• 한국재료학회:학술대회논문집
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• 한국재료학회 1997년도 한국재료학회 추계학술발표회
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• pp.167-167
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• 1997

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2005년도 춘계학술발표회
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• pp.513-514
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• 2005

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 추계학술발표회 초록집
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• pp.10-11
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• 2000

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2005년도 추계학술발표회
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• pp.386-387
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• 2005

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.56.1-56
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• 1998

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.88-88
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• 2005

• 한국결정성장학회지
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• 제7권4호
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• pp.626-631
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• 1997

하동고령토($Al_2O_3-SiC-C$)를 출발원료로하여 AlSiCa내화재 원료를 합성하였다. 하동고령토와 탄소분말을 혼합하여 수소분위기하에서 반응시킨결과, $1300^{\circ}C$에서$Al_2O_3-SiC-C$ 복합체가 힙성되기 시작하여$1400^{\circ}C$에서 완전 합성되었고, $SiO_2$에 대한 최적carbon량은 mole비로 1:4이었다. 합성시 알루미나 용기에 탄소분말을 충전시키지 않을 때는 미합성부분이 없이 밝은 녹색을 띈 $\beta$-SiC(cubic form) 를 형성함을 확인하였다.

• 한국산업융합학회 논문집
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• 제20권2호
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• pp.149-155
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• 2017

Mechanical properties of carbon coated $SiC_f/SiC$ composites have been investigated, in conjunction with a detailed analysis of microstructure. Especially, the fracture behavior of $SiC_f/SiC$ composites by the induction of carbon coating layers has been examined. The matrix region of $SiC_f/SiC$ composites with ultra-fine SiC powders were consolidated by a liquid phase sintering (LPS) process, using a sintering additive of $Al_2O_3-Y_2O_3$ powder compound. In this composite, plain and satin- woven Tyranno SA fabrics were also utilized as a reinforcing material. A carbon interfacial layer was coated around satin-woven SiC fabrics. The characterization of LPS-$SiC_f/SiC$ composites was investigated by means of SEM and three point bending test.

• 대한치과보철학회지
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• 제37권5호
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• pp.620-639
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• 1999

Indirect composite resins are used as an popular effective esthetic material in prosthetic dentistry, often with metallic substructure that provides support for restorations. Recently, new indirect composite resins as a substitute of ceramic have been developed. These resins provide good esthetics, with a wide range of hue and chroma. And the flexural strength of those is in the range of 120-150MPa, Which is higher than that of feldspathic Ceramic, and similar th that of Dicor. Although it has many merits, one of the major clinical problems of composite resins is the bond failure between metal and resin due to insufficient interfacial bond strength. The purpose of this study was to evaluate shear bond strength of the reinforced indirect composite resin to dental alloys. Three different composite resin systems($Artglass^{(R)},\;Sculpture^{(R)},\;Targis^{(R)}$) as test groups and ceramic($VMK\;68^{(R)}$) as control group were bonded to Ni-Cr-Be alloy($Rexillium\;III^{(R)}$) and gold alloy(Deva 4). All specimens were stored at $^37{\circ}C$ distilled water for 24 hours and the half of specimens were thermocycled 2000 times at temperature from $5^{\circ}C\;to\;60^{\circ}C$. The shear bond strengths of reinforced indirect composite resins to dental alloys were measured by using the universal testing machine, and modes of debonding were observed by stereoscope and scanning electron microscope. The results were as follows: 1 The shear bond strengths of reinforced indirect composite resins to dental alloys were approximately half those of ceramic to dental alloys(P<0.01). 2. There was no significant difference between the shear bond strength of several reinforced indirect composite resins to metal. 3. Alloy type did not affect on the shear bond strengths of resin to metal, but the shear bond strengths of ceramic to gold alloys were higher than those of ceramic to Ni-Cr alloys(P<0.05). 4. The shear bond strengths of Artglass and Targil to gold alloys were significantly decreased after thermocycling treatment(P<0.01). 5. Sculpture showed cohesive, adhesive, and mixed failure modes, but Artglass and Targis showed adhesive or mixed failures. And ceramic showed cohesive and mixed failures.

• 한국응용과학기술학회지
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• 제31권2호
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• pp.218-224
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• 2014

생분해성 고분자인 PLA를 매트릭스로 용액 중합된 DBSA가 15 mole% 정도 도핑된 PAni를 첨가하여 도전성 PAni/PLA 복합 필름을 제조하여 기계적, 전기적 특성 및 표면 morphology를 고찰하였다. FE SEM 측정 결과 PAni/PLA 복합 필름은 PAni 입자들이 매트릭스 고분자인 PLA에 비교적 잘 분산된 상태를 보였으며, 인장강도는 PAni 함유량 15 wt% 인 경우 $565.3kg_f/cm^2$에서 $309.7kg_f/cm^2$로 급격히 감소하였으며, 신율은 모든 필름에서 3-6%로 크게 변화하지는 않았다. 전기전도도는 PAni의 함량이 증가함에 따라 상승하였으며, PAni 함유량이 15 wt% 인 복합필름의 경우 $2.9{\times}10^{-3}$ S/cm의 전기전도도를 나타내었다. PAni 함유량에 따른 복합 필름의 열적 안정성은 $300^{\circ}C$ 이하에서는 약간 낮아졌으며, 고온 처리 후의 최종 잔존 타르의 함량은 PAni의 함량에 비례하였다. 결과적으로 PAni를 15 wt% 이상 함유한 복합필름은 전자파차폐 및 정전기방지 소재로 응용될 수 있다.