• 한국세라믹학회지
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• 제56권6호
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• pp.589-595
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• 2019

The top-seeded solution growth (TSSG) method is an effective approach for the growth of high-quality SiC single crystals. In this method, the temperature gradient in the melt is the key factor determining the crystal growth rate and crystal quality. In this study, the effects of the aperture at the top of the hot-zone on the growth of the SiC single crystal obtained using the TSSG method were evaluated using multiphysics simulations. The temperature distribution and C concentration profile in the Si melt were taken into consideration. The simulation results showed that the adjustment of the aperture at the top of the hot-zone and the temperature gradient in the melt could be finely controlled. The surface morphology, crystal quality, and polytype stability of the grown SiC crystals were investigated using optical microscopy, high-resolution X-ray diffraction, and micro-Raman spectroscopy, respectively. The simulation and experimental results suggested that a small temperature gradient at the crystal-melt interface is suitable for growing high-quality SiC single crystals via the TSSG method.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1223-1225
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• 1994

The properties of $TiN/TiSi_2$ bilayer formed by a rapid thermal anneal ing is investigated when thin $SiO_2$ film exists at the Ti-Si interface. The competitive reaction for the $TiN/TiSi_2$ bilayer occurs above $600^{\circ}C$. The thickness of the $TiSi_2$ layer decreases with increasing $SiO_2$ film thickness while the TiN layer increases at the competitive reaction. The composition of TiN layer is changed to the $TiN_xO_y$ film due to the thin $SiO_2$ layer at the Ti-Si interface while the structure of the TiN and $TiSi_2$ layers was not changed.

• 대한기계학회논문집A
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• 제24권6호
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• pp.1584-1592
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• 2000

Reversed plane bending fatigue tests were conducted on SiC whisker reinforced aluminum composite which were consolidated by squeeze casting process. Initiation and growth of small surface fatigue c racks were investigated by means of a plastic replica technique. The fatigue crack initiated in the vicinity of SiC whisker/matrix interface. It was found that a fatigue crack deflected along SiC whisker and grew in a zig-zag manner microscopically, although the crack propagated along the direction normal to the loading axis macroscopically. The coalescence of micro-cracks was observed in the tests conducted at high stress levels, but were not evident in tests in which lower levels of stress were applied. Due to the coalescence, a higher crack growth rate of small cracks rather than those of long cracks was recognized in da/dn -ΔK realtionship.

• 한국세라믹학회지
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• 제39권10호
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• pp.948-954
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• 2002

차세대 발전 시스템에서 사용되는 고온 가스 필터용 지지층 소재를 제조하기 위하여 용융 Si 침윤 방법으로 기공율이 32∼36%, 주기공 크기가 37∼90 ${\mu}m$ 범위를 갖는 고강도 다공질 반응소결 탄화규소(RBSC)를 개발하였다. 반응소결 탄화규소 다공체의, 최대 파괴강도는 120MPa이었으며, 용융 Si 침윤 방법으로 제조된 반응소결 탄화규소 다공체에서는 SiC 입자 사이에 SiC/Si로 이루어진 기지상이 형성되어 있기 때문에 파괴 강도 및 열충격 특성이 점토 결합 탄화규소 다공체 보다 우수하였다. 반응소결 탄화규소 다공체의 기공율 및 기공 크기는 잔류 Si의 양 및 성형체에 사용한 SiC 입자 크기에 따라 다르게 나타났다.

• 한국전기전자재료학회논문지
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• 제15권6호
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• pp.479-485
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• 2002

We have investigated the effects of various wafers cleaning on glass/Si bonding using 4 inch Pyrex glass wafers and 4 inch silicon wafers. The various wafer cleaning methods were examined; SPM(sulfuric-peroxide mixture, $H_2SO_4:H_2O_2$ = 4 : 1, $120^{\circ}C$), RCA(company name, $NH_4OH:H_2O_2:H_2O$ = 1 : 1 : 5, $80^{\circ}C$), and combinations of those. The best room temperature bonding result was achieved when wafers were cleaned by SPM followed by RCA cleaning. The minimum increase in surface roughness measured by AFM(atomic force microscope) confirmed such results. During successive heat treatments, the bonding strength was improved with increased annealing temperatures up to $400^{\circ}C$, but debonding was observed at $450^{\circ}C$. The difference in thermal expansion coefficients between glass and Si wafer led debonding. When annealed at fixed temperatures(300 and $400^{\circ}C$), bonding strength was enhanced until 28 hours, but then decreased for further anneal. To find the cause of decrease in bonding strength in excessively long annealing time, the ion distribution at Si surface was investigated using SIMS(secondary ion mass spectrometry). tons such as sodium, which had been existed only in glass before annealing, were found at Si surface for long annealed samples. Decrease in bonding strength can be caused by the diffused sodium ions to pass the glass/si interface. Therefore, maximum bonding strength can be achieved when the cleaning procedure and the ion concentrations at interface are optimized in glass/Si wafer direct bonding.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.277-277
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• 2013

The epitaxial graphene on the 4H- or 6H-SiC(0001) surface has been intensively studied due to the possibility of wafer-scale growt. However the existence of interface layer (zero layer graphene) and its influence on the upper graphene layer have been considered as one of the main obstarcles for the industrial application. Among various methods tried to overcome the strong interaction with the substrate through the interface layer, it has been proved that the hydrogen intercalation successfully passivate the Si dangling bond of the substrate and can produce the quasi-free standing epitaxial graphene (QFEG) layers on the siC(0001) surface. In this study, we report the results of the angle-resolved photoemission spectroscopy (ARPES) and Raman spectroscopy for the QFEG layers produced by ex-situ and in-situ hydrogen intercalation.From the ARPES measurement, we confirmed that the Dirac points of QFEG layers exactly coincide with the Fermi level. The band structure of QFEG layer are sustainable upon thermal heating up to 1100 K and robust against the deposition of several metals andmolecular deposition. We also investigated the strain of the QFEG layers by using Raman spectroscopy measurement. From the change of the 2D peak position of graphene Raman spectrum, we found out that unlike the strong compressive strain in the normal epitaxial graphene on the SiC(0001) surface, the strain of the QFEG layer are significantly released and almost similar to that of the mechanically exfoliated graphene on the silicon oxide substrate. These results indicated that various ideas proposed for the ideal free-standing graphene can be tested based on the QFEG graphene layers grown on the SiC(0001) surface.

• 한국재료학회지
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• 제10권11호
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• pp.738-741
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• 2000

사이클로펜타디에닐 디카보닐 코발트 (Co(η(sup)5-C(sub)5H(sub)5) ($CO_2$)의 반응성 화학 기상 증착법에 의해 $600^{\circ}C$ 근처의기판온도에서 (100)Si 기판 위에 균일한 에피택셜 CoSi2 층이 후열처리를 거치지 않고 직접 성장되었다. (100) Si 기판 위에서 에피택셜 CoSi(sub)2 층의 성장 속도론을 $575^{\circ}C$에서 $650^{\circ}C$의 온도 구간에서 조사하였다. 증착 초기 단계에서 판(plate)모양의 CoSi(sub)2 스차이크가 쌍정의 구조를 가지고 (100) Si 기판에서 <111> 방향을 따라서 불연속적으로 핵생성되었다. {111}과 (100)면을 가진 불연속의 CoSi(sub)2 판은 (100) Si 위에서 평평한 계면으로 이루어진 에피택셜 층으로 성장했다. (100) Si 위에서 에피택셜 CoSi(sub)2 층을 통한 Co의 확산에 의해 제어되는 것으로 나타났다.

• 한국재료학회지
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• 제8권6호
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• pp.499-504
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• 1998

코발트 폴리사이드 게이트 전극을 형성할 때, 원주형(columnar)과 입자형(granular)다결정 Si 및 비정질 Si 기판위에 Co 단일막(Co monolayer)또는 Co/Ti 이중막(Co/Ti bilayer)을 사용하여 형성한 $CoSi_{2}$의 열정안정을 비교하여 기판의 결정성과 CoSi/ sub 2/ 형성방법이 열적안정성에 미치는 영향을 연구하였다.$ 900^{\circ}C$에서 600초까지 급속열처리하였을 때 , 기판을 비정질을 사용하거나 기판에 관계없이 Co/Ti 이중막을 사용하면 열적안정성이 향상되었다, 이는 평탄하고 깨끗한 기판 Si표면과 지연된 Co확산으로 인해,조성이 균일하고 계면이 평탄한 CoSi$_{2}$가 형성되었기 때문이다. $ CoSi_{2}$의 열적안정성에 가장 중요한 인자는 열처리 초기 처음 형성된 실리사이드의 조성 균일성과 기판과의 계면 평탄성이었다.

• 한국재료학회지
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• 제14권5호
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• pp.343-347
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• 2004

We investigated the growth feasibility of polycrystalline Si film on mica substrate for the transfer of the layer to a plastic substrate. The annealing temperature was limited up to $600^{\circ}C$ because of crack development in the mica substrate. Amorphous Si film was deposited on mica substrate by PECVD and was crystallized by furnace annealing. During the annealing, bubbles were formed at the Si/mica interface. The bubble formation was avoided by the Ar-plasma treatment before amorphous Si deposition. A uniform and clean polycrystalline Si film was obtained by coating $NiCl_2$ on the amorphous Si film and annealing at $500^{\circ}C$ for 10 h. The conventional Si lithography was possible on the mica substrate and the devices fabricated on the substrate could be transferred to a plastic substrate.

• Composites Research
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• 제21권6호
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• pp.15-22
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• 2008

본 연구는 SiC입자를 20% 강화된 알루미늄기 복합재료를 이용해서 평면굽힘피로시험을 향했다. 표면미소피로균열의 발생 및 진전거동은 레프리카법으로 연속관찰을 했고 파괴원인과 파괴기구를 규명하기 위해서 주사전자현미경을 이용했다. da/dn-$K_{max}$ 관계에서 저응력 레벨에서는 여러 개의 균열이 진전하고, 합체 등이 일어나는 것으로부터 진전속도는 꽤 분산(흐트러짐)이 심하고, 고응력 레벨에서는 비교적 흐트러짐은 적게 나타나는 것을 알 수 있었다.