• Macromolecular Research
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• 제8권6호
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• pp.253-260
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• 2000

Biodegradable wafers were prepared with poly (hydroxybutyrate-co-hydroxyvalerate) (PHBV;5, 10, and 15 mole% for 3-hydroxyvalerate) by simple heat pressing method for the sustained release of antibiotic agent, gentamicin sulfate (GS) to investigate the possibility of the treatment for osteomyelitis. The effects of hydroxyvalerate (HV) content, thickness of wafers, various types of additives such as sodium dodecyl sulfate (SDS), microcrystalline cellulose, polyvinylpyrrolidone, and hydroxypropylcellulose (HPC), and different initial drug loading ratio on the release profile have been investigated. In vitro release studies showed that different release patterns and rates could be achieved by simply modifying factors in the preparation conditions. PHBV wafers with 3 mm thickness, 10% of GS initial loading, 15% of HV content and addition of 5% of SDS and HPC were free from initial burst and a near-zero-order sustained release was observed for over 30 days. It might be suggested that the mechanisms of G5 release may be more predominant simple dissolution and diffusion of GS than erosion of PHBV in our system.

• Transactions on Electrical and Electronic Materials
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• 제13권3호
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• pp.139-143
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• 2012

Optical emission spectroscopy (OES) is often used for real-time analysis of the plasma processes. OES has been suggested as a primary plasma process monitoring tool. It has the advantage of non-invasive in-situ monitoring capability but selecting the proper wavelengths for the analysis of OES data generally relies on empirically established methods. In this paper, we propose a practical method for the selection of OES wavelength peaks for the analysis of plasma etch process and this is done by investigating reactants and by-product gas species that reside in the plasma etch chamber. Wavelength selection criteria are based on the standard deviation and correlation coefficients. Moreover, chemical actinometry is employed for the normalization of the selected wavelengths. We also present the importance of chemical actinometry of OES data for quantitative analysis of plasma. Then, the suggested OES peak selection method is employed.. This method is used to find out the reason behind abnormal etching of PR erosion during a series of $SiO_2$ etch processes using the same recipe. From the experimental verification, we convinced that OES is not only capable for real-time detection of abnormal plasma process but it is also useful for the analysis of suspicious plasma behavior.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.528-528
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• 2007

Cu CMP widely has been using for the formation of multilevel metal interconnects by the Cu damascene process. And lower dielectric constant materials are required for the below 45nm technology node. As the dielectric constant of dielectric materials are smaller, the strength of dielectric materials become weaker. Therefore these materials are easily damaged by high down pressure during conventional CMP. Also, technical problems such as surface scratches, delamination, dishing and erosion are also occurred. In order to overcome these problems in CMP, the ECMP (electro-chemical mechanical planarization) has been introduced. In this process, abrasive free electrolyte, soft pad and low down force were used. The electrolyte is one of important factor to solve these problems. Also, additives are required to improve the removal rate, uniformity, surface roughness, defects, and so on. In this study, KOH and $NaNO_3$ based electrolytes were used for Cu ECMP and the electrochemical behavior was evaluated by the potentiostat. Also, the Cu surface was observed by SEM as a function of applied voltage and chemical concentration.

• Bulletin of the Korean Chemical Society
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• 제22권8호
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• pp.872-876
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• 2001

Topological changes caused by the alkaline and enzymatic attacks of solution-grown, chain-folded lamellar crystals (SGCs) of poly[(R)-3-hydroxybutyrate] P(3HB) have been studied in order to investigate the chain-folding structure in P(3HB) crystal regions. NaOH and an extracellular PHB depolymerase purified from Alcaligenes faecalis T1 were used for alkaline and enzymatic hydrolysis, respectively. The measurements were performed on crystals attached to a substrate which is inactive to degradation mediums. Both alkaline and enzymatic attacks lead to a breakup of the lamellar crystals along the crystallographic b-axis during initial erosion. Since hydrolysis preferentially occurs in amorphous regions, this morphological result reflects relatively loosely packed chains in core parts of lamellar crystals. Additionally, it was supported by the ridge formation along the b-axis in the lamellar crystals after thermal treatment at a low temperature because of the thermally sensitive nature of the loosely packed chains in lamellar crystals. However, the alkaline hydrolysis accompanied the chain erosions or scissions in quasi-regular folded lamellar surfaces due to smaller size of alkaline ions in comparison to the enzyme, resulting in the decrease of molecular weight.

• Nuclear Engineering and Technology
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• 제53권9호
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• pp.2866-2877
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• 2021

The complex coupling relationship between liquid sodium and concrete materials affects both the sodium fire characteristics and concrete properties through heat and chemical erosion. In this study, experiments on direct and indirect (separated by a steel plate) contact of the columnar sodium fire with the concrete surface were performed. It was found that the combustion efficiency of liquid sodium in direct contact with concrete was significantly enhanced and accompanied by intermittent explosions and splashing of small concrete fragments. The sodium fire on the surface of the concrete considerably increased the internal temperature, pore size, and distribution density of the concrete. In addition, the depth of influence on the loosening of the concrete structure was also greatly extended. The contact of liquid sodium with the concrete substantially affected its permeability resistance. The water absorption of the concrete surface was increased by more than 70% when liquid sodium directly impacted the bare concrete surface. However, the change in water absorption in the centre of the concrete was primarily affected by the duration of the external heat.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.28-33
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• 2020

Plasma etching process employs high density plasma to create surface chemistry and physical reactions, by which to remove material. Plasma chamber includes silicon-based materials such as a focus ring and gas distribution plate. Focus ring needs to be replaced after a short period. For this reason, there is a need to find materials resistant to erosion by plasma. The developed chemical vapor deposition processing to produce silicon carbide parts with high purity has also supported its widespread use in the plasma etch process. Silicon carbide maintains mechanical strength at high temperature, it have been use to chamber parts for plasma. Recently, besides the structural aspects of silicon carbide, its electrical conductivity and possibly its enhanced life time under high density plasma with less generation of contamination particles are drawing attention for use in applications such as upper electrode or focus rings, which have been made of silicon for a long time. However, especially for high purity silicon carbide focus ring, which has usually been made by the chemical vapor deposition method, there has been no study about quality improvement. The goal of this study is to reduce surface roughness and depth of damage by diamond tool grit size and tool dressing of diamond tools for precise dimensional assurance of focus rings.

• 전자공학회논문지D
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• 제35D권9호
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• pp.20-25
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• 1998

대면적 평탄화 및 미세패턴형성기술로 각광받고 있는 CMP(chemical mechanical polishing) 공정을 이용하여 SiO₂ trench 패턴의 피치크기와 밀도에 따른 Cu의 평탄화 과정과 평탄화 이후의 표면 profile을 AFM(atomic forced microscopy)으로 측정하고 분석하였다. 실험결과, 평탄화 초기 연마율은 패턴밀도가 높고 피치크기가 작을수록 연마율이 증가하였으며, 초기 평탄화 이후 연마율이 급속히 감소함을 알 수 있었다. 말기 평탄화 이후, 전체 패턴의 평균 rms roughness는 120Å이었다. 그러나, 패턴피치 크기가 2㎛ 이하이고, 50% 패턴밀도를 갖는 패턴의 경우에는 Cu의 일부분이 120∼330Å 정도의 깊이로 떨어져 나가는 현상과 SiO₂와 Cu의 경계면에 oxide erosion 현상이 나타났으며, 패턴 피치 크기가 10㎛ 및 15㎛에서는 Cu와 SiO₂경계면 부분에 Cu가 260∼340Å 정도로 trench 되어 있는 것을 볼 수 있었다. 또한, SiO₂와 Cu의 패턴내부 및 접합면에서 생기는 수백 Å이하의 peeling 및 deeping 현상의 원인과 해결방안에 대해 논의하였다.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.37-41
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• 2012

Cu 본딩을 이용한 웨이퍼 레벨 적층 기술은 고밀도 DRAM 이나 고성능 Logic 소자 적층 또는 이종소자 적층의 핵심 기술로 매우 중요시 되고 있다. Cu 본딩 공정을 최적화하기 위해서는 Cu chemical mechanical polishing(CMP)공정 개발이 필수적이며, 본딩층 평탄화를 위한 중요한 핵심 기술이라 하겠다. 특히 Logic 소자 응용에서는 ultra low-k 유전체와 호환성이 좋은 Ti barrier를 선호하는데, Ti barrier는 전기화학적으로 Cu CMP 슬러리에 영향을 받는 경우가 많다. 본 연구에서는 웨이퍼 레벨 Cu 본딩 기술을 위한 Ti/Cu 배선 구조의 Cu CMP 공정 기술을 연구하였다. 다마싱(damascene) 공정으로 Cu CMP 웨이퍼 시편을 제작하였고, 두 종류의 슬러리를 비교 분석 하였다. Cu 연마율(removal rate)과 슬러리에 대한 $SiO_2$와 Ti barrier의 선택비(selectivity)를 측정하였으며, 라인 폭과 금속 패턴 밀도에 대한 Cu dishing과 oxide erosion을 평가하였다.

• 한국물환경학회지
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• 제40권2호
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• pp.79-88
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• 2024

This study employed field measurements and biogeochemical analysis to examine the effects of seasonal conditions (e.g., temperature and precipitation) and human intervention (e.g., dam or weir construction) on the chemical composition of dissolved organic matter, flocculation kinetics of suspended particulate matter, and formation of the fluid mud layer on riverbeds. The results indicated that a water environment with a substantial amount of biopolymers offered favorable conditions for flocculation kinetics during an algal bloom period in summer; a thick fluid mud layer was found to be predominated with cohesive materials during this period. However, after high rainfall, a substantial influx of terrigenous humic substances led to enhanced stabilization of the particulate matter, thereby decreasing flocculation and deposition, and the reduced biopolymer composition served to weaken the erosion resistance of the fluid mud on the riverbed. Moreover, a high-turbulence condition disaggregated the flocs and the fluid mud layer and resuspended the suspended particulate matter in the water column. This study demonstrates the mutual relationship that exists between biogeochemistry, flocculation kinetics, and the formation of the fluid mud layer on the riverine area during different seasons and under varying hydrological conditions. These findings are expected to eventually help inform the more optimal management of water resources, which is an urgent task in the face of anthropogenic stressors and climate change.

• 생태와환경
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• 제38권3호통권113호
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• pp.334-340
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• 2005

The chemical forms of Cd, Cu, Pb, and Zn were analysed by sequential extraction technique to evaluate the effects of drying and heating of dredged sediments from Lake Chungcho. The most abundant fraction of Cd, Cu, and Zn in the wet and untreated sediment was organic/sulfidic fraction that is state in reducing environment such as the bottom condition of Lake Chungcho, while Pb dominated in residual fraction. This means that the source of Cd, Cu, and Zn in the Chungcho lake sediment is related to the organic degradation and Pb to the erosion from surrounding rocks. With drying and oxidation by dredging, heating treatment, and disposal of the lake sediment, the chemical forms of studied metals changed greatly from organic/sulfidic fraction to adsorbed and reducible fractions which are more labile in oxygenated environment. Organic/sulfidic fraction of Cd, Cu and Pb in the wet sediment was transformed with drying and heating treatments to the labile ones like adsorbed and reducible fraction, but Zn to carbonate and reducible fraction. Heating of the sediment at $320^{\circ}C$ greatly increased the labile fraction of Cd and Cu, while that at $105^{\circ}C$ for Pb and Zn. It is believed that the increase in labile forms of heavy metals in the sediments by drying and heating is caused by the contact with oxygen during drying and heating and by the increase of pH of the pore water at the expense of organic/sulfidic fraction. It is concluded that the drying and oxidation currently used in the treatment of dredged sediment can increase labile forms of heavy metals in the sediment, and the potential of the metal availability from the sediment.