• Title/Summary/Keyword: chemical gassing

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The Application of Gassed Bulk Emulsion to Quarry Blasting in Limestone Mine (석회석 광산 채석발파에서 Gassed Bulk Emulsion의 적용)

  • Min, Hyung-Dong;Jeong, Min-Su;Park, Yun-Seok;Lee, Eung-So;Lee, Won-Wook
    • Explosives and Blasting
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    • v.25 no.2
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    • pp.61-70
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    • 2007
  • Korean large limestone mines started to employ bulk emulsion explosives to improve the productivity in early 2000s. As the application of the bulk emulsion explosives became common in the mid 2000s, the bulk emulsion application increases overall performance but it tends to decrease the moving and heaving because it lacks in gas volume and heat energy. Therefore, the chemical gassing technique was introduced to improve the blasting efficiency of the existing bulk emulsion explosives. The chemical gassing is a technique to replacing GMB(Glass Micro Balloon), which is used for a sensitizer, with gassing agent to chemically sensitize it. This paper introduces the case of successful application of chemical gassing in a Korean large limestone mine. We also compared and evaluated the blast and work efficiency between bulk emulsion GMB & gassing agent (chemical gassing). The results indicate that the replacement of GMB with gassing agent improved fragmentation in the upper part and toe of a bench as well as moving efficiency of the material.

Novel Maskless Bumping for 3D Integration

  • Choi, Kwang-Seong;Sung, Ki-Jun;Lim, Byeong-Ok;Bae, Hyun-Cheol;Jung, Sung-Hae;Moon, Jong-Tae;Eom, Yong-Sung
    • ETRI Journal
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    • v.32 no.2
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    • pp.342-344
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    • 2010
  • A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.

Studies on Rheological Properties of Dough and Stability of Frozen Dough (밀가루의 이화학적(理化學的)인 성질(性質) 및 냉동(冷凍)반죽의 안정성(安定性))

  • Suh, Sook Chool;Song, Hyung lk;Chung, Ki Taek
    • Current Research on Agriculture and Life Sciences
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    • v.5
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    • pp.75-80
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    • 1987
  • We investigated physico-chemical properties of hard wheat flours for frozen yeast-raised breadmaking and freezing stability of frozen dough prepared by the straight no-time method. The general Composition of wheat flours were : moisture ; 14.0%, ash ; 0.48%. protein ; 13.15%, and dry gluten ; 13.43%. In farinograph data, development time and water absorption were 5.5 mimutes and 62 %, respectively. Amylograph maximum viscosity was 500 BU. Resistance to extention increased with the time and their extensibility decreased in the extensigraph data. From these results obtained from these physico-chemical properties, it was confirmed that the used wheat flours were most suitable for bread-baking. Considering effect of gassing power on cold storage period and fermentation time, it was effective that dough temperature should be adjusted to $20^{\circ}C$ in order to decrease freezing injury and maintain freezing stability.

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