• Journal of Adhesion and Interface
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• v.12 no.4
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• pp.144-150
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• 2011

The effect of low profile agent and release agent on the surface and mechanical properties of bulk mold compound were investigated. Atomic content and contact angle of surface were characterized using X-ray photoelectron spectroscopy and contact anglemeter. Surface morphology and surface roughness were obtained using field emission scanning electron microscope and atomic force microscope, respectively. As increasing the low profile agent from 0 to 9.2 wt%, the volume shrinkage and surface roughness decreased from 0.35% to 0.05%, and from $0.27{\mu}m$ to $0.12{\mu}m$, respectively. The increase of release agent from 1.8 wt% to 3.6 wt% resulted in the migration of release agent to sample surface and it increased the surface roughness. The flexural strength and impact strength were decreased approximately 30% as the low profile agent increasing from 5.0 wt% to 9.0 wt%.