 평상시를 포함하여 운동시에도 측정이 가능하도록 설계하였다.

• The Journal of the Convergence on Culture Technology
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• v.7 no.1
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• pp.564-569
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• 2021

In this paper, for the typical LED and the tilted LED, when there is no electrode, when 20% absorption (80% reflection) occurs at the electrode, and when 60% absorption (40% reflection) occurs at the electrode, the effect of the absorption at the electrode and the height of the active region on the photon extraction efficiency and the mean photon path length was investigated, and an appropriate height of the active region was proposed. In a typical LED, as the absorption of the electrode increases, the photon extraction efficiency decreases from 18% to 15% and 13%, and the photon extraction efficiency is highest when the height of the active area is located in the center between the two electrodes. In the tilted LED, as the absorption of the electrode increases, the photon extraction efficiency decreases from 38% to 33% and 25%, and the photon extraction efficiency is highest when the height of the active area is located in the center between the two electrodes. The tilted LED can increase the photon extraction efficiency more than twice than that of a typical LED, where photons are trapped inside the chip due to total reflection.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.26 no.6
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• pp.87-93
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• 2012

In this paper, we propose an analog-to-digital converter to set the address of a I2C slave chip. The proposed scheme converts a fixed voltage between 0 and VDD to the digital value which can be used as the address of the slave chip. The rising time and the falling time are measured with digital counter in a serially connected RC circuit, while the circuit is being charged and discharged with the voltage to be measured. The ratio of the two measured values is used to get the corresponding digital value. This scheme gives a strong point which is to be implementable all the parts except comparator using digital logic. Although the method utilizes RC circuit, it has no relation with the RC value if the quantization error is disregarded. Experimental result shows that the proposed scheme gives 32-level resolution thus it can be used to configure the address of the I2C slave chip.