• Journal of Korea Multimedia Society
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• v.13 no.8
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• pp.1235-1244
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• 2010

Most emerging smart phones support capacitive touch sensors. It renders existing gesture-based interfaces not suitable since they were developed for the resistive touch sensors and pen-based input. Unlike the flick gestures from the existing gesture interfaces, the finger flick gesture used in this paper reduces the workload about half by selecting the target and the command to perform on the target at a single touch input. With the combination with multi-touch interface, it supports various menu commands without having to learn complex gestures, and is suitable for the touch-based devices hence it minimizes input error. This research designs and implements the multi-touch and flick interface to provide an effective file management system on the smart phones with capacitive touch input. The evaluation proves that the suggested interface is superior to the existing methods on the capacitive touch input devices.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.11 s.254
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• pp.1369-1375
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• 2006

In this work, mechanical characteristics of stainless steel diaphragm have been studied as a potential robust substrate and a diaphragm material for micromachined devices. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on a stainless steel diaphragm have been designed, fabricated and characterized. The fabrication process for stainless steel micromachined devices keeps the membrane and substrate being at the environment of 8.65MPa pressure and $175^{\circ}C$ for a half hour and then subsequently cooled to $25^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated stainless steel film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the device fabricated using these technologies is 9.03 ppm $kPa^{-1}$ with a net capacitance change of 0.14 pF over a range 0$\sim$180 kPa.

• Journal of Sensor Science and Technology
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• v.23 no.1
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• pp.7-14
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• 2014

Noncontact electrocardiogram (ECG) measurement using capacitive-coupled technique is a very reliable long-term noninvasive health-care remote monitoring system. It can be used continuously without interrupting the daily activities of the user and is one of the most promising developments in health-care technology. However, ECG signal is a very small electric signal. A robust system is needed to separate the clean ECG signal from noise in the measurement environment. Noise may come from many sources around the system, for example, bad contact between the sensor and body, common-mode electrical noise, movement artifacts, and triboelectric effect. Thus, in this paper, the extended Kalman filter (EKF) is applied to denoise a real-time ECG signal in capacitive-coupled sensors. The ECG signal becomes highly stable and noise-free by combining the common analog signal processing and the digital EKF in the processing step. Furthermore, to achieve ubiquitous monitoring, android-based application is developed to process the heart rate in a realtime ECG measurement.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.83-89
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• 2012

A simple array of metal-insulator-metal capacitive elements was proposed for a potential application in humidity sensing platforms. We fabricated meso-scale sensors with different sizes(large-size: $2.7{\times}2.7mm^2$ ; mid-size: $1.5{\times}1.5mm^2$ ; small-size: $0.7{\times}0.7mm^2$) and characterized the performance of each design. Polyimide films were utilized as a humidity-sensitive layer. Capacitance changes of the polyimide layer were measured with respect to water absorption. The device showed sensitivity in the full range of relative humidity (RH) with excellent linearity(correlation coefficient > 0.994). This array structure exhibits unique advantages including easy fabrication process, high batch productivity, and high structural compatibility with various substrate materials. It is anticipated that this device structure will be potentially useful in unique applications including mapping spatial humidity variations over a meso-scale area and implementing flexible humidity sensing element arrays.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.128-132
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• 2004

This paper presents the design, fabrication sequence and measurement results of a highly sensitive capacitive-type humidity sensor using a polyimide film without hydrophobic elements. The structure of the humidity sensor is MIM (metalinsulator-metal). For a high sensitivity, a modified aromatic polyimides as a moisture absorbing layer has been synthesized instead of using general polyimides containing hydrophobic elements. The polyimide film was obtained by synthesizing and thermally polymerizing polyamic acid composed of m-pyromellitic dianhydride, phenelenediamine and dimethylacetamide. Characteristics of fabricated sensors which include sensitivity, hysteresis and stability have been measured. The measurement result shows the percent normalized capacitance change of 0.37/%RH over a range from 10 to 90%RH, hysteresis of 0.77% over the same %RH range and maximum drift of 0.25% at 50%RH. The result shows that the developed humidity sensor can be applied to evaluate a hermeticity of various sensors and actuator systems as well as micro packages.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1529-1531
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• 2003

Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, piezocapastive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. The screen printing technique has been used to fabricate the pressure sensors on alumina substrate($Al_2O_3$). Thick film capacitive of strain sensing characteristics are reported and dielectric paste based on (Ti+Ba) materials. The electric property of dielectric paste has been studied and exhibit good properly with good gage factor comparable to piezoresistive strain gage. New piezocapacitive strain sensor was designed and tested. The output of capacitive value was good characteristics.

• Journal of Sensor Science and Technology
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• v.31 no.3
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• pp.139-144
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• 2022

Advanced tactile sensors are receiving significant attention in various industries such as extended reality, electronic skin, organic user interfaces, and robotics. The capabilities of advanced tactile sensors require a variety of functions, including position sensing, pressure sensing, and material recognition. Moreover, they should comsume less power and be bio-friendly with human contact. Recently, a tactile sensor based on the triboelectrification effect was developed. Triboelectric tactile sensors have the advantages of wide material availability, simple structure, and low manufacturing cost. Because they generate electricity by contact, they have low power consumption compared to conventional tactile sensors such as capacitive and piezoresistive. Furthermore, they have the ability to recognize the contact material as well as execute position and pressure sensing functions using the triboelectrification effect. The aim of this study is to introduce the progress of research on triboelectrification-based tactile sensors with various functions such as position sensing, pressure sensing and contact material recognition.

• Journal of Sensor Science and Technology
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• v.26 no.1
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• pp.60-65
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• 2017

This paper describes the low noise and low power IC using the opamp sharing technique for the capacitive micro-sensor sensing platform. The proposed IC reduces noise using correlated double sampling (CDS) and reduces power consumption using the opamp sharing technique. The IC is designed to be fully programmable, and can be digitally controlled by serial peripheral interface (SPI). The power consumption and the integrated input referred noise are 1.02 mW from a 3.3 V supply voltage and $0.164aF_{RMS}$ with a bandwidth of 400 Hz. The capacitive sensitivity, the input-output linearity and the figure of merits (FoM) are 2.5 mV/fF, 2.46 %FSO, and 8.4, respectively.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.55 no.1
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• pp.26-30
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• 2006

For the purpose of developing capacitive humidity sensor having interdigital electrodes, interdigital electrode was modeled and simulated to obtain capacitance and sensitivity as a function of geometric parameters like the structural gap and thickness. For the development of ASIC, switched capacitor signal processing circuits for capacitive humidity sensor were designed and simulated by Cadence using $0.25{\mu}m$ CMOS process parameters. The signal processing circuits are composed of amplifier for voltage gain control, and clock generator for sensor driving and switch control. The characteristics of the fabricated sensors are; 1) sensitivity is 9fF/%R.H., 2) temperature coefficient of offset(TCO) is $0.4%R.H./^{\circ}C$, 3) nonlinearity is 1.2%FS, 4) hysteresis is 1.5%FS in humidity range of $3%R.H.{\sim}98%R.H.$. The response time is 50 seconds in adsorption and 70 seconds in desorption. Fabricated process used in this capacitive humidity sensor having interdigital electrode are just as similar as conventional IC process technology. Therefore this can be easily mass produced with low cost, simple circuit and utilized in many applications for both industrial and environmental measurement and control system, such as monitoring system of environment, automobile, displayer, IC process room, and laboratory etc.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.3
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• pp.144-148
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• 2001

For the purpose of developing capacitive humidity sensor having interdigit electrodes, interdigit electrode was modeled and simulated to obtain capacitance and sensitivity as a function of geometric parameters like the structural gap and thichness. For the development of ASIC, switched capacitor signal conditioning circuits for capacitive humidity sensor were designed and simulated by cadence using 0.25um CMOS process parameters. The signal conditioning circuits are composed of amplifier for voltage gain control, and clock generator for sensor driving and switch control The characteristics of the fabricated sensors are; 1) sensitivity is 9fF/%R.H., 2) temperature coefficient of offset(TCO) is 0.4%R.H./$^{\circ}C$, 3) nonlinearity is 1.2%FS, 4) hysteresis is 1.5%FS in humidity range of 3%R.H. ${\sim}$ 98%R.H.. The response time is 50 seconds in adsorption and 70 seconds in desorption. Fabricated process used in this capacitive humidity sensor having interdigit electrode are just as similar as conventional IC process technology. Therefore this can be easily mass produced with low cost, simple circuit and utilized in many applications for both industrial and environmental measurement and control system, such as monitoring system of environment, automobile, displayer, IC process room, and laboratory etc..