• Bulletin of the Korean Chemical Society
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• 제27권10호
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• pp.1685-1688
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• 2006

• Bulletin of the Korean Chemical Society
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• 제28권10호
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• pp.1867-1870
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• 2007

• Bulletin of the Korean Chemical Society
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• 제24권2호
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• pp.153-154
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• 2003

• Bulletin of the Korean Chemical Society
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• 제30권6호
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• pp.1241-1242
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• 2009

• Journal of Welding and Joining
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• 제18권5호
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• pp.90-97
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• 2000

Effect of alloy elements on joinability of insert metal for liquid phase diffusion bonding of heat resistant alloys was investigated in this study. Also, optimum chemical composition of insert metal was explained using interpolation method. The insert metals utilized was commercial Ni-base amorphous foils and newly developed Ni-base filler metals with B, Si and Cr in this study. Melting point and critical interlayer width(CIW) decreased with increasing additional amount of B, Si and Cr, melting point lowering element of the insert metal. Optimized chemical composition of insert metals could be estimated by interpolation method. The optimum amount of B, Si, Cr addition into the insert metal were found to be about 3%, 4% and 3%, respectively. The measured characteristic values, melting point, microhardness in the bonded interlayer and CIW of the insert metals were the almost identical to ones of the calculated results by interpolation method.

• 구강회복응용과학지
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• 제32권4호
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• pp.293-300
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• 2016

목적: 중합방식과 화학적 조성이 다른 본딩제들이 자가중합형 비스아크릴 임시수복 재료의 결합에 미치는 영향을 알아 보고자 하였다. 연구 재료 및 방법: 원반 형태의 비스아크릴 임시수복 재료 시편 40개를 준비한 후 본딩제의 중합특성에 따라 대조군을 포함 4개의 군으로 나누었다. 본딩제 도포 후 직경 4 mm의 원형 구멍을 가진 4 mm 두께의 테플론 몰드를 이용하여 동일한 비스아크릴 임시수복 재료을 첨상하였다. 전단결합강도시험을 시행하였으며 파절면을 현미경으로 관찰하였다. 일원배치 분산분석과 Tukey 사후분석을 사용하여 유의수준 0.05로 검증하였다. 결과: 화학중합형 본딩제를 사용한 군에서 통계적으로 유의한 가장 높은 전단결합강도를 보였으며($27.36{\pm}4.30 MPa$, P < 0.05) 모든 시편에서 비스아크릴 임시수복 재료 내에서 파절이 일어나는 응집성 파절 양상을 보였다(100%). 실험군중 가장 낮은 값은 광중합형 본딩제를 사용한 군에서 기록되었으며($13.29{\pm}2.56 MPa$) 이는 대조군과 거의 유사한 값을 보였다. 동일한 광중합 방식 이지만 화학중합 레진과의 호환성을 높인 본딩제를 사용한 군에서는 광중합형 본딩제를 사용한 군에 비해 통계적으로 유의하게 높은 값을 보였다(P = 0.043). 결론: 본딩제의 종류가 수리된 비스아크릴 임시수복 재료의 전단결합 강도에 영향을 주며, 비스아크릴 임시수복 재료의 수리 시 적절한 본딩제 선택이 중요하다.

• 한국정밀공학회지
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• 제31권5호
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• pp.441-449
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• 2014

Thermoplastic fusion bonding is widely used to seal polymer microfluidic devices and optimal bonding protocol is required to obtain a successful bonding, strong bonding force without channel deformation. Besides, UV modification of the PMMA (poly-methyl methacrylate) is commonly used for chemical or biological application before the bonding process. However, study of thermal bonding for the UV modified PMMA was not reported yet. Unlike pristine PMMA, the optimal bonding parameters of the UV modified PMMA were $103^{\circ}C$, 71 kPa, and 35 minutes. A very low aspect ratio micro channel (AR=1:100, $20{\mu}m$ depth and $2000{\mu}m$ width) was successfully bonded (over 95%, n>100). Moreover, thermal bonding of multi stack PMMA chips was successfully demonstrated in this study. The results may applicable to fabricate a complex 3 dimensional microchannel networks.

• 펄프종이기술
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• 제34권5호
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• pp.56-62
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• 2002

Alternative way of shaping fibers suitable for papermaking was introduced. Impact refining, which was done simply by hitting wet fibers with a metal weight vertically, was intended to keep the fibers from shortening and to cause mostly internal fibrillation. Virgin chemical pulp, its recycled one and OCC were used in the experiment. It was noticed from the experiment that impact refining on virgin chemical pulp kept the fiber length and increased bonding properties greatly. However, in the recycled fibers from the chemical pulp, fiber length and bonding properties were decreased. In OCC, which seems to contain fractions of semi-chemical pulp and mechanical pulp (GP), and which is recycled pulp from corrugated boxes, fiber length and bonding properties were decreased disastrously. We believe recycled cellulosic fibers (recycled chemical pulp and OCC in this case), which went through hornification, were less resistant to the mechanical impact than virgin chemical pulp. For virgin chemical pulp, impact refining allowed no significant fiber length shortening, high WRV, and high mechanical strength.

• Bulletin of the Korean Chemical Society
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• 제34권2호
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• pp.609-614
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• 2013

Extended H$\ddot{u}$ckel tight-binding band structure calculations are used to address the chemical bonding and elastic properties of $Zr_2AC$ (A=Al, Si, P, and S). Elastic properties are interpreted by analyzing the density of states and the crystal orbital overlap population for the respective phases. Our results show that the bulk modulus of these ternary compounds is determined by the strength of Zr-A bonds.

• Bulletin of the Korean Chemical Society
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• 제24권3호
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• pp.325-333
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• 2003

An analysis of the electronic structure and bonding in the ternary silicide YNiSi₃is made, using extended Huckel tight-binding calculations. The YNiSi₃structure consists of Ni-capped Si₂dimer layers and Si zigzag chains. Significant bonding interactions are present between the silicon atoms in the structure. The oxidation state formalism of $(Y^{3+})(Ni^0)(Si^3)^{3-}$ for YNiSi₃constitutes a good starting point to describe its electronic structure. Si atoms receive electrons from the most electropositive Y in YNiSi₃, and Ni 3d and Si 3p states dominate below the Fermi level. There is an interesting electron balance between the two Si and Ni sublattices. Since the ${\pi}^*$ orbitals in the Si chain and the Ni d and s block levels are almost completely occupied, the charge balance for YNiSi₃can be rewritten as $(Y^{3+})(Ni^{2-})(Si^{2-})(Si-Si)^+$, making the Si₂layers oxidized. These results suggest that the Si zigzag chain contains single bonds and the Si₂double layer possesses single bonds within a dimer with a partial double bond character. Strong Si-Si and Ni-Si bonding interactions are important for giving stability to the structure, while essentially no metal-metal bonding exists at all. The 2D metallic behavior of this compound is due to the Si-Si interaction leading to dispersion of the several Si₂π bands crossing the Fermi level in the plane perpendicular to the crystallographic b axis.