• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.531-537
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• 1999

A copper based leadframe was oxidized in brown-oxide forming solution, then the growth characteristics of brown oxide and the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) were studied by using sandwiched double cantilever beam (SDCB) specimens. The brown oxide is composed of fine acicular CuO, and its thickness increased up to ~150 nm within 2 minutes and saturated. Bare leadframe showed alomost no adhesion to EMC, while once the brown-oxide layer formed on the Surface of leadframe, the adhesion strength increased up to ~80 J/$\m^2$ within 2 minutes. Correlation between oxide thickness, $\delta$ and the adhesion strength in terms of interfacial fracture toughness, $G_{c}$ was linear. Considering the above results, we might conclude that the main adhesion mechanism of brown-oxide treated leadframe to EMC is mechanical interlocking, in which fine acicular CuO plays a major role.e.

• Journal of the Korean institute of surface engineering
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• v.29 no.4
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• pp.238-252
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• 1996

In order to study the effect of interface oxides on the adhesion strength of the copper/epoxy system, copper foils were immersed in black oxide or brown oxide forming solutions before lamination with epoxy prepregs, and variation of peel strength with the treatment time were investigated. Results showed that peel strength decreased rapidly up to 1 minute of treatment lime and remained constant in the case of the black oxide treated specimens, which was accompanied by the thickening of $Cu_2O$ at the Copper/Epoxy interface during the period. In contrast, peel strength increased rapidly up to 1 minute of treatment time and remained constant in the case of the brown oxide treated specimens, which could be ascribed to the thickening of CuO. Subsequent heat treatments of the Copper/Epoxy laminations at $120^{\circ}C$ in air showed that peel strength remained constant in the case of the black oxide treated specimens but decreased gradually in the case of the brown oxide treated specimens. Following XPS analyses revealed that the latter was possibly caused by the coalescence of CuO at the Copper/Epoxy interface into $Cu_2O$.

• Journal of the Korean institute of surface engineering
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• v.36 no.6
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• pp.491-499
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• 2003

Copper-based leadframe sheets were oxidized in a hot alkaline solution to form brown-oxide layer on the surface and molded with epoxy molding compound (EMC). The brown-oxide-coated leadframe/EMC joints were machined to form sandwiched double-cantilever beam (SDCB) specimens and sandwiched Brazil-nut (SBN) specimens for the purpose of measuring the fracture toughness of leadframe/EMC interfaces. The SDCB and the SBN specimens were designed to measure the fracture toughness of the leadframe/EMC interfaces under nearly mode-I loading and mixed-mode (mode I ＋ mode II) loading conditions, respectively. Fracture surfaces were analyzed by various equipment such as glancing-angle XRD, SEM, AES, EDS and AFM to elucidate failure path. Results showed that failure occurred irregularly in the SDCB specimens, and oxidation time of 2 minutes divided the types of irregular failures into two classes. The failure in the SBN specimens was quite different from that in the SDCB specimens. The failure path in the SBN specimens was not dependent on the phase angle as well as the distance from tips of pre-cracks.

• Korean Journal of Materials Research
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• v.15 no.1
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• pp.1-5
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• 2005

Copper-based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The present paper deals with the failure path, and the cause of the failure path formation with an adhesion model will be treated in the succeeding paper.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.142-150
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• 2001

Due to naturally formed copper oxides, the adhesion strength between copper and epoxy resin is often very poor. To improve the adhesion strength between copper and epoxy resin, Cu-based leadframe sheets were oxidized in a brown-oxide forming solution. Then the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) was studied using pull-out specimens. After the pull-out test, fracture surfaces were analyzed using SEM, AES and EDS to determine failure path. The results showed that the failure path lay over inside the CuO and inside the EMC irrespective of the pull strength.

• Korean Journal of Materials Research
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• v.15 no.1
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• pp.6-13
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• 2005

Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.992-999
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC(Epoxy Molding Compound) interface, popcorn-cracking phenomena of thin plastic packages frequently occur during the solder reflow process. In this study, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, brown-oxide layer was formed on the leadframe surface by immersing of leadframe sheets in hot alkaline solution, and the adhesion strength of leadframe/EMC interface was measured by using SDCB(Sandwiched Double Cantilever Beam) and SBN(Sandwiched Brazil-Nut) specimens. Results showed that brown oxide treatment of leadframe introduced fine acicular CuO crystals on the leadframe surface and improved the adhesion strength of leadframe/EMC interface. Enhancement of adhesion strength was directly related to the thickening kinetics of oxide layer. This might be due to the mechanical interlocking of fine acicular CuO crystals into EMC.

• Korean Journal of Materials Research
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• v.14 no.5
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• pp.322-327
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• 2004

Copper-based leadframe sheets were oxidized in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched Brazil-nut (SBN) specimens. The SBN specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under mixed-mode (mode I + mode II) loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The results revealed that the failure paths were strongly dependent on the oxide type. In case of brown oxide, hackle-type failure was observed and failure path lay near the EMC/CuO interface with a little inclining to CuO at all case. On the other hand, in case of black oxide, quite different failure path was observed with respect to the distance from the tip of pre-crack and phase angle. Different failures occurred with oxide type is presumed to be due to the difference in microstructure of the oxides.

• Asian-Australasian Journal of Animal Sciences
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• v.25 no.7
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• pp.1029-1037
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• 2012

The present study was designed to investigate the effect of ${\alpha}$-melanocyte-stimulating hormone (${\alpha}$-MSH), nitric oxide (NO) and L-cysteine on melanin production and expression of related genes MC1R, Tyr, Tyrp-1 and Tyrp-2 in muzzle melanocytes of differently colored three native Hanwoo cattle. Muzzle samples were taken from black, brindle and brown Hanwoo and purified melanocytes were cultured with ${\alpha}$-MSH, nitric oxide and L-cysteine at 100 nM, $50{\mu}M$ and 0.07 mg/ml of media respectively. The amounts of total melanin, eumelanin and mRNA expression at Tyr, Tyrp-1, Tyrp-2 and MC1R levels were quantified. ${\alpha}$-MSH and nitric oxide significantly increased (p<0.05) the amount of total melanin in black and brindle whereas eumelanin production in brown Hanwoo muzzle melanocytes. On the contrary, L-cysteine greatly (p<0.05) depressed the eumelanin production in black color but increased in brown. Simultaneously, up regulation of Tyr by nitric oxide and ${\alpha}$-MSH and down regulation of Tyr, Tyrp-2 and MC1R genes by L-cysteine were observed in muzzle melanocytes of all three phenotypes. The results of this study revealed nitric oxide and ${\alpha}$-MSH contribute hyper-pigmentation by enhancing eumelanogenesis whereas L-cysteine contributes to pheomelanin production in different colored Hanwoo muzzle melanocytes.

• Korean Journal of Soil Science and Fertilizer
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• v.50 no.2
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• pp.115-126
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• 2017

There is an increasing concern over arsenic (As) contamination in rice. This study was conducted to develope a prediction model for As uptake by rice based on the physico-chemical properties of soil. Soil and brown rice samples were collected from 46 sites in paddy fields near three different areas of closed mines and industrial complexes. Total As concentration, soil pH, Al oxide, available phosphorus (avail-P), organic matter (OM) content, and clay content in the soil samples were determined. Also, 1.0 N HCl, 1.0 M $NH_4NO_3$, 0.01 M $Ca(NO_3)_2$, and Mehlich 3 extractable-As in the soils were measured as phytoavailable As concentration in soil. Total As concentration in brown rice samples was also determined. Relationships among As concentrations in brown rice, total As concentrations in soils, and selected soil properties were as follows: As concentration in brown rice was negatively correlated with soil pH value, where as it was positively correlated with Al oxide concentration, avail-P concentration, and OM content in soil. In addition, the concentration of As in brown rice was statistically correlated only with 1.0 N HCl-extractable As in soil. Also, using multiple stepwise regression analysis, a modelling equation was created to predict As concentration in brown rice as affected by selected soil properties including soil As concentration. Prediction of As uptake by rice was delineated by the model [As in brown rice = 0.352 + $0.00109^*$ HCl extractable As in soil + $0.00002^*$ Al oxide + $0.0097^*$ OM + $0.00061^*$ avail-P - $0.0332^*$ soil pH] ($R=0.714^{***}$). The concentrations of As in brown rice estimated by the modelling equation were statistically acceptable because normalized mean error (NME) and normalized root mean square error (NRMSE) values were -0.055 and 0.2229, respectively, when compared with measured As concentration in the plant.