• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.140-143
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• 2006

Load/Unload(L/UL) technology includes the benefits, that is, increased areal density, reduced power consumption and improved shock resistance. The main issues of L/UL are no slider-disk contact and no media damage. To make sure L/UL stability, we consider many design parameters in L/UL systems. This paper is focused on disk design parameters through designing a disk bump in outer guard band(OGB). In the case of bump design on the disk, we create a bump by changing bump design parameters as like size and amplitude. From dynamic analysis, we choose optimal bump model with the highest flying height and the longest rising time. When a slider passes over a bump in dynamic system, the slider rise above bump according to bump shape. On the basis of this rising effect on the bump, we apply bump design to classical L/UL system having slider-disk contact possibility. This study is based on the simulation, we finally realize improved slider unloading performance by applying slider dynamic result on unload simulation.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.833-836
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• 2007

Load/Unload technology has more benefits than the conventional CSS technology. However, it remains unsolved technical problem on the unloading process. While the slider climbs up the ramp at the outer edge of the disk, the possibility of the slider-disk contact by lift-off force and rebound of the slider increases. This paper focuses on no slider-disk contact. To prevent the slider-disk contact, we apply the disk bump on disk outer edge proceeding unload. Firstly, in the simulation, the bump dimension is determined by changing bump design parameters. Secondly, dynamic stability of slider have to be checked on disk bump before unload analysis, and unload analysis is performed by applying stable bump shapes to unload simulation. Thirdly, we select optimal bump shape to improve unload performance by unload analysis. Finally, in the experiment, the disk bump is mechanically manufactured by pressing disk surface using diamond tip. That is variously processed by changing pressing pressure. After confirming bump shape by nano-scanner, proper bump shape is applied to real experimental unload process. Through this investigation, we propose the optimal bump design to prevent the slider-disk contact, and then we can realize improved unloading performance.

• Tribology and Lubricants
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• v.18 no.1
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• pp.42-48
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• 2002

Experiments were conducted to determine the structural dynamic characteristics of bump foil bearing. The housing of the bearing on the journal was driven by two shakers which were used to simulate dynamic forces acting on the bump foil strips. Three different bump foils(Cu-coated bump, silicon bump, viscoelastic bump) are tested and the dynamic coefficients of three bump foils compared, based on the experimental measurements for a wide range of operating conditions. From the test results, the high damping coefficients of viscoelastic bump are achieved and the possibility of the super-bending-critical operation is suggested.

• Korean Journal of Optics and Photonics
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• v.7 no.4
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• pp.434-439
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• 1996

To investigate influence of the incident beams which have the truncated Gaussian amplitude and of the shapes of bump on read-out signal is an optical disc, and the point spread function on bump, the scalar diffraction theory is used in this paper. We consider the truncated Gaussian amplitudes which are $\sigma$=0, 0.5, 1.5, and 2.5, the height of bump which is given by $n{\Delta}_0={\lambda}/4$, and the phase height of bump which is then given by ${\Phi}_0={\pi}$. We also consider the shapes of the bump which are a rectangular shape, a frustoconical shape, and a conical shape. It is shown that as the truncation of incident beam reduces the radius of central spot on bump decreases, the maximum value of read-out signal increases, and that the size of bump decreases. From these results, we get better read-out signal and the reduced cross-talk in optical disc when the truncation of incident beam reduces. Therefore a laser beam having less truncated Gaussian amplitude may useful for an actual optical disc.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.477-478
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• 2012

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.86-88
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• 2003

The characteristic of induction heating solder bump(solder ball: Sn-37Pb, Sn-3.5Ag, Sn-3.0Ag-0.5Cu) has analyzed in this paper. The initial condition of induction heating depends on the time and current. The shape of lead-free solder bump is better than lead solder. The shear strength of lead solder bump has decreased with aging time. The average of shear strength of solder bump is about 10N, 11N, and 11N respectively. The lead-free solder bump's shear strength is better than lead solder and varies irregularly with aging time.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.11a
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• pp.282-289
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• 2001

Experiments were conducted to determine the structural dynamic characteristics of bump foil bearing. The housing of the bearing on the journal was driven by two shakers which were used to simulate dynamic forces acting on the bump foil strips. Three different bump foils(Cu-coated bump, silicon bump, viscoelastic bump) are tested and the dynamic coefficients of three bump foils compared, based on the experimental measurements for a wide range of operating conditions. From the test results, the high damping coefficients of viscoelastic bump are achieved and the possibility of the super-bending-critical operation is suggested.

• Korean Journal of Optics and Photonics
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• v.4 no.4
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• pp.403-410
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• 1993

The scalar diffraction theory of the read-out signal in optical disc is described. and numerical results is given. The strength of this signal depends on the shape of bump(pit) which show more or less rounding of the edge because of the photoresist process. It is shown that the ideal shape is the retangular form, with no rounding of edge. This form is not achievable in practise. but the results show that very satisfactory values of the read-out signal can nevertheless be achieved in the presence of the moderate amounts of rounding.unding.