• Journal of Digital Convergence
• /
• v.14 no.11
• /
• pp.449-457
• /
• 2016

At this study, we select five colorful and high-acid fruits: grape, lemon, orange, grapefruit and kiwi, and we made a composite resin specimen and dipped into fruit juice in order to figure out influence that affects on surface corrosion and coloring. We dipped resin specimen into fruit juice by three-day and seven-day interval at $37^{\circ}C$. Control group used the resin that was not dipped into fruit juice. For surface change according to the time, it was observed by using scanning electron microscopy, and it was measured by using spectrophotometer for change of coloring degree. As a result of surface change of resin by using scanning electron microscopy, furrow size between surface particles increased, and rectangular rod-shape structure was emerged, and small prominent particles on bumps disappeared. As a result of coloring degree of resin by measuring spectrophotometer, a difference between experimental group appears with the darkest brightness in the case where it is dipped into grape extracts.

• Korean Journal of Materials Research
• /
• v.10 no.12
• /
• pp.853-863
• /
• 2000

In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

• The Journal of Sustainable Design and Educational Environment Research
• /
• v.14 no.2
• /
• pp.26-36
• /
• 2015

The new town was assumed that there is a difference between the country's elementary school environment. First, given the important elements of the school safety plan in order to verify this, and we plan to set up each of these elements by safety criteria. In the second chapter in order to achieve the objective of this study was to develop indicators to evaluate the safety of the school environment influences the safety of the school environment through the theoretical consideration. In Chapter 3, the difference in safety through the new elementary school survey of metropolitan areas was given a score per item per item depending on the evaluation criteria. The fourth section is the difference between safety school environment can be summarized as the following analytical results that the difference between the new city. The results of this study as follows: First, the characteristics of the elementary school environment showed a significant difference between the new town. Second, school location, terrain characteristics, bike paths and pedestrian to the installation, the safety of landscape installations, installing median barriers, traffic safety facilities, speed bumps, separation of pedestrian and vehicle circulation in the front door, scores of elements of the plan such as parking scheme there is a difference between the new town. Third, the introduction of elements of the plan such as Traffic calming or Traffic Island installation techniques was found lacking.

• Korean Journal of Materials Research
• /
• v.12 no.9
• /
• pp.750-760
• /
• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.39-43
• /
• 2009

In this paper, the flow characteristics of underfill material driven by capillary action between flip-chip and substrate were investigated. Also, the effects of viscosity level and dispensing point of underfill on flow characteristics were investigated. Flip chip package size was $5mm{\times}5mm{\times}0.65^tmm$, the diameter of solder bump was 100 ${\mu}m$, and the pitch was 150 ${\mu}m$. It was full grid area-array type with 1024 I/Os. The glass substrate was used and the gap between the chip and substrate was 50 ${\mu}m$. For the experimental study, three different underfills with different viscous properties($2000{\sim}3700$ cps), and two different types of dispensing methods(center dot and edge dot) were used. The flow characteristics and filling time of underfill were investigated by using CCD camera. The results show that the edge flow was faster than center flow due to the edge effect, which was caused by the resistance of solder bumps. In case of edge dot dispensing type, the filling time was faster due to the large edge effect, compared to center dot dispensing type. Also, it was found that the underfill flow was faster and the filling time decreased as the viscosity level of underfill was decreased.

• Journal of Veterinary Clinics
• /
• v.30 no.2
• /
• pp.87-94
• /
• 2013

This retrospective study reviewed the clinical and diagnostic features, therapeutic outcome and compilations of interventional ductal occlusion in 37 dogs with patent ductus arteriosus (PDA). Malteses and female dogs were over-presented. Bounding pulse and left basal continuous murmur were most common findings in physical examination, while the differential cyanosis was rarely observed. Left ventricular (LV) enlargement patterns and sinus tachycardia were common in the ECG. Typical radiographic findings included LV elongation and triple bumps indicating left atrial (LA), aortic and pulmonary dilation. Echocardiographic features were typical shunt flow at the ductus arteriosus and marked LV dilation with mild to moderate mitral regurgitation (MR). The 32 of 37 dogs were interventionally treated with either thromboemolic coils (TCE) or Amplatz canine ductal occluder (ACDO). Transient hemoglobinuria caused by incomplete closure was occurred in 2 dogs treated with TCE, although the hemoglobinuria was disappeared within a week of intervention. The dislodgement of occlusion device was occurred in 2 dogs with TCE and 1 dog with ACDO. However there were no significant complications associated with this dislodgement, since those were dislodged at the lower pulmonary vasculature. We also found that no serious complications and no further medical intervention in 29 dogs having long-term follow-ups.

• Korean Journal of Materials Research
• /
• v.9 no.3
• /
• pp.288-294
• /
• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.17 no.3
• /
• pp.537-542
• /
• 2022

There is a limit to the current indoor air quality (IAQ) monitoring method using fixed sensors and devices. A mobile robot for IAQ monitoring was developed by mounting IAQ monitoring sensors on a small multi-legged robot to minimize vibration and protect the sensors from vibration while robot moves. The developed mobile robot used a simple gait mechanism to enable the robot to move forward, backward, and turns only with the combination of forward and reverse rotation of the two DC motors. Due to the simple gait mechanism, not only IAQ data measurements but also gait motion control were processed using a single Arduino board. Because the mobile robot has small number of electronic components and low power consumption, a relatively low-capacity battery was mounted on the robot to reduce the weight of the battery. The weight of mobile robot is 1.4kg including links, various IAQ sensors, motors, and battery. The gait and turning speed of the mobile robot was measured at 3.75 cm/sec and 14.13 rad/sec. The maximum height where the robot leg could reach was 33 mm, but the mobile robot was able to overcome the bumps up to 24 mm.

• Korean Journal of Environment and Ecology
• /
• v.36 no.5
• /
• pp.535-549
• /
• 2022

Damage to forests, such as broken or falling trees, has increased due to the increased intensity and frequency of abnormal climate events, such as strong winds and heavy rains. However, it is difficult to respond to them in advance based on prediction since structural defects such as cavities and bumps inside trees are difficult to identify with a visual inspection. Non-invasive sonic tomography (SoT) is a method of estimating internal defects while minimizing physical damage to trees. Although SoT is effective in diagnosing internal defects, its accuracy varies depending on the species. Therefore, it is necessary to analyze the reliability of its measurement results before applying it in the field. In this study, we measured internal defects in wood by cross-applying destructive resistance micro drilling on old Pinus densifloraSiebold & Zucc. and Ginkgo bilobaL., which are representative tree species in Korea, to verify the reliability of SoT and compared the evaluation results. The t-test for the mean values of the defect measurement between the two groups showed no statistically significant difference in pine trees and some difference in ginkgo trees. Linear regression analysis results showed a positive correlation with an increase in defects in SoT images when the defects in the drill resistance graph increased in both species.

• The Journal of the Convergence on Culture Technology
• /
• v.8 no.3
• /
• pp.91-97
• /
• 2022

The purpose of this study was to analyze the measurements of blood pressure and time using manual and automatic blood pressure monitors in various road conditions to verify reliable blood pressure monitor in a moving ambulance. First, the manual blood pressure monitor palpation on unpaved roads showed a systolic pressure deviation of 5 mmHg. However, the automatic blood pressure monitor showed two measurement failures, one reading failure, and the measured systolic pressure deviation was 35 mmHg. The measurement time was 102 seconds faster on average than the automatic blood pressure monitor. Second, the palpation of the manual blood pressure monitor while going over speed bumps remained constant at 130 mmHg. However, the automatic blood pressure monitor had a systolic pressure deviation of 52 mmHg. The measurement time was 61 seconds faster on average than the automatic blood pressure monitor. Finally, the manual blood pressure monitor palpation on the sharp curve road showed a systolic pressure deviation of 5 mmHg. The automatic blood pressure monitor had one reading failure and the measured systolic pressure deviation was 21 mmHg. The measurement time showed that the manual blood pressure monitor was 101 seconds faster than the automatic blood pressure monitor. As a result, in a moving ambulance during an emergency, the manual blood pressure monitor showed high reliability because the blood pressure measurement was constant and the measurement time was short.