• 한국기계가공학회지
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• 제20권5호
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• pp.135-141
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• 2021

As a trend of lightening automobiles and electronic products, several studies are currently underway to replace parts of metals with resins. In particular, heterojunctions between metals and resins are now under the spotlight. This study aims to evaluate the variation in bonding strength with process conditions when the polybutylene terephthalate (PBT) polymer is bonded to a specimen of the lightweight 6061 aluminum alloy (AL6061). Conditions of the bonding surface of the AL6061 specimen, the temperature of the injection mold, and the content of the glass fiber were considered to be process variables. Bonded specimens were manufactured for different values of these variables. Bonding strength tests were then performed on these specimens and variations were analyzed in their characteristics corresponding to those of the process conditions. Fractures in these specimens were assessed using scanning electron microscopy (SEM) to assess the fracture surface. This was then used to analyze the fracture shape and determine whether anodizing the specimen led to the development of cracks on the joint surface. Results of the above test indicated that while the surface condition of the specimen and the temperature of the injection mold significantly influenced the strength of bonding, the content of the glass fiber did not.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.1-7
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• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• 분석과학
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• 제5권3호
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• pp.309-317
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• 1992

졸-겔법에 의해 무기-유기 복합체를 합성하였으며, 복합체의 결합특성을 알아보기 위하여 DMTA(Dynamic Mechanical Thermal Analyzer)를 이용하여 유리전이 온돈(Tg)를 측정하였다. HCl 과 물의 양이 증가될수록 Tg는 고운으로 진행됨으로부터 복합화가 더 잘 일어남을 알 수 있었다. 그러나 반응시간에 따른 Tg의 변화는 관찰되지 않았다.

• 열처리공학회지
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• 제14권6호
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• pp.345-349
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• 2001

This study has investigated the effect of thermal stability and mechanical property of $Fe_{80-X}P_{10}C_6B_4M_X$(X=2, 4, 6, M=transition metal) amorphous alloys fabricated by the melt-spun process. The glass transition temperature($T_g$), crystallization temperature($T_x$) and hardness increase with decreasing electron concentration (e/a) from about 7.38 to 7.18. The decrease of e/a implies the increase in the attractive bonding state between the M elements and other constituent element. The decrease in a/e leads to the enhancement of the attractive bonding state among the constituent elements which is favorable for the increase in $T_g$, $T_x$ and hardness.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.63-69
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• 2012

As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• Journal of the Korean Wood Science and Technology
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• 제37권1호
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• pp.87-93
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• 2009

목재의 탄화과정에서 일어나는 화학적 변화를 알아보기 위하여 목탄의 기초물성과 화학결합양식의 변화를 조사하였다. 탄화온도 증가에 따른 pH 변화에 있어서는, $300^{\circ}C$와 같이 낮은 온도에서 탄화한 탄화물의 pH는 약산성 또는 중성에 가까우나, $600^{\circ}C$ 이상에서 탄화한 고온탄화물의 pH는 알칼리성을 띠는 것으로 나타났다. 또한 탄화온도가 증가하여 탄화정도가 더욱 진행되면, 탄재 내의 탄소함량이 증가하고, 수소와 산소함량이 감소하였으며, 이러한 경향은 $600^{\circ}C$까지의 탄화에서 현저하게 나타났으나, $600^{\circ}C$ 이상의 탄화온도에서는 그 변화가 완만하였다. 탄화온도가 높아짐에 다라 C-C 결합 비율이 증가하고, C-O-H 또는 C-O-R 결합 비율이 감소하는 경향이 뚜렷이 나타났다. 이는 C-O-H 등 산소를 포함한 결합이 분해되어 C-C결합 비율이 높아지고, 이는 새로운 관능기의 생성과도 관련되는 것으로 추정된다. 또한 탄화 온도의 상승에 따라 C=O결합 등의 비율이 다소 증가 또는 감소하는 것으로 보아, 일부는 분해, 생성, 재결합 등의 과정을 거치는 것으로 판단된다. 목탄의 이와 같은 화학적 변화에 대한 인식은 세공 특성 등 물리적인 파라메타만으로 흡착성을 이해하려고 할 때 발생하는 한계를 극복할 수 있는 사고가 되며, 또한 목탄의 성능개선과 신용도 개발의 기초가 될 것으로 생각된다.

• 수산해양기술연구
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• 제45권3호
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• pp.188-193
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• 2009

The present study was undertaken to evaluate the effect of temperature on the results of Charpy impact test for glass fiber reinforced polyurethane(GF/PUR) composites. The Charpy impact test were conducted in the temperature range from -50$^{\circ}$ to 50$^{\circ}$. The impact fracture toughness of GF/PUR composites was considerably affected by temperature and it was shown that the maximum value was appeared at room temperature. It is believed that sensitivity of notch on impact fracture energy were increased with decrease in temperature of specimen. As the GF/PUR composites exposed in low temperature, impact fracture toughness of composites decreased gradually owing to the decrease of interface bonding strength caused by difference of thermal expansion coefficient between the glass fiber/polyurethane resin. And decrease of interface bonding strength of composites with decrease in specimen temperature was ascertained by SEM photographs of Charpy impact fracture surface.

• 동력기계공학회지
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• 제9권4호
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• pp.137-142
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• 2005

The effects of temperature and initial crack length on impact fracture behavior of side plate material of 35 ton class FRP ship, which are composed by glass fiber and unsaturated polyester resin, were investigated. Impact fracture toughness of GF/PE composites displayed maximum value when the temperature of specimen is room temperature and $50^{\circ}C$, and with decrease in temperature of specimen, impact fracture toughness decreased. Impact fracture energy of GF/EP composites decreased with increase in initial crack length of specimen, and this value decreased rapidly when the temperature of specimen is lowest, $-25^{\circ}C$,. It is believed that sensitivity of notch on impact fracture energy were increased with decrease in temperature of specimen. As the GF/EP composites exposed in low temperature, impact fracture toughness of composites decreased gradually owing to the decrease of interface bonding strength caused by difference of thermal expansion coefficient between the glass fiber/polyester resin. Further, decrease of interface bonding strength of composites with decrease in specimen temperature was ascertained by SEM photograph of impact fracture surface.